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1. 发明授权

US08578774B2 Physical quantity sensor including bonding wire with vibration isolation performance characteristics 有权
标题翻译：物理量传感器，包括具有隔振性能特征的接合线
公开(公告)号：US08578774B2
公开(公告)日：2013-11-12
申请号：US13004295
申请日：2011-01-11
申请人： Tameharu Ohta , Takeshi Shinoda , Itaru Ishii , Keisuke Nakano
发明人： Tameharu Ohta , Takeshi Shinoda , Itaru Ishii , Keisuke Nakano
IPC分类号： G01P1/02 , G01P15/125 , G01C19/56
CPC分类号： G01C19/5769 , B81B7/0058 , B81B2201/0242 , G01P1/023 , G01P15/125 , H01L2224/48465
摘要： A physical quantity sensor includes a sensing portion, a casing, a vibration isolating member, an electrically conductive portion, a pad and a bonding wire. The casing encases the sensing portion therein. The vibration isolating member is disposed between the sensing portion and the casing to reduce a relative vibration between the sensing portion and the casing. The bonding wire electrically connects the electrically conductive portion provided on the casing and the pad provided on a surface of the sensing portion. The bonding wire extends from the pad to the electrically conductive portion and includes a bend. The bonding wire is configured to satisfy a relation of 20×d≦h, in which d is an outer diameter of the bonding wire, and h is a dimension of the bonding wire with respect to a direction perpendicular to the surface of the sensing portion.
摘要翻译：物理量传感器包括感测部分，壳体，隔振部件，导电部分，焊盘和接合线。壳体将感测部分包围在其中。防振构件设置在感测部分和壳体之间以减小感测部分和壳体之间的相对振动。接合线将设置在壳体上的导电部分和设置在感测部分的表面上的焊盘电连接。接合线从焊盘延伸到导电部分并且包括弯曲部。接合线被配置为满足20×d @ h的关系，其中d是接合线的外径，h是接合线相对于垂直于感测部分的表面的方向的尺寸。

2. 发明申请

US20120018611A1 VIBRATION ISOLATION TARGET MOUNTING STRUCTURE AND METHOD 审中-公开
标题翻译：振动隔离目标安装结构与方法
公开(公告)号：US20120018611A1
公开(公告)日：2012-01-26
申请号：US13186506
申请日：2011-07-20
申请人： Itaru Ishii , Tameharu Ohta , Takeshi Shinoda , Keisuke Nakano
发明人： Itaru Ishii , Tameharu Ohta , Takeshi Shinoda , Keisuke Nakano
IPC分类号： F16F15/02 , B29C65/54
CPC分类号： H01L23/057 , B81B7/0058 , B81B2201/0235 , G01C19/5769 , H01L2224/16145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： A bonding structure of a vibration isolation target is disclosed. The structure includes: a base; a vibration isolation target mounted to the base; and a vibration isolator bonds together the base and the vibration isolation target. A lift-up portion is formed on one of the base and the vibration isolation target, and is lift-upped from the one toward the other of the base and the vibration isolation target. The lift-up portion has an apex surface located at an apex of the lift-up portion. The vibration isolator is on the apex surface.
摘要翻译：公开了一种防振目标物的接合结构。该结构包括：基座; 安装在基座上的防振目标; 并且隔振器将基座和隔振目标件连接在一起。升降部分形成在基座和隔振目标之一上，并从基座和隔振目标的一个向另一个提升。提升部具有位于提升部的顶点的顶点表面。隔振器位于顶点表面。

3. 发明授权

US08359923B2 Physical quantity sensor 有权
标题翻译：物理量传感器
公开(公告)号：US08359923B2
公开(公告)日：2013-01-29
申请号：US12926970
申请日：2010-12-21
申请人： Tameharu Ohta , Tetsuo Fujii , Masanobu Azukawa , Takeshi Ito , Itaru Ishii
发明人： Tameharu Ohta , Tetsuo Fujii , Masanobu Azukawa , Takeshi Ito , Itaru Ishii
IPC分类号： G01P15/125
CPC分类号： G01C19/56 , B81B7/0058 , B81B2201/0235 , B81B2201/0285 , G01D18/00 , G01P15/08 , H01L2224/48247 , H05K13/00 , Y10T29/49002 , Y10T29/49117 , Y10T29/49826
摘要： A physical quantity sensor includes a sensor portion, a casing, and a vibration isolator. The casing includes a supporting portion with a supporting surface that is located to face an end surface of the sensor portion. The vibration isolator is located between the end surface of the sensor portion and the supporting surface of the casing to join the sensor portion to the casing. The vibration isolator reduces a relative vibration between the sensor portion and the casing.
摘要翻译：物理量传感器包括传感器部分，壳体和隔振器。壳体包括具有支撑表面的支撑部分，支撑表面位于传感器部分的端表面上。隔振器位于传感器部分的端面和壳体的支撑表面之间，以将传感器部分接合到壳体。隔振器减小传感器部分和壳体之间的相对振动。

4. 发明授权

US07891244B2 Method of making a physical quantity sensor 有权
标题翻译：物理量传感器的制作方法
公开(公告)号：US07891244B2
公开(公告)日：2011-02-22
申请号：US12453485
申请日：2009-05-12
申请人： Tameharu Ohta , Tetsuo Fujii , Masanobu Azukawa , Takeshi Ito , Itaru Ishii
发明人： Tameharu Ohta , Tetsuo Fujii , Masanobu Azukawa , Takeshi Ito , Itaru Ishii
IPC分类号： G01P1/02
CPC分类号： G01C19/56 , B81B7/0058 , B81B2201/0235 , B81B2201/0285 , G01D18/00 , G01P15/08 , H01L2224/48247 , H05K13/00 , Y10T29/49002 , Y10T29/49117 , Y10T29/49826
摘要： A physical quantity sensor includes a sensor portion, a casing, and a vibration isolator. The casing includes a supporting portion with a supporting surface that is located to face an end surface of the sensor portion. The vibration isolator is located between the end surface of the sensor portion and the supporting surface of the casing to join the sensor portion to the casing. The vibration isolator reduces a relative vibration between the sensor portion and the casing.
摘要翻译：物理量传感器包括传感器部分，壳体和隔振器。壳体包括具有支撑表面的支撑部分，支撑表面位于传感器部分的端表面上。隔振器位于传感器部分的端面和壳体的支撑表面之间，以将传感器部分接合到壳体。隔振器减小传感器部分和壳体之间的相对振动。

5. 发明申请

US20110094303A1 Physical quantity sensor and method of making the same 有权
标题翻译：物理量传感器及其制作方法
公开(公告)号：US20110094303A1
公开(公告)日：2011-04-28
申请号：US12926970
申请日：2010-12-21
申请人： Tameharu Ohta , Tetsuo Fujii , Masanobu Azukawa , Takeshi Ito , Itaru Ishii
发明人： Tameharu Ohta , Tetsuo Fujii , Masanobu Azukawa , Takeshi Ito , Itaru Ishii
IPC分类号： G01C19/56 , B23P11/00
CPC分类号： G01C19/56 , B81B7/0058 , B81B2201/0235 , B81B2201/0285 , G01D18/00 , G01P15/08 , H01L2224/48247 , H05K13/00 , Y10T29/49002 , Y10T29/49117 , Y10T29/49826
摘要： A physical quantity sensor includes a sensor portion, a casing, and a vibration isolator. The casing includes a supporting portion with a supporting surface that is located to face an end surface of the sensor portion. The vibration isolator is located between the end surface of the sensor portion and the supporting surface of the casing to join the sensor portion to the casing. The vibration isolator reduces a relative vibration between the sensor portion and the casing.
摘要翻译：物理量传感器包括传感器部分，壳体和隔振器。壳体包括具有支撑表面的支撑部分，支撑表面位于传感器部分的端表面上。隔振器位于传感器部分的端面和壳体的支撑表面之间，以将传感器部分接合到壳体。隔振器减小传感器部分和壳体之间的相对振动。

6. 发明申请

US20090282915A1 Physical quantity sensor and method of making the same 有权
标题翻译：物理量传感器及其制作方法
公开(公告)号：US20090282915A1
公开(公告)日：2009-11-19
申请号：US12453485
申请日：2009-05-12
申请人： Tameharu Ohta , Tetsuo Fujii , Masanobu Azukawa , Takeshi Ito , Itaru Ishii
发明人： Tameharu Ohta , Tetsuo Fujii , Masanobu Azukawa , Takeshi Ito , Itaru Ishii
IPC分类号： G01C19/56 , H01L21/50
CPC分类号： G01C19/56 , B81B7/0058 , B81B2201/0235 , B81B2201/0285 , G01D18/00 , G01P15/08 , H01L2224/48247 , H05K13/00 , Y10T29/49002 , Y10T29/49117 , Y10T29/49826
摘要： A physical quantity sensor includes a sensor portion, a casing, and a vibration isolator. The casing includes a supporting portion with a supporting surface that is located to face an end surface of the sensor portion. The vibration isolator is located between the end surface of the sensor portion and the supporting surface of the casing to join the sensor portion to the casing. The vibration isolator reduces a relative vibration between the sensor portion and the casing.
摘要翻译：物理量传感器包括传感器部分，壳体和隔振器。壳体包括具有支撑表面的支撑部分，支撑表面位于传感器部分的端表面上。隔振器位于传感器部分的端面和壳体的支撑表面之间，以将传感器部分接合到壳体。隔振器减小传感器部分和壳体之间的相对振动。

7. 发明授权

US07385296B2 Sensor device having stopper for limitting displacement 有权
标题翻译：传感器装置具有用于限制位移的止动器
公开(公告)号：US07385296B2
公开(公告)日：2008-06-10
申请号：US11224280
申请日：2005-09-13
申请人： Tameharu Ohta
发明人： Tameharu Ohta
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/83 , G01C19/5719 , H01L24/32 , H01L24/45 , H01L25/18 , H01L2224/05554 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/4813 , H01L2224/48145 , H01L2224/48227 , H01L2224/48624 , H01L2224/48644 , H01L2224/48724 , H01L2224/48744 , H01L2224/49171 , H01L2224/73265 , H01L2224/8314 , H01L2224/8385 , H01L2224/85424 , H01L2224/85444 , H01L2225/06506 , H01L2225/0651 , H01L2225/06593 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/16195 , H01L2924/30105 , H01L2924/351 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A sensor includes: a first chip; a second chip disposed on the first chip through an adhesive member; and a stopper. The second chip is connected to the first chip through a bonding wire. The stopper limits a displacement of the second chip when the adhesive member is deformed. The stopper is disposed around the second chip. Since the displacement of the second chip is restricted, deformation of the bonding wire between the first and the second chips is also restricted.
摘要翻译：传感器包括：第一芯片; 通过粘合构件设置在第一芯片上的第二芯片; 和塞子。第二芯片通过接合线连接到第一芯片。当粘合构件变形时，止动器限制第二芯片的位移。止动件设置在第二芯片周围。由于第二芯片的位移受到限制，所以第一和第二芯片之间的接合线的变形也受到限制。

8. 发明授权

US06935176B2 Capacitive dynamic quantity sensor device 失效
标题翻译：电容式动态传感器装置
公开(公告)号：US06935176B2
公开(公告)日：2005-08-30
申请号：US10834166
申请日：2004-04-29
申请人： Keisuke Goto , Tameharu Ohta
发明人： Keisuke Goto , Tameharu Ohta
IPC分类号： G01P15/08 , G01P15/125 , H01L29/84 , H01G7/00
CPC分类号： G01P15/125 , G01P2015/0814
摘要： A sensor chip (100) includes comb-toothed movable electrodes (24) displaceable in a Y-direction, and comb-toothed stationary electrodes (30, 31, 40, 41) arranged to confront those movable electrodes (24), on one face side of a semiconductor substrate (10). The sensor chip (100) detects acceleration on the basis of a capacity change accompanying an acceleration application in the Y-direction between the movable electrodes (24) and the stationary electrodes (30, 31, 41, 42). The stationary electrodes (30, 31, 41, 42) are individually disposed to confront each other on one and other sides of the direction taken along the Y-direction in the individual movable electrodes (24). The individual electrode pads (25a, 30a, 31a, 40a, 41a) and the circuit chip (200) are electrically connected by bump electrodes (300) so that one face of the substrate (10) confronts the circuit chip (200).
摘要翻译：传感器芯片（100）包括可沿Y方向移位的梳齿可动电极（24），以及梳齿固定电极（30,31,40,41），其布置成在一个面上与所述可动电极（24）相对一侧的半导体衬底（10）。传感器芯片（100）基于伴随着可动电极（24）和固定电极（30,31,41,42）之间的Y方向上的加速度施加的容量变化来检测加速度。固定电极（30,31,41,42）分别设置成在各个可动电极（24）中沿着Y方向取向的方向的一侧和另外侧彼此面对。单独的电极焊盘（25 a，30 a，31 a，40 a，41 a）和电路芯片（200）通过凸块电极（300）电连接，使得衬底（10）的一个面与电路芯片（200）。

9. 发明授权

US6035712A Sensor device and method of producing the same using lead frame 失效
标题翻译：传感器装置及其使用引线框的方法
公开(公告)号：US6035712A
公开(公告)日：2000-03-14
申请号：US38906
申请日：1998-03-12
申请人： Tameharu Ohta , Hiromi Ariyoshi
发明人： Tameharu Ohta , Hiromi Ariyoshi
IPC分类号： G01P15/12 , G01P1/02 , G01P15/08 , H05K1/18
CPC分类号： G01P1/023 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2924/1815 , H05K1/181
摘要： An acceleration sensor device includes a molded package mounted on a circuit board and first and second leads protruding from the molded package and joined to the circuit board. The molded package retains an island portion of a lead frame in a state where a chip mounting surface of the island portion is perpendicular to the circuit board. An acceleration sensor is mounted on the chip mounting surface of the island portion. After attaching the acceleration sensor chip to the island portion, the island portion is bent up in the lead frame. Then, the island portion, the acceleration sensor chip, and the first and second leads are integrally molded to make the molded package. Accordingly, a detection axis of the acceleration sensor device can be arbitrary set, and the molded package is stably mounted on the circuit board.
摘要翻译：加速度传感器装置包括安装在电路板上的模制封装件和从模制封装突出并连接到电路板的第一和第二引线。模制包装在岛部的芯片安装表面垂直于电路板的状态下保持引线框架的岛部。加速度传感器安装在岛部的芯片安装面上。在将加速度传感器芯片附接到岛部之后，岛部在引线框架中向上弯曲。然后，将岛部，加速度传感器芯片以及第一和第二引线一体地模制成模制封装。因此，可以任意设定加速度传感器装置的检测轴，并且将模制包装稳定地安装在电路板上。

10. 发明授权

US07268435B2 Capacitive semiconductor sensor 失效
标题翻译：电容半导体传感器
公开(公告)号：US07268435B2
公开(公告)日：2007-09-11
申请号：US10792734
申请日：2004-03-05
申请人： Tameharu Ohta
发明人： Tameharu Ohta
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L23/057 , B81B2201/0235 , B81C1/00238 , G01P1/023 , G01P15/125 , H01L24/48 , H01L25/0657 , H01L2224/05554 , H01L2224/05599 , H01L2224/16 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/15153 , H01L2924/1517 , H01L2924/16195 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： In a capacitive semiconductor sensor, a sensor chip and a circuit chip are contained in a package. First bump members are mounted on second electrodes disposed on a second surface of the circuit chip, respectively. The sensor chip is mounted at its first surface on the second surface of the circuit chip so that first electrodes disposed on the first surface of the sensor chip are electrically mechanically connected to the second electrodes through the first bump members, respectively. Second bump members are mounted on third electrodes disposed on the second surface of the circuit chip, respectively. The third electrodes are electrically mechanically connected to lead electrodes disposed to the package through the second bump members, respectively.
摘要翻译：在电容半导体传感器中，传感器芯片和电路芯片被包含在封装中。第一凸起构件分别安装在设置在电路芯片的第二表面上的第二电极上。传感器芯片安装在电路芯片的第二表面上的第一表面上，使得设置在传感器芯片的第一表面上的第一电极分别通过第一凸块部件电连接到第二电极。第二凸起部件分别安装在设置在电路芯片的第二表面上的第三电极上。第三电极分别通过第二凸起构件电学机械地连接到设置在封装件上的引线电极。

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