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    • 3. 发明申请
    • Thin-Film Magnetic Head Having Antistatic Means for Protective Coat of Element End
    • 具有防止元件端部防护装置的薄膜磁头
    • US20080204938A1
    • 2008-08-28
    • US11678913
    • 2007-02-26
    • Kei HirataTakeo KagamiTakumi UesugiTetsuro Sasaki
    • Kei HirataTakeo KagamiTakumi UesugiTetsuro Sasaki
    • G11B5/48
    • G11B5/3106G11B5/3929G11B5/40
    • Provided is a thin-film magnetic head in which a noise due to the voltage potential difference between the read head element and the protective coat surface is suppressed. The thin-film magnetic head comprises: a read head element, one end surface of the read head element reaching an head end surface on the ABS side; a protective coat formed on the head end surface in such a way to cover at least the one end surface of the read head element; and at least one antistatic means for preventing the protective coat from being electrostatically charged, formed on/above the element formation surface, one end surface of the at least one antistatic means reaching the head end surface, the protective coat covering a portion, not the whole, of the one end surface of the at least one antistatic means on the head end surface.
    • 提供了一种薄膜磁头,其中抑制了读头元件和保护涂层表面之间的电压电位差引起的噪声。 薄膜磁头包括:读头元件,读头元件的一个端面到达ABS侧的头端面; 形成在头端表面上的保护涂层,以至少覆盖读头元件的一个端面; 以及至少一个抗静电装置,用于防止保护涂层被静电充电,形成在元件形成表面上或上方,至少一个抗静电装置的一个端面到达头端表面,保护涂层覆盖一部分,而不是 在头端表面上的至少一个抗静电装置的一个端面的整体。
    • 8. 发明申请
    • CPP-type magnetoresistive element having spacer layer that includes semiconductor layer
    • CPP型磁阻元件具有包括半导体层的间隔层
    • US20080218912A1
    • 2008-09-11
    • US11715984
    • 2007-03-09
    • Kei HirataSatoshi MiuraTakeo KagamiTetsuro Sasaki
    • Kei HirataSatoshi MiuraTakeo KagamiTetsuro Sasaki
    • G11B5/39
    • B82Y10/00B82Y25/00G11B5/3906G11B2005/3996
    • An MR element includes: a free layer whose direction of magnetization changes in response to a signal magnetic field; a pinned layer whose direction of magnetization is fixed; and a spacer layer disposed between these layers. The spacer layer includes: a semiconductor layer made of an n-type semiconductor; and a Schottky barrier forming layer made of a metal material having a work function higher than that of the n-type semiconductor that the semiconductor layer is made of, the Schottky barrier forming layer being disposed in at least one of a position between the semiconductor layer and the free layer and a position between the semiconductor layer and the pinned layer, touching the semiconductor layer and forming a Schottky barrier at an interface between the semiconductor layer and itself The semiconductor layer is 1.1 to 1.7 nm in thickness, and the Schottky barrier forming layer is 0.1 to 0.3 nm in thickness.
    • MR元件包括:其磁化方向响应于信号磁场而变化的自由层; 固定磁化方向的钉扎层; 以及设置在这些层之间的间隔层。 间隔层包括:由n型半导体制成的半导体层; 以及肖特基势垒形成层,其由具有比半导体层形成的n型半导体的功函数高的金属材料制成,所述肖特基势垒形成层设置在所述半导体层之间的位置中的至少一个 自由层和半导体层与被钉扎层之间的位置,与半导体层接触并在半导体层与其自身之间的界面处形成肖特基势垒。半导体层的厚度为1.1〜1.7nm,形成肖特基势垒 层的厚度为0.1〜0.3nm。