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1. 发明申请

US20090195933A1 HEAD ASSEMBLY 审中-公开
标题翻译：总部组织
公开(公告)号：US20090195933A1
公开(公告)日：2009-08-06
申请号：US12361233
申请日：2009-01-28
申请人： Takuma Kido , Atsushi Koga , Satoshi Emoto , Kenrou Yamamoto , Takeshi Ohwe
发明人： Takuma Kido , Atsushi Koga , Satoshi Emoto , Kenrou Yamamoto , Takeshi Ohwe
IPC分类号： G11B5/48
CPC分类号： G11B5/4826 , G11B5/455 , G11B5/4853 , H05K3/305 , H05K3/326 , H05K3/3442 , H05K3/4015 , H05K2201/09427 , H05K2201/09781 , H05K2201/1025 , H05K2201/10727 , Y02P70/613
摘要： A head assembly for writing or reading information to or from a recording medium. The head assembly includes a suspension having an electrode pad; a mounting member placed on the suspension; a head mounted on the mounting member and having an electrode, for writing or reading information; and a first bonding member made of a hot-melt adhesive and fixing the electrode to the electrode pad.
摘要翻译：用于向或从记录介质读取信息的头组件。头组件包括具有电极垫的悬架; 放置在悬架上的安装构件; 安装在所述安装构件上并具有用于写入或读取信息的电极的头部; 以及由热熔粘合剂制成的第一粘接部件，并将该电极固定在电极焊盘上。

2. 发明申请

US20150007876A1 COLLECTOR SHEET FOR SOLAR CELL, AND SOLAR CELL MODULE USING COLLECTOR SHEET FOR SOLAR CELL 审中-公开
标题翻译：太阳能电池收集板和使用太阳能电池收集板的太阳能电池模块
公开(公告)号：US20150007876A1
公开(公告)日：2015-01-08
申请号：US14238831
申请日：2012-03-29
申请人： Takayuki Komai , Satoshi Emoto
发明人： Takayuki Komai , Satoshi Emoto
IPC分类号： H01L31/052 , H01L31/02
CPC分类号： H01L31/02008 , H01L31/049 , H01L31/0516 , H01L31/0547 , Y02E10/52
摘要： Provided is a collector sheet for a solar cell, and contributing to improvement of power generation efficiency. A collector sheet (5) for a solar cell is disposed on the rear surface side of a solar cell element (4), and is provided with: a circuit (54), which is formed on the front surface of a resin base material (53), and which is configured of a wiring section (541) composed of a metal, and a non-wiring section (542); and an insulating layer (52), which is formed on the circuit (54). Light extraction to the solar cell element (4) due to reflection from the insulating layer (52) is increased, said insulating layer being disposed at the element periphery of the solar cell element (4), by having a white pigment contained in the insulating layer (52), and power generation efficiency is improved even in a back contact solar cell element.
摘要翻译：提供一种太阳能电池用集电体片，有助于提高发电效率。在太阳能电池元件（4）的背面侧配置有用于太阳能电池的集电片（5），并且设置有形成在树脂基材的表面上的电路（54） 53），由金属构成的配线部（541）和非配线部（542）构成。以及形成在电路（54）上的绝缘层（52）。由于绝缘层（52）的反射而向太阳能电池元件（4）的光提取增加，所述绝缘层通过在绝缘层（52）中包含白色颜料而设置在太阳能电池元件（4）的元件周围层（52），即使在背接触太阳能电池元件中也能够提高发电效率。

3. 发明申请

US20140186989A1 CONDUCTIVE BASE FOR FORMING WIRING PATTERN OF COLLECTOR SHEET FOR SOLAR CELLS, AND METHOD FOR PRODUCING COLLECTOR SHEET FOR SOLAR CELLS 有权
标题翻译：用于形成用于太阳能电池的收集板的布线图案的导电基板和用于生产太阳能电池的收集板的方法
公开(公告)号：US20140186989A1
公开(公告)日：2014-07-03
申请号：US14126366
申请日：2012-06-14
申请人： Takayuki Komai , Satoshi Emoto
发明人： Takayuki Komai , Satoshi Emoto
IPC分类号： H01L31/18 , H01L31/05 , B32B15/01
CPC分类号： H01L31/18 , B32B15/01 , C23C30/00 , C25D3/22 , C25D5/48 , C25D7/0607 , H01L31/05 , H01L31/0516 , H05K1/09 , H05K3/06 , H05K2201/0338 , H05K2201/0355 , H05K2201/10143 , Y02E10/50 , Y10T428/12792
摘要： Provided are: a conductive base for forming a wiring pattern of a collector sheet for solar cells, which has good rust inhibiting properties and solderability without using an organic rust inhibitor that may harm a solar cell element; and a method for producing a collector sheet for solar cells, said method using the conductive base. A conductive base for forming a wiring pattern of a collector sheet for solar cells, which is a conductive base (30) wherein a zinc layer (320) composed of zinc is formed on the surface of a copper foil (310), is used. The conductive base for forming a wiring pattern of a collector sheet for solar cells is characterized in that the zinc layer (320) does not contain chromium and the amount of zinc therein is more than 20 mg/m2 but 40 mg/m2 or less.
摘要翻译：提供：用于形成太阳能电池用集电体片的布线图案的导电性基材，其具有良好的防锈性和可焊性，而不使用可能损害太阳能电池元件的有机防锈剂; 以及太阳能电池用集电体片的制造方法，使用该导电性基材的方法。使用在铜箔（310）的表面上形成由锌构成的锌层（320）的导电性基体（30）形成太阳能电池用集电体片的布线图形的导电性基材。用于形成太阳能电池用集电体片的布线图案的导电性基材的特征在于，锌层（320）不含铬，锌的含量超过20mg / m 2，但为40mg / m 2以下。

4. 发明申请

US20100006325A1 PRINTED WIRING BOARD 失效
标题翻译：印刷线路板
公开(公告)号：US20100006325A1
公开(公告)日：2010-01-14
申请号：US12495860
申请日：2009-07-01
申请人： Masayuki KITAJIMA , Takeshi Ishitsuka , Satoshi Emoto
发明人： Masayuki KITAJIMA , Takeshi Ishitsuka , Satoshi Emoto
IPC分类号： H05K1/09 , H01B1/00 , H01B1/22 , H01B1/24 , H05K3/00 , H05K1/00 , H05K1/03
CPC分类号： H05K3/249 , H05K1/118 , H05K2201/0272 , H05K2201/035 , H05K2201/0769 , H05K2203/1105
摘要： A printed wiring board includes a first conductive paste forming a wiring pattern, and a second conductive paste including kneaded first conductive material and second conductive material whose particles are finer than those of the first conductive material.
摘要翻译：印刷布线板包括形成布线图案的第一导电浆料和包含捏合的第一导电材料的第二导电浆料和其颗粒比第一导电材料的颗粒更细的第二导电材料。

5. 发明授权

US09666746B2 Conductive base for forming wiring pattern of collector sheet for solar cells, and method for producing collector sheet for solar cells 有权
公开(公告)号：US09666746B2
公开(公告)日：2017-05-30
申请号：US14126366
申请日：2012-06-14
申请人： Takayuki Komai , Satoshi Emoto
发明人： Takayuki Komai , Satoshi Emoto
IPC分类号： H01L31/18 , H01L31/05 , B32B15/01 , C25D5/48 , C25D7/06 , C23C30/00 , H05K1/09 , C25D3/22 , H05K3/06
CPC分类号： H01L31/18 , B32B15/01 , C23C30/00 , C25D3/22 , C25D5/48 , C25D7/0607 , H01L31/05 , H01L31/0516 , H05K1/09 , H05K3/06 , H05K2201/0338 , H05K2201/0355 , H05K2201/10143 , Y02E10/50 , Y10T428/12792
摘要： Provided are: a conductive base for forming a wiring pattern of a collector sheet for solar cells, which has good rust inhibiting properties and solderability without using an organic rust inhibitor that may harm a solar cell element; and a method for producing a collector sheet for solar cells, said method using the conductive base. A conductive base for forming a wiring pattern of a collector sheet for solar cells, which is a conductive base (30) wherein a zinc layer (320) composed of zinc is formed on the surface of a copper foil (310), is used. The conductive base for forming a wiring pattern of a collector sheet for solar cells is characterized in that the zinc layer (320) does not contain chromium and the amount of zinc therein is more than 20 mg/m2 but 40 mg/m2 or less.

6. 发明授权

US09293607B2 Collector sheet for solar cell and solar cell module employing same 有权
标题翻译：用于太阳能电池和太阳能电池模块的收集器片采用它
公开(公告)号：US09293607B2
公开(公告)日：2016-03-22
申请号：US14238819
申请日：2012-02-29
申请人： Takayuki Komai , Satoshi Emoto
发明人： Takayuki Komai , Satoshi Emoto
IPC分类号： H02N6/00 , H01L31/042 , H01L31/02 , H01L31/048 , H01L31/0224 , H05K1/02 , H05K3/06 , H01L31/05
CPC分类号： H01L31/02008 , H01L31/0203 , H01L31/02245 , H01L31/0481 , H01L31/049 , H01L31/0516 , Y02E10/50
摘要： Provided is a collector sheet for a solar cell, wherein the collector sheet for solar cell can prevent short circuiting between a non-photoreception surface side element and a wiring section, as well as cushioning shocks. This collector sheet (2) for a solar cell has a circuit (22) on the surface of a resin substrate (21). A sealing material layer (23) is stacked on the circuit (22), and in the sealing material layer (23) on the wiring section (221) is formed a conductive recessed part (24) through which the wiring section (221) is exposed, in order to provide conductivity between an electrode (4) on the non-photoreception surface side of the solar cell element (1), and the wiring section (221) corresponding thereto, with the sealing material layer (23) therebetween.
摘要翻译：本发明提供一种太阳能电池用集电体片，其中，太阳能电池用集电体板能够防止非光接收面侧元件与配线部之间的短路以及缓冲冲击。该太阳能电池用集电体片（2）在树脂基板（21）的表面具有电路（22）。密封材料层（23）层叠在电路（22）上，在布线部（221）的密封材料层（23）中形成导电性的凹部（24），配线部（221）露出，以便在太阳能电池元件（1）的非光接收表面侧的电极（4）和与其对应的布线部分（221）之间提供导电性，其间具有密封材料层（23）。

7. 发明授权

US08314339B2 Circuit board with kneaded conductive paste 失效
标题翻译：电路板用捏合的导电膏
公开(公告)号：US08314339B2
公开(公告)日：2012-11-20
申请号：US12495860
申请日：2009-07-01
申请人： Masayuki Kitajima , Takeshi Ishitsuka , Satoshi Emoto
发明人： Masayuki Kitajima , Takeshi Ishitsuka , Satoshi Emoto
IPC分类号： H05K1/03 , H05K1/09
CPC分类号： H05K3/249 , H05K1/118 , H05K2201/0272 , H05K2201/035 , H05K2201/0769 , H05K2203/1105
摘要： A printed wiring board includes a first conductive paste forming a wiring pattern, and a second conductive paste including kneaded first conductive material and second conductive material whose particles are finer than those of the first conductive material.
摘要翻译：印刷布线板包括形成布线图案的第一导电浆料和包含捏合的第一导电材料的第二导电浆料和其颗粒比第一导电材料细颗粒的第二导电材料。

8. 发明授权

US08434670B2 Repair apparatus and repair method 失效
标题翻译：修理设备及维修方法
公开(公告)号：US08434670B2
公开(公告)日：2013-05-07
申请号：US12485642
申请日：2009-06-16
申请人： Toru Okada , Satoshi Emoto
发明人： Toru Okada , Satoshi Emoto
IPC分类号： B23K3/00 , B23K3/04 , B23K1/00 , B23K1/018
CPC分类号： H05K3/3494 , B23K1/012 , B23K3/04 , H05K3/225 , H05K2201/10371 , H05K2203/081
摘要： A repair apparatus includes a heating head device configured to heat a soldering member, which is soldered to a circuit board. The heating head device includes a heating head and a contact member heated by the heating head. The contact member is formed of a material having a spring characteristic and a thermal conductivity higher than a thermal conductivity of the heating head. The contact member is configured to be brought into contact with a soldered surface of the soldering member with an elastic force so as to melt a solder joining the soldering member to the circuit board.
摘要翻译：修理装置包括加热头装置，其被配置为加热焊接到电路板的焊接部件。加热头装置包括加热头和由加热头加热的接触构件。接触构件由具有比加热头的热导率高的弹簧特性和导热性的材料形成。接触构件被配置成以弹性力与焊接构件的焊接表面接触，以便熔化将焊接构件接合到电路板的焊料。

9. 发明申请

US20100326726A1 SOLDER JOINT STRUCTURE, ELECTRONIC DEVICE USING THE SAME, AND SOLDER BONDING METHOD 审中-公开
标题翻译：焊接接头结构，使用其的电子器件和焊接接合方法
公开(公告)号：US20100326726A1
公开(公告)日：2010-12-30
申请号：US12818542
申请日：2010-06-18
申请人： Hisao Tanaka , Satoshi Emoto , Kenichi Nashirozawa , Nana Matsushima , Takumi Masuyama
发明人： Hisao Tanaka , Satoshi Emoto , Kenichi Nashirozawa , Nana Matsushima , Takumi Masuyama
IPC分类号： H01R4/02
CPC分类号： H05K3/363 , G11B5/4846 , H05K3/3452 , H05K2201/0373 , H05K2201/058 , H05K2201/098 , H05K2201/10234 , H05K2201/10992 , H05K2201/2036
摘要： A solder joint structure include: a first terminal portion including a plurality of first terminal conductors adjacent to each other; a second terminal portion arranged opposite to the first terminal portion and including a plurality of second terminal conductors which are joined to the first terminal conductors; solders electrically connecting the first terminal conductors and the second terminal conductors; and member for suppressing flow of the solders.
摘要翻译：焊接结构包括：包括彼此相邻的多个第一端子导体的第一端子部分; 第二端子部分，布置成与第一端子部分相对并且包括多个第二端子导体，第二端子导体连接到第一端子导体; 电连接第一端子导体和第二端子导体的焊料; 以及用于抑制焊料流动的部件。

10. 发明申请

US20090044972A1 Circuit board, method of forming wiring pattern, and method of manufacturing circuit board 审中-公开
标题翻译：电路板，布线图案的形成方法以及电路板的制造方法
公开(公告)号：US20090044972A1
公开(公告)日：2009-02-19
申请号：US12155261
申请日：2008-05-30
申请人： Masayuki Kitajima , Takeshi Ishitsuka , Satoshi Emoto , Yutaka Noda , Seiichi Shimoura
发明人： Masayuki Kitajima , Takeshi Ishitsuka , Satoshi Emoto , Yutaka Noda , Seiichi Shimoura
IPC分类号： H05K3/12 , H05K1/09
CPC分类号： H05K1/095 , H05K1/117 , H05K1/118 , H05K3/1283 , H05K3/249 , H05K2201/0129 , H05K2201/035 , H05K2201/2009 , H05K2203/0278 , H05K2203/1105
摘要： When manufacturing a circuit board, a wiring pattern is printed on a substrate with a conductive paste formed of metal powder and thermoplastic resin, and then the conductive paste is subjected to a heating treatment and a pressing treatment.
摘要翻译：当制造电路板时，使用由金属粉末和热塑性树脂形成的导电膏将基板上印刷布线图案，然后对导电浆进行加热处理和压制处理。

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