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    • 3. 发明授权
    • Semiconductor device and method of manufacturing the same
    • 半导体装置及其制造方法
    • US08791521B2
    • 2014-07-29
    • US13423664
    • 2012-03-19
    • Koji NakaharaKazuhiro MatsuoMasayuki TanakaHirofumi Iikawa
    • Koji NakaharaKazuhiro MatsuoMasayuki TanakaHirofumi Iikawa
    • H01L29/788
    • H01L27/11521H01L29/42324H01L29/7881
    • A semiconductor device includes an interelectrode insulating film formed between a charge storage layer and a control electrode layer. The interelectrode insulating film is formed in a first region above an upper surface of an element isolation insulating film, a second region along a sidewall of the charge storage layer, and a third region above an upper surface of the charge storage layer. The interelectrode insulating film includes a first stack including a first silicon nitride film or a high dielectric constant film interposed between a first and a second silicon oxide film or a second stack including a second high dielectric constant film and a third silicon oxide film, and a second silicon nitride film formed between the control electrode layer and the first or the second stack. The second silicon nitride film is relatively thinner in the third region than in the first region.
    • 半导体器件包括在电荷存储层和控制电极层之间形成的电极间绝缘膜。 电极间绝缘膜形成在元件隔离绝缘膜的上表面上方的第一区域,沿着电荷存储层的侧壁的第二区域和电荷存储层的上表面上方的第三区域。 电极间绝缘膜包括:第一堆叠,其包括介于第一和第二氧化硅膜之间的第一氮化硅膜或高介电常数膜,或包括第二高介电常数膜和第三氧化硅膜的第二堆叠, 形成在控制电极层和第一或第二堆叠之间的第二氮化硅膜。 在第三区域中,第二氮化硅膜比第一区域相对薄。
    • 6. 发明申请
    • IMAGE PROCESSING APPARATUS
    • 图像处理设备
    • US20130084027A1
    • 2013-04-04
    • US13578542
    • 2011-02-10
    • Shunichi KogaMasayuki TanakaMasatoshi Okutomi
    • Shunichi KogaMasayuki TanakaMasatoshi Okutomi
    • G06K9/32
    • G06K9/32G06T3/4053H04N1/3871H04N5/232
    • [Problem]An object of the present invention is to provide an image processing apparatus used for acquisition assistance of optimal low-resolution image set for super-resolution processing.[Means for solving the problem]The image processing apparatus of the present invention comprises a processing unit for computing displacement amounts between a basis image and each reference image, a processing unit for generating a plurality of deformed images based on the displacement amounts, the basis image and a plurality of reference images, a processing unit for setting a threshold of a parameter used at the time of image information selection, a processing unit for selecting image information used in the super-resolution processing from the reference image by using the threshold of the parameter, a processing unit for generating composed images and weighted images based on the basis image, the displacement amounts and the image information, a processing unit for generating high-resolution grid images by dividing the composed image by the weighted image, a processing unit for generating simplified interpolation images based on high-resolution grid images, a processing unit for generating assistance images, a display unit for displaying the assistance images, and a control unit that respectively controls a processing concerning the image input, a processing concerning the basis image selection, a processing concerning the reference image selection and a processing concerning the threshold setting of the parameter as necessary.
    • 本发明的目的是提供一种用于超分辨率处理的最佳低分辨率图像集的获取辅助的图像处理装置。 解决问题的手段本发明的图像处理装置包括:处理单元,用于计算基础图像和每个参考图像之间的位移量;处理单元,用于基于位移量产生多个变形图像;基础 图像和多个参考图像,用于设置在图像信息选择时使用的参数的阈值的处理单元,用于从参考图像中选择用于超分辨率处理的图像信息的处理单元, 所述参数,用于基于所述基础图像生成合成图像和加权图像的处理单元,所述位移量和所述图像信息,用于通过将所述合成图像除以所述加权图像来生成高分辨率网格图像的处理单元,处理单元 用于生成基于高分辨率网格图像的简化插值图像的处理单元 生成辅助图像,用于显示辅助图像的显示单元和分别控制与图像输入有关的处理的控制单元,关于基础图像选择的处理,关于参考图像选择的处理以及关于阈值设置的处理 必要的参数。
    • 10. 发明授权
    • Nonvolatile semiconductor memory device and method of fabricating the same
    • 非易失性半导体存储器件及其制造方法
    • US08022467B2
    • 2011-09-20
    • US12467424
    • 2009-05-18
    • Hirofumi IikawaMasayuki Tanaka
    • Hirofumi IikawaMasayuki Tanaka
    • H01L29/792
    • H01L29/42336H01L21/76224H01L27/11519H01L27/11521H01L27/11524H01L29/513H01L29/7881
    • A nonvolatile semiconductor memory device includes a first insulating layer, charge storage layers, element isolation insulating films, and a second insulating layer formed on the charge storage layers and the element isolation insulating films and including a stacked structure of a first silicon nitride film, first silicon oxide film, intermediate insulating film and second silicon oxide film. The first silicon nitride film has a nitrogen concentration of not less than 21×1015 atoms/cm2. Each element isolation insulating film includes a high-temperature oxide film formed along lower side surfaces of the charge storage layers between the charge storage layers and a coating type insulating film. The first silicon nitride film is formed on an upper surface of the high-temperature oxide film in upper surfaces of the element isolation insulating films and not on the upper surface of the coating type insulating film.
    • 非易失性半导体存储器件包括第一绝缘层,电荷存储层,元件隔离绝缘膜和形成在电荷存储层和元件隔离绝缘膜上的第二绝缘层,并且包括第一氮化硅膜的堆叠结构,第一 氧化硅膜,中间绝缘膜和第二氧化硅膜。 第一氮化硅膜的氮浓度不小于21×10 15原子/ cm 2。 每个元件隔离绝缘膜包括沿电荷存储层和涂层型绝缘膜之间的电荷存储层的下侧表面形成的高温氧化膜。 第一氮化硅膜形成在元件隔离绝缘膜的上表面的高温氧化膜的上表面上,而不是在涂层型绝缘膜的上表面上。