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1. 发明授权

US08029333B2 Device for polishing peripheral edge of semiconductor wafer 有权
标题翻译：用于抛光半导体晶片周边边缘的装置
公开(公告)号：US08029333B2
公开(公告)日：2011-10-04
申请号：US11911808
申请日：2007-10-17
申请人： Tamami Takahashi , Kenya Ito , Mitsuhiko Shirakashi , Kazuyuki Inoue , Kenji Yamaguchi , Masaya Seki , Satoru Sato , Jun Watanabe , Kenji Kato , Jun Tamura , Souichi Asakawa
发明人： Tamami Takahashi , Kenya Ito , Mitsuhiko Shirakashi , Kazuyuki Inoue , Kenji Yamaguchi , Masaya Seki , Satoru Sato , Jun Watanabe , Kenji Kato , Jun Tamura , Souichi Asakawa
IPC分类号： B24B49/00
CPC分类号： B24B9/065 , B24B21/16
摘要： A device for polishing the peripheral edge part of a semiconductor wafer includes a wafer stage for holding the wafer, a wafer stage unit including devices for rotating the wafer stage, causing the wafer stage to undergo a rotary reciprocating motion within the same plane as the surface of the wafer stage, and moving the wafer stage parallel to the surface, a notch polishing part for polishing the notch on the wafer and a bevel polishing part for polishing the beveled part of the wafer. Pure water is supplied to the wafer to prevent it from becoming dry as it is transported from the notch polishing part to the bevel polishing part.
摘要翻译：用于抛光半导体晶片的周边部分的装置包括用于保持晶片的晶片台，包括用于旋转晶片台的装置的晶片台单元，使得晶片台在与表面相同的平面内进行旋转往复运动的晶片台，并且平行于表面移动晶片台，用于抛光晶片上的凹口的凹口抛光部分和用于抛光晶片的斜面部分的斜面抛光部分。将纯水供应到晶片，以防止其从凹口抛光部件输送到斜面抛光部件时变干。

2. 发明申请

US20090093192A1 DEVICE FOR AND METHOD OF POLISHING PERIPHERAL EDGE OF SEMICONDUCTOR WAFER 有权
标题翻译：用于抛光半导体波形外围边缘的装置和方法
公开(公告)号：US20090093192A1
公开(公告)日：2009-04-09
申请号：US11911808
申请日：2006-04-18
申请人： Tamami Takahashi , Kenya Ito , Mitsuhiko Shirakashi , Kazuyuki Inoue , Kenji Yamaguchi , Masaya Seki , Satoru Sato , Jun Watanabe , Kenji Kato , Jun Tamura , Souichi Asakawa
发明人： Tamami Takahashi , Kenya Ito , Mitsuhiko Shirakashi , Kazuyuki Inoue , Kenji Yamaguchi , Masaya Seki , Satoru Sato , Jun Watanabe , Kenji Kato , Jun Tamura , Souichi Asakawa
IPC分类号： B24B9/00 , B24B49/12
CPC分类号： B24B9/065 , B24B21/16
摘要： A device for polishing the peripheral edge part of a semiconductor wafer includes a wafer stage for holding the wafer, a wafer stage unit including devices for rotating the wafer stage, causing the wafer stage to undergo a rotary reciprocating motion within the same plane as the surface of the wafer stage, and moving the wafer stage parallel to the surface, a notch polishing part for polishing the notch on the wafer and a bevel polishing part for polishing the beveled part of the wafer. Pure water is supplied to the wafer to prevent it from becoming dry as it is transported from the notch polishing part to the bevel polishing part.
摘要翻译：用于抛光半导体晶片的周边部分的装置包括用于保持晶片的晶片台，包括用于旋转晶片台的装置的晶片台单元，使得晶片台在与表面相同的平面内进行旋转往复运动的晶片台，并且平行于表面移动晶片台，用于抛光晶片上的凹口的凹口抛光部分和用于抛光晶片的斜面部分的斜面抛光部分。将纯水供应到晶片，以防止其从凹口抛光部件输送到斜面抛光部件时变干。

3. 发明申请

US20060094343A1 Polishing machine 有权
公开(公告)号：US20060094343A1
公开(公告)日：2006-05-04
申请号：US11303207
申请日：2005-12-15
申请人： Satoru Sato , Jun Tamura , Jun Watanabe
发明人： Satoru Sato , Jun Tamura , Jun Watanabe
IPC分类号： B24B21/00
CPC分类号： B24B21/002 , B24B9/065
摘要： A polishing machine uses a polishing head having a movable pad to press a polishing tape for polishing beveled and edge parts of a disk-shaped object. A rotary shaft is connected to the polishing head in a direction of contact surface between the polishing tape and the object. A rotary-and-reciprocating motion device rotates the polishing head around the axial line of the rotary shaft and moves it reciprocatingly along its axial line. A moving device undergoes a reciprocating motion perpendicularly to the object surface while supporting the object. When in use, the polishing head is rotated while the pad causes the polishing tape to protrude from it while the object is rotated.

4. 发明授权

US07108582B2 Polishing machine 有权
标题翻译：抛光机
公开(公告)号：US07108582B2
公开(公告)日：2006-09-19
申请号：US11303207
申请日：2005-12-15
申请人： Satoru Sato , Jun Tamura , Jun Watanabe
发明人： Satoru Sato , Jun Tamura , Jun Watanabe
IPC分类号： B24B49/00
CPC分类号： B24B21/002 , B24B9/065
摘要： A polishing machine uses a polishing head having a movable pad to press a polishing tape for polishing beveled and edge parts of a disk-shaped object. A rotary shaft is connected to the polishing head in a direction of contact surface between the polishing tape and the object. A rotary-and-reciprocating motion device rotates the polishing head around the axial line of the rotary shaft and moves it reciprocatingly along its axial line. A moving device undergoes a reciprocating motion perpendicularly to the object surface while supporting the object. When in use, the polishing head is rotated while the pad causes the polishing tape to protrude from it while the object is rotated.
摘要翻译：抛光机使用具有可移动垫的抛光头来按压用于抛光圆盘形物体的斜面和边缘部分的抛光带。旋转轴在抛光带和物体之间的接触表面的方向上连接到抛光头。旋转往复运动装置使抛光头围绕旋转轴的轴线旋转，并沿其轴线往复运动。移动装置在支撑物体的同时进行垂直于物体表面的往复运动。当使用时，当物体旋转时，抛光头旋转，同时衬垫使得抛光带从其上突出。

5. 发明授权

US07121320B2 Method for shaping semisolid metals 有权
标题翻译：半固态金属成型方法
公开(公告)号：US07121320B2
公开(公告)日：2006-10-17
申请号：US11008749
申请日：2004-12-09
申请人： Mitsuru Adachi , Hiroto Sasaki , Yasunori Harada , Tatsuo Sakamoto , Satoru Sato
发明人： Mitsuru Adachi , Hiroto Sasaki , Yasunori Harada , Tatsuo Sakamoto , Satoru Sato
IPC分类号： B22D27/04
CPC分类号： C22C1/005 , B22D17/007 , Y10S164/90
摘要： A method of shaping a semisolid metal comprising pouring a molten aluminum or magnesium alloy which contains a crystal grain refiner and which is superheated to less than 50° C. above a liquidus temperature of aluminum or magnesium, directly into a vessel without using a cooling jig, maintaining the alloy in the vessel for 30 seconds to 30 minutes as a resultant melt is cooled to a temperature where a specified liquid fraction is established such that a temperature of the poured alloy which is liquid and superheated to less than 10° C. above the liquidus temperature or which is partially solid, partially liquid and at a temperature of less than 5° C. below the liquidus temperature decreases from an initial level and passes through a temperature zone 5° C. below the liquidus temperature within at least 10 minutes, whereby fine primary crystals are generated in the alloy, recovering the alloy from the vessel, supplying the alloy into a mold, and shaping the alloy under pressure.
摘要翻译：一种成形半固体金属的方法，包括将含有晶粒细化剂的熔融铝或镁合金浇注，并将其过热至低于铝或镁的液相线温度以上的50℃以上，而不使用冷却夹具，将合金保持在容器中30秒至30分钟，将所得熔体冷却至指定液体分数建立的温度，使得液态并过热至低于10℃的浇注合金的温度高于液相线温度或部分固体，部分液体，低于液相温度的温度低于5℃，从初始水平降低，并在至少10分钟内通过低于液相线温度5℃的温度区域从而在合金中产生细的一次晶体，从容器中回收合金，将合金供给到模具中，并在压力下成形合金。

6. 发明授权

US06851466B2 Method and apparatus for shaping semisolid metals 失效
标题翻译：半固态金属成型方法和装置
公开(公告)号：US06851466B2
公开(公告)日：2005-02-08
申请号：US10852952
申请日：2004-05-24
申请人： Mitsuru Adachi , Hiroto Sasaki , Yasunori Harada , Tatsuo Sakamoto , Satoru Sato
发明人： Mitsuru Adachi , Hiroto Sasaki , Yasunori Harada , Tatsuo Sakamoto , Satoru Sato
IPC分类号： B22D17/00 , C22C1/00 , B22D27/08
CPC分类号： C22C1/005 , B22D17/007 , Y10S164/90
摘要： A method of shaping a semisolid metal to provide shaped parts which are produced in a convenient, easy and inexpensive manner, without relying upon the conventional mechanical or electromagnetic agitation. The method includes feeding, without using a cooling jig, into an insulating vessel, a molten alloy containing an element for promoting generation of crystal nuclei and being held to be superheated to less than 100° C. above a liquidus temperature of the alloy; maintaining the molten alloy in the insulating vessel for 5 seconds to 60 minutes as the alloy is cooled at a cooling rate of 0.01° C./s to 3.0° C./s thereby crystallizing fine primary spherical crystals in an alloy solution containing a specified liquid fraction; and feeding the alloy solution into a forming mold for shaping the alloy under pressure.
摘要翻译：一种使半固体金属成形以提供成形部件的方法，所述成形部件以方便，容易和便宜的方式制造，而不依赖于传统的机械或电磁搅拌。该方法包括：在不使用冷却夹具的情况下，将绝缘容器，含有促进晶核产生的元素的熔融合金进料并保持过热至低于合金的液相线温度以下的100℃以下; 将熔融合金保持在绝缘容器中5秒至60分钟，因为合金以0.01℃/ s至3.0℃/ s的冷却速率冷却，从而使含有规定的合金溶液的合金溶液中的细小的初级球形晶体结晶液体馏分并将合金溶液进料到用于在压力下成形合金的成型模具中。

7. 发明授权

US07254861B2 Device for cleaning tip and side surfaces of a probe 失效
标题翻译：用于清洁探头末端和侧面的装置
公开(公告)号：US07254861B2
公开(公告)日：2007-08-14
申请号：US10289494
申请日：2002-11-05
申请人： Izuru Morioka , Satoru Sato
发明人： Izuru Morioka , Satoru Sato
IPC分类号： B24B19/00 , B24D15/04
CPC分类号： B24D15/04 , G01R1/06711 , G01R3/00
摘要： A device for cleaning the tip portion and the side surfaces of a probe has two or more different kinds of intermediate sheets affixed to a substrate in a side-by-side relationship with respect to each other. One of these intermediate sheets is an elastic sheet having an elastic property. Another intermediate sheet of a different kind is a plastic sheet which is less elastic. The tip portion of a probe is cleaned by a polishing layer affixed to the elastic sheet. The side surfaces of the probe are cleaned by a polishing layer affixed to the plastic sheet. A porous foamed sheet having openings on its surface and having air bubbles inside may be used as the elastic sheet. A polishing layer is formed on the surface of the foamed sheet, having a porous surface with openings corresponding to the openings on the foamed sheet. A spacer may be provided between the substrate and the plastic sheet for adjusting the heights of the polishing layers formed over the intermediate sheets.
摘要翻译：用于清洁探针的尖端部分和侧表面的装置具有彼此并排地固定到基板上的两种或更多种不同种类的中间片。这些中间片之一是具有弹性的弹性片。另一种不同种类的中间片是弹性较小的塑料片。探针的尖端部分被固定在弹性片上的抛光层清洁。探针的侧表面被固定在塑料片上的抛光层清洁。可以使用在其表面上具有开口并且内部具有气泡的多孔泡沫片作为弹性片。在发泡片材的表面上形成抛光层，其具有与发泡片材上的开口对应的开口的多孔表面。可以在衬底和塑料片之间设置间隔件，以调节在中间片上形成的抛光层的高度。

8. 发明申请

US20050161127A1 Method for shaping semisolid metals 有权
标题翻译：半固态金属成型方法
公开(公告)号：US20050161127A1
公开(公告)日：2005-07-28
申请号：US11008749
申请日：2004-12-09
申请人： Mitsuru Adachi , Hiroto Sasaki , Yasunori Harada , Tatsuo Sakamoto , Satoru Sato
发明人： Mitsuru Adachi , Hiroto Sasaki , Yasunori Harada , Tatsuo Sakamoto , Satoru Sato
IPC分类号： B22D17/00 , C22C1/00 , B22D17/08 , B22D23/00 , B22D25/00 , C22F1/04
CPC分类号： C22C1/005 , B22D17/007 , Y10S164/90
摘要： A method of shaping a semisolid metal comprising pouring a molten aluminum or magnesium alloy which contains a crystal grain refiner and which is superheated to less than 50° C. above a liquidus temperature of aluminum or magnesium, directly into a vessel without using a cooling jig, maintaining the alloy in the vessel for 30 seconds to 30 minutes as a resultant melt is cooled to a temperature where a specified liquid fraction is established such that a temperature of the poured alloy which is liquid and superheated to less than 10° C. above the liquidus temperature or which is partially solid, partially liquid and at a temperature of less than 5° C. below the liquidus temperature decreases from an initial level and passes through a temperature zone 5° C. below the liquidus temperature within at least 10 minutes, whereby fine primary crystals are generated in the alloy, recovering the alloy from the vessel, supplying the alloy into a mold, and shaping the alloy under pressure.
摘要翻译：一种成形半固体金属的方法，包括将含有晶粒细化剂的熔融铝或镁合金浇注，并将其过热至低于铝或镁的液相线温度以上的50℃以上，而不使用冷却夹具，将合金保持在容器中30秒至30分钟，将所得熔体冷却至指定液体分数建立的温度，使得液态并过热至低于10℃的浇注合金的温度高于液相线温度或部分固体，部分液体，低于液相温度的温度低于5℃，从初始水平降低，并在至少10分钟内通过低于液相线温度5℃的温度区域从而在合金中产生细的一次晶体，从容器中回收合金，将合金供给到模具中，并在压力下成形合金。

9. 发明授权

US06769473B1 Method of shaping semisolid metals 失效
标题翻译：半固态金属成型方法
公开(公告)号：US06769473B1
公开(公告)日：2004-08-03
申请号：US09490983
申请日：2000-01-24
申请人： Mitsuru Adachi , Hiroto Sasaki , Yasunori Harada , Tatsuo Sakamoto , Satoru Sato , Atsushi Yoshida
发明人： Mitsuru Adachi , Hiroto Sasaki , Yasunori Harada , Tatsuo Sakamoto , Satoru Sato , Atsushi Yoshida
IPC分类号： B22D2708
CPC分类号： C22C1/005 , B22D17/007 , Y10S164/90
摘要： A method and apparatus for the semisolid forming of alloys to enable shaped parts having a fine-grained, spherical thixotropic structure to be produced in a convenient, easy and inexpensive manner without relying upon the conventional mechanical or electromagnetic agitation. In the method, a molten alloy having crystal nuclei at a temperature not lower than the liquidus temperature or a partially solid, partially molten alloy having crystal nuclei at a temperature not lower than a molding temperature is fed into an insulated vessel and is maintained in the insulated vessel for 5 seconds to 60 minutes as it is cooled to the molding temperature where a specified liquid fraction is established, thereby crystallizing fine primary crystals in the alloy solution, and the alloy is fed into a forming mold, where it is shaped under pressure.
摘要翻译：一种用于半固态成形合金的方法和装置，使得能够以方便，容易和便宜的方式制造具有细粒度，球形触变结构的成形部件，而不依赖于常规的机械或电磁搅拌。在该方法中，在不低于液相线温度的温度下具有晶核的熔融合金或在不低于成型温度的温度下具有晶核的部分固体部分熔融的合金进料到绝缘容器中并保持在隔热容器5秒钟至60分钟，将其冷却至建立特定液体分数的成型温度，从而在合金溶液中结晶出细小的一次晶体，并将该合金送入成型模具中，在其中形成压力。

10. 发明申请

US20070282159A1 Biological Rhythm Adjustment Method, Biological Rhythm Adjustment Device, Biological Rhythm Adjustment System 失效
标题翻译：生物节律调整方法，生物节律调整装置，生物节律调整系统
公开(公告)号：US20070282159A1
公开(公告)日：2007-12-06
申请号：US10593260
申请日：2005-03-18
申请人： Satoru Sato , Takayuki Ishiwata , Jun-Ichiro Arai , Yukio Mori
发明人： Satoru Sato , Takayuki Ishiwata , Jun-Ichiro Arai , Yukio Mori
IPC分类号： A61M21/00
CPC分类号： A61M21/00
摘要： A biological rhythm is adjusted based on a time difference as well while individually dealing with moving subjects that move in accordance with moving schedules. In step S1, information including the moving schedule and biological information on the moving subject is input. In step S2, a sleeping schedule is set based on the information obtained in step S1. Step S2 is roughly divided into two steps. In the first step, parameters for setting the sleeping schedule are set based on the moving schedule and the biological information. In the next step, the sleeping schedule is set with the parameters obtained in the first step.
摘要翻译：同时根据时间差调整生物节奏，同时单独处理根据移动时间表移动的移动对象。在步骤S1中，输入包括移动进度和关于移动物体的生物信息的信息。在步骤S2中，基于在步骤S1中获得的信息来设置睡眠进度表。步骤S2大致分为两个步骤。在第一步中，基于移动的时间表和生物信息来设置用于设置睡眠时间表的参数。在下一步骤中，使用第一步中获得的参数设置睡眠时间表。

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