会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 9. 发明授权
    • Semiconductor wafer polishing apparatus
    • 半导体晶片抛光装置
    • US6074287A
    • 2000-06-13
    • US834665
    • 1997-04-11
    • Akira MiyajiTakashi AraiTakeshi Yagi
    • Akira MiyajiTakashi AraiTakeshi Yagi
    • B24B37/20B24B49/12B24D7/12B24B7/22
    • B24B37/205B24B49/12
    • Polishing laps and apparatus incorporating such polishing laps for polishing workpieces such as semiconductor wafers are disclosed. The polishing laps are made from a cured mixture of an epoxy resin and a filler material, and preferably have at least a portion that is transparent to light. The polishing lap is preferably mounted on rigid polishing wheel or the like with or without an intervening layer such as an elastic layer. Polishing apparatus incorporating the polishing lap preferably include a light source for directing a beam of light toward the transparent portion of the polishing lap to enable the light beam to reflect from the working surface of the workpiece as the workpiece is being polished by the polishing lap. The apparatus also preferably includes a light detector for detecting light reflected from the surface of the workpiece. Such light can provide information, as on the status of the working surface as polishing progresses and can provide an indication of when polishing has reached a desired end point.
    • 公开了用于抛光工件如半导体晶片的抛光圈和装有这种抛光圈的装置。 抛光圈由环氧树脂和填充材料的固化混合物制成,并且优选具有至少一部分对光透明的部分。 抛光搭扣优选安装在具有或不具有中间层(例如弹性层)的刚性抛光轮等上。 结合了抛光搭扣的抛光装置优选地包括一个光源,用于将光束引导到抛光搭盘的透明部分,以使得当工件被抛光圈抛光时,光束能够从工件的工作表面反射。 该装置还优选地包括用于检测从工件的表面反射的光的光检测器。 这样的光可以提供关于作为抛光进行的工作表面的状态的信息,并且可以提供何时抛光已经达到期望的终点。