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1. 发明专利

JP2009004436A Reflow apparatus 有权
标题翻译：反光装置
公开(公告)号：JP2009004436A
公开(公告)日：2009-01-08
申请号：JP2007161423
申请日：2007-06-19
申请人： Tamura Fa System Co Ltd , Tamura Seisakusho Co Ltd , 株式会社タムラエフエーシステム , 株式会社タムラ製作所
发明人： KAWAKAMI TAKEHIKO , TAMORI NOBUAKI
IPC分类号： H05K3/34 , B23K1/00 , B23K1/008 , F27B9/02 , F27B9/10 , F27B9/12 , F27D7/02 , F27D7/04 , F27D9/00
CPC分类号： B23K1/008 , F27B9/02 , F27B9/10 , F27B9/12 , F27D7/02 , F27D9/00 , H05K3/3494
摘要： PROBLEM TO BE SOLVED: To assure a temperature difference between the surface temperature of the soldering surface of a substrate and the surface temperature of the non-soldering surface of the substrate when reflow soldering is performed on one side of the surface.
SOLUTION: A heating section 15 and a housing section 35 are provided through a conveyance way 41. The heating section 15 heats the reflow surface W1 of an article W to be heated. The housing section 35 has an open surface 36 in close proximity to the conveyance way 41, and a closed surface 37 facing the open surface 36. Since a distance from the conveyance way 41 to the closed surface 37 of the housing section 35 is longer than that from the conveyance way 41 to a radiation panel 19, the temperature of the housing section 35 can be made lower than that of the heating section 15.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了确保在表面的一侧进行回流焊接时，衬底的焊接表面的表面温度与衬底的非焊接表面的表面温度之间的温度差。解决方案：加热部分15和壳体部分35通过输送方式41设置。加热部分15加热被加热物品W的回流面W1。收纳部35具有靠近输送路41的开放面36和面向开口面36的封闭面37.由于从输送路41到收纳部35的封闭面37的距离长于从传送方式41到辐射面板19，可以使壳体部分35的温度低于加热部分15的温度。版权所有：（C）2009，JPO＆INPIT

2. 发明专利

JP2004197975A Heating furnace device 有权
公开(公告)号：JP2004197975A
公开(公告)日：2004-07-15
申请号：JP2002363880
申请日：2002-12-16
申请人： Tamura Fa System Co Ltd , Tamura Seisakusho Co Ltd , 株式会社タムラエフエーシステム , 株式会社タムラ製作所
发明人： YAMASHITA FUMIHIRO , KAWAKAMI TAKEHIKO
IPC分类号： B23K1/00 , F27D17/00 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a heating furnace device capable of easily dissolving and eliminating components left and attached to be cooled and solidified in an elimination unit to separate and eliminate cold and liquefied substances including cooled and solidified components mixed in an inner atmosphere in a furnace body.
SOLUTION: To the furnace body 11 to heat workpieces W, elimination units 43 and 44 are respectively provided to suck cooled and liquefied substances including cooled and solidified components mixed in the inner atmosphere in the furnace body 11 from a buffer chamber 22 in the furnace body 11 and a buffer chamber 29 in a workpiece cooling part 15. A piping system 65 is provided on the elimination units 43 and 44 to change from a circuit to suck low-temperature atmosphere in the buffer chambers 22 and 29 into a circuit to suck atmosphere of a buffer chamber 26 heated to be higher than the atmosphere in the buffer chambers 22 and 29. The piping system 65 is provided with valves 66-69 to change the circuit to be sucked.
COPYRIGHT: (C)2004,JPO&NCIPI

3. 发明专利

JP2009148817A Reflowing apparatus 有权
标题翻译：反射装置
公开(公告)号：JP2009148817A
公开(公告)日：2009-07-09
申请号：JP2007331168
申请日：2007-12-21
申请人： Tamura Fa System Co Ltd , Tamura Seisakusho Co Ltd , 株式会社タムラエフエーシステム , 株式会社タムラ製作所
发明人： KAWAKAMI TAKEHIKO , YAMASHITA FUMIHIRO
IPC分类号： B23K1/008 , B23K3/08 , B23K101/42 , F27B9/10 , F27B9/20 , F27B9/30 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To prevent flux deposited on the inner surface of a blower case from hanging down onto a substrate to be heated.
SOLUTION: The flux (M1) is deposited on the inner surface of the lateral wall of the blower case (40). A round drain hole (or slotted hole) (65) is formed in the top face of a furnace body in the vicinity of the lateral wall, while a piping (66) with the hole (65) as its opened end is installed. The piping (66) is extended out to the exterior of an upper furnace body (15), and the flux flowing out through the piping (66) in the exterior is supplied to a collection vessel. The flux hung out downward from the blower is made to flow downward along the plate surface of an inclined plate (36a) of a baffle plate (17b), and streams into a gutter (36b) to be pooled therein. In addition, a recessed section (72) is formed on the top of a panel (191), and the flux (M3) that is hung down onto the panel (191) is pooled in the recessed section (72), so that the flux is prevented from hanging down onto an object to be heated (W), and the flux pooled in the recessed section (72) can be collected for recycling.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：防止在鼓风机壳体的内表面上沉积的助焊剂悬垂在待加热的基板上。解决方案：磁通（M1）沉积在鼓风机壳体（40）的侧壁的内表面上。在侧壁附近的炉体的顶面形成有圆形的排水孔（或开槽孔）65，而安装有作为其开口端的孔65的配管66。管道（66）延伸到上炉体（15）的外部，并且通过外部的管道（66）流出的助焊剂被供应到收集容器。从鼓风机向下悬挂的通量沿着挡板（17b）的倾斜板（36a）的板表面向下流动，并流入沟槽（36b）以汇集在其中。此外，在面板（191）的顶部形成有凹部（72），并且将悬挂在面板（191）上的焊剂（M3）汇集在凹部（72）中，防止焊剂垂下到待加热物体（W）上，并且收集在凹部（72）中的焊剂可以被收集用于再循环。版权所有（C）2009，JPO＆INPIT

4. 发明专利

JP2009190045A Soldering device 审中-公开
标题翻译：焊接设备
公开(公告)号：JP2009190045A
公开(公告)日：2009-08-27
申请号：JP2008030670
申请日：2008-02-12
申请人： Tamura Fa System Co Ltd , Tamura Seisakusho Co Ltd , 株式会社タムラエフエーシステム , 株式会社タムラ製作所
发明人： KAWAKAMI TAKEHIKO , YAMASHITA FUMIHIRO
IPC分类号： B23K1/008 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a soldering device capable of heating returning gas without using any heater when flux is collected outside a furnace body and gas after collecting the flux is returned into a furnace.
SOLUTION: High-temperature gas is led to a flux collection device 71 from a lower furnace body 35 through a cylindrical duct 72. Low-temperature gas with its flux components being removed by the flux collection device 71 is led inside the lower furnace body 35 via a duct 73, a heat exchanger 74 and a duct 75. A hollow part 76 in which the duct 72 as an inner pipe is inserted is formed at a center part, and an outer circumferential surface of the duct 72 is tightly attached to an inner circumferential surface of the hollow part 76. The outer circumferential surface of the duct 72 and the inner circumferential surface of the hollow part 76 constitute partitions, and the heat is exchanged through the partitions. The low-temperature gas from the flux collection device 71 receives the heat from the high-temperature gas flowing in the duct 72 and is heated, and the heated gas is introduced in the lower furnace body 35.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够在炉体外收集助熔剂时能够加热返回气体而不使用任何加热器的焊接装置，并且在将焊剂收集后的气体返回到炉中。解决方案：高温气体通过圆柱形管道72从下炉体35引导到集流装置71.通过助焊剂收集装置71除去其助焊剂组分的低温气体被引导到下部炉体35通过管道73，热交换器74和管道75.在中心部分处形成有作为内管的管道72插入的中空部分76，并且管道72的外周表面紧密地连接到中空部76的内周面。管72的外周面和中空部76的内周面构成隔壁，通过隔壁进行热交换。来自焊剂收集装置71的低温气体接收来自在管道72中流动的高温气体的热量，并被加热，并且将加热的气体引入下炉体35中。（C） 2009年，JPO＆INPIT

5. 发明专利

JP2008272793A Reflow device and method for removing flux 有权
标题翻译：反流装置及其方法
公开(公告)号：JP2008272793A
公开(公告)日：2008-11-13
申请号：JP2007119452
申请日：2007-04-27
申请人： Tamura Fa System Co Ltd , Tamura Seisakusho Co Ltd , 株式会社タムラエフエーシステム , 株式会社タムラ製作所
发明人： YAMASHITA FUMIHIRO , KAWAKAMI TAKEHIKO
IPC分类号： B23K1/008 , B23K1/00 , F27B9/10 , F27D7/02 , F27D7/04 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a reflow device capable of preventing the deposition of flux components that disturbs rotation of a fan housed in a casing, and to provide a method for removing a flux.
SOLUTION: In the vicinity of a fan 51, aside from an inlet port for nitrogen gas as a main atmospheric gas, a nitrogen inlet port for introducing the nitrogen gas for removing the flux is provided at a nearby site of a base plate 53, which supports the rotating shaft of the fan. A nitrogen gas heated to a liquefaction temperature of the flux components (e.g. ≥140°C) is introduced through the nitrogen inlet port 56. Thereby, solidification of the flux in the vicinity of the rotating shaft of the fan 51 is prevented, so that deposition of the flux components is prevented.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够防止妨碍容纳在壳体中的风扇的旋转的通量成分的沉积的回流装置，并且提供去除焊剂的方法。解决方案：在风扇51附近，除了作为主要气氛气体的氮气的入口之外，还设置用于导入用于除去助焊剂的氮气的氮气入口，在基板的附近位置 53，其支撑风扇的旋转轴。通过氮气导入口56导入加热到助熔剂成分（例如≥140℃）的液化温度的氮气，从而防止风扇51的旋转轴附近的助熔剂固化，使得阻止了助焊剂成分的沉积。版权所有（C）2009，JPO＆INPIT

6. 发明专利

JP2004195477A Flux removal device for soldering 有权
公开(公告)号：JP2004195477A
公开(公告)日：2004-07-15
申请号：JP2002363878
申请日：2002-12-16
申请人： Tamura Fa System Co Ltd , Tamura Seisakusho Co Ltd , 株式会社タムラエフエーシステム , 株式会社タムラ製作所
发明人： YAMASHITA FUMIHIRO , KAWAKAMI TAKEHIKO
IPC分类号： B23K1/00 , B23K101/42
摘要： PROBLEM TO BE SOLVED: To provide a removal unit in which the efficiency of removing flux is improved.
SOLUTION: A suction airflow channel 5 forcedly sucking an atmosphere including flux generated from a work subjected to soldering treatment is provided. A cooling mean 11 cooling the atmosphere sucked into the suction air channel 5, and misting the flux mixed into the atmosphere is provided so as to communicate with the suction air channel 5. A flux removal means 12 separating the flux mist from the inside of the atmosphere, and removing the same is provided so as to communicate with the cooling means 11.
COPYRIGHT: (C)2004,JPO&NCIPI

7. 发明专利

JP2009004439A Soldering equipment and falling detection method of object to be heated 有权
标题翻译：焊接对象的焊接设备和后期检测方法
公开(公告)号：JP2009004439A
公开(公告)日：2009-01-08
申请号：JP2007161466
申请日：2007-06-19
申请人： Tamura Fa System Co Ltd , Tamura Seisakusho Co Ltd , 株式会社タムラエフエーシステム , 株式会社タムラ製作所
发明人： KAWAKAMI TAKEHIKO , YAMASHITA FUMIHIRO
IPC分类号： H05K3/34 , B23K1/00 , B23K1/008
摘要： PROBLEM TO BE SOLVED: To detect falling of an object to be heated such as a substrate in soldering equipment while preventing abrasion of a sensor or reduction in heating power.
SOLUTION: At a lower portion of a chain for carrying an object to be heated, a wire is stretched in the same direction as the carrying direction of the carrying chain such that the object to be heated touches the wire when it falls and the wire vibrates. Vibrational state of the wire is detected by the sensor and falling of the object to be heated is judged. When a photoelectric sensor is employed, vibrational state of the wire is detected by the quantity of light received by the photoelectric sensor, and it is judged that the object to be heated has fallen if the quantity of light received by the photoelectric sensor has changed from that when the wire is stationary. When the quantity of light received by the photoelectric sensor changes, whether the change is due to falling of the object to be heated, hot wind or the like is determined in the soldering equipment in order to detect falling more accurately.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了防止焊接设备中的诸如基板的待加热物体的下落，同时防止传感器磨损或减少加热功率。解决方案：在用于承载待加热物体的链条的下部，线材沿与承载链条的运送方向相同的方向被拉伸，使得被加热物体在下落时接触线材，并且线振动。由传感器检测线的振动状态，判断被加热物的落下。当采用光电传感器时，通过光电传感器接收到的光量来检测线的振动状态，并且如果光电传感器接收的光量已经从当电线静止时。当光电传感器接收到的光量变化时，是否由于待加热物体的下降而发生变化，在焊接设备中确定热风等，以便更精确地检测落下。版权所有（C）2009，JPO＆INPIT

8. 发明专利

JP2005294561A Reflow apparatus 有权
标题翻译：反光装置
公开(公告)号：JP2005294561A
公开(公告)日：2005-10-20
申请号：JP2004108026
申请日：2004-03-31
申请人： Tamura Fa System Co Ltd , Tamura Seisakusho Co Ltd , 株式会社タムラエフエーシステム , 株式会社タムラ製作所
发明人： OKANO TERUO , KAWAKAMI TAKEHIKO
IPC分类号： H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a reflow apparatus capable of enhancing the heating ability for a work.
SOLUTION: There are provided a furnace 10 for the reflow heating of the work W, a heat capacity increasing medium supply means 26 for supplying a heat capacity increasing medium into the furnace 10 to increase the heat capacity of an atmospheric gas in the furnace. The heat capacity increasing medium is a liquid having a boiling point lower than the set temperature within the furnace 10. The heat capacity increasing medium supply means 26 supplies the fixed amount of the heat capacity increasing medium according to a pulse injection, or supplies the heat capacity increasing medium only to a heating chamber 16 for the reflow when the work W is moved to the heating chamber 16 from a heating chamber 15 for preheating.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够提高工件的加热能力的回流装置。解决方案：提供了用于工件W的回流加热的炉10，用于将加热容量增加介质供应到炉10中的增加热容量的介质供应装置26，以增加炉内的大气气体的热容量炉。加热容量增加介质是沸点低于炉10内的设定温度的液体。加热量增加介质供给装置26根据脉冲喷射提供固定量的热容量增加介质，或者提供热量当工件W从用于预热的加热室15移动到加热室16时，容量增加介质仅到加热室16用于回流。版权所有（C）2006，JPO＆NCIPI

9. 发明专利

JP2004195478A Heating furnace device 有权
公开(公告)号：JP2004195478A
公开(公告)日：2004-07-15
申请号：JP2002363879
申请日：2002-12-16
申请人： Tamura Fa System Co Ltd , Tamura Seisakusho Co Ltd , 株式会社タムラエフエーシステム , 株式会社タムラ製作所
发明人： YAMASHITA FUMIHIRO , KAWAKAMI TAKEHIKO
IPC分类号： B23K1/015 , B23K1/008 , F27B9/24 , F27D17/00
摘要： PROBLEM TO BE SOLVED: To provide a heating furnace device by which liquefied material on cooling is efficiently recovered even in the process of reflow driving, and a reduction in quality of a work caused by the liquefied material on cooling can securely be prevented.
SOLUTION: A furnace body 11 has an inlet throat 13 from which a work W is carried in and an intermediate throat 14 from which the work W is carried out, and the work W carried in from the inlet throat 13 is heated and is carried out from the intermediate throat 14. Buffer chambers 22 and 19 are expansively formed to directions perpendicularly crossed with the inlet throat 13 and the intermediate throat 14 of the furnace body 11. The buffer chambers 22 and 29 are provided with recovery means 35 and 36 sucking an atmosphere inside the furnace body 11 to be flowed out from the inlet throat 13 and the intermediate throat 14 to the outside of the furnace body 11 and recovering gasified flux intruded into the atmosphere.
COPYRIGHT: (C)2004,JPO&NCIPI

10. 发明专利

JP2004195476A Cooling device for soldering, and reflow device 审中-公开
公开(公告)号：JP2004195476A
公开(公告)日：2004-07-15
申请号：JP2002363877
申请日：2002-12-16
申请人： Tamura Fa System Co Ltd , Tamura Seisakusho Co Ltd , 株式会社タムラエフエーシステム , 株式会社タムラ製作所
发明人： YAMASHITA FUMIHIRO , KAWAKAMI TAKEHIKO
IPC分类号： B23K1/008 , B23K31/02 , B23K101/42 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a cooling device for soldering improved in cooling efficiency.
SOLUTION: The upper side and lower side of a work W are provided with an upper cooling nozzle 32 and a lower cooling nozzle 57. The upper side and lower side in the side directions of the work W are provided with an upper suction port 34, an upper recovery port 36, a lower recovery port 37 and a lower suction port 38 forcedly sucking an atmosphere and recovering the same. The atmosphere whose temperature is raised by being sprayed on the work W by the upper cooling nozzle 32 and lower cooling nozzle 57 is sucked by the upper suction port 34, upper recovery port 36, lower recovery port 37 and lower suction port 38. Cold air is not stayed in the vicinity of the work W, but is efficiently exhausted, and fresh cold air is successively fed to the work W, so that the cooling efficiency of the work W can be improved.
COPYRIGHT: (C)2004,JPO&NCIPI

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