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    • 1. 发明申请
    • OXETANE-CONTAINING RESIN, AS WELL AS AN ADHESIVE AND A RESIST AGENT USING THE SAME
    • 包含含氧树脂,作为粘合剂和使用它的耐药剂
    • US20100069599A1
    • 2010-03-18
    • US12513388
    • 2007-11-08
    • Takeshi YatsukaKatsuya ShimenoTakahiro HattoriShintaro NanbaraShoko NagataYasunari Hotta
    • Takeshi YatsukaKatsuya ShimenoTakahiro HattoriShintaro NanbaraShoko NagataYasunari Hotta
    • C08G18/77C08G69/00C08G63/00C08G79/02C08G65/00C08G67/00
    • C08G18/4684C08G18/3218C08G18/348C08G18/3878C08G18/664C08G18/6659C08G63/668C08G65/18C09J167/00
    • [Object] To provide a thermosetting resin used for the manufacture of layered products for fibrous use, electrical products and automobile parts or, particularly, used for multilayered circuit board and flat cables, being suitable for a latent thermosetting adhesive which shows, upon adhesion, the fluidity necessary for the adhesion but quickly hardens by heat or light and also being excellent in resistance to heat upon soldering; to provide a resin expressing an excellent flame-retarding property in spite of non-use of halogen, and expressing latent hardening properties to quickly harden by heat and light; and to provide an adhesive and a resist agent comprising the same.[Constitution] An oxetane-containing resin which is characterized in having a number-average molecular weight of not less than 2,000, having one or more bonding group(s) selected from ester bond, urethane bond, amide bond and ether bond in its main chain and containing 100 to 10,000 equivalents/ton of oxetane group, 300 to 5,000 equivalents/ton of carboxyl group, not less than 0.1% by weight of phosphorus atom and 100 to 2,000 equivalents/ton of ethylenic unsaturated double bond in a molecule in a molecule. An adhesive and a resist agent obtained from the same.
    • 本发明提供一种用于制造纤维用层压制品,电气产品和汽车部件的热固性树脂,特别是用于多层电路板和扁平电缆的热固性树脂,适用于潜热固化性粘合剂, 粘合所需的流动性,但由于热或光而迅速硬化,并且在焊接时耐热性优异; 提供尽管不使用卤素表现出优异的阻燃性的树脂,并表现出潜热硬化性能以通过热和光快速硬化; 并提供包含该粘合剂和抗蚀剂的粘合剂和抗蚀剂。 [结构]其特征在于数均分子量为2000以上的含有氧杂环丁烷的树脂,其主要具有一个或多个选自酯键,氨基甲酸酯键,酰胺键和醚键的键合基团 含有100至10,000当量/吨氧杂环丁烷基,300至5000当量/吨羧基,不少于0.1重量%的磷原子和100至2,000当量/吨的烯属不饱和双键在分子中的 分子。 从其获得的粘合剂和抗蚀剂。