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1. 发明申请

US20110069455A1 Power Semiconductor Module for Inverter Circuit System 有权
标题翻译：用于逆变器电路系统的功率半导体模块
公开(公告)号：US20110069455A1
公开(公告)日：2011-03-24
申请号：US12886904
申请日：2010-09-21
申请人： Takeshi TOKUYAMA , Kinya Nakatsu , Ryuichi Saito
发明人： Takeshi TOKUYAMA , Kinya Nakatsu , Ryuichi Saito
IPC分类号： H05K7/20
CPC分类号： H01L25/115 , H01L23/473 , H01L25/072 , H01L2224/48091 , H01L2224/48472 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/30107 , H02M7/003 , H02M7/81 , H05K7/20927 , H01L2924/00014 , H01L2924/00
摘要： A double-face-cooled semiconductor module with an upper arm and a lower arm of an inverter circuit includes first and second heat dissipation members, each having a heat dissipation surface on one side and a conducting member formed on another side through an insulation member. On the conducting member on the first dissipation plate is provided with a fixing portion that fixes a collector surface of the semiconductor chip and a gate conductor connected to a gate terminal of the semiconductor module. The gate electrode terminal and the gate conductor are wire bonded. The conducting member on the second heat dissipation member is connected to an emitter surface of the semiconductor chip connected to the first heat dissipation member. The productivity and reliability are improved by most of formation operations for the upper and lower arms series circuit on one of the heat dissipation member.
摘要翻译：具有逆变器电路的上臂和下臂的双面冷却半导体模块包括第一和第二散热构件，每个散热构件具有一侧的散热面和通过绝缘构件形成在另一侧的导电构件。在第一散热板上的导电部件上设置有固定部分，该固定部分固定半导体芯片的集电极表面和连接到半导体模块的栅极端子的栅极导体。栅电极端子和栅极导体线接合。第二散热构件上的导电构件连接到连接到第一散热构件的半导体芯片的发射极表面。通过在散热构件之一上的上下臂系列电路的大多数形成操作来提高生产率和可靠性。

2. 发明申请

US20110228479A1 Electric Power Conversion Apparatus 有权
标题翻译：电力转换装置
公开(公告)号：US20110228479A1
公开(公告)日：2011-09-22
申请号：US13152505
申请日：2011-06-03
申请人： Takeshi TOKUYAMA , Kinya NAKATSU , Ryuichi SAITO , Keisuke HORIUCHI , Toshiya SATOH , Hideki MIYAZAKI
发明人： Takeshi TOKUYAMA , Kinya NAKATSU , Ryuichi SAITO , Keisuke HORIUCHI , Toshiya SATOH , Hideki MIYAZAKI
IPC分类号： H05K7/20
CPC分类号： H05K7/20927 , B60K6/26 , B60K6/28 , B60K6/46 , B60K17/16 , B60L11/1803 , B60L15/007 , B60L2210/40 , B60L2220/14 , B60L2240/429 , B60Y2200/92 , H01L23/3121 , H01L23/36 , H01L23/3675 , H01L23/473 , H01L23/492 , H01L23/49517 , H01L24/45 , H01L25/072 , H01L2224/40137 , H01L2924/00014 , H01L2924/0002 , H01L2924/1203 , H01L2924/13055 , H02M7/003 , H02M7/537 , H02P27/06 , H05K1/0262 , H05K7/2089 , Y10S903/906 , Y10S903/907 , Y10S903/909 , H01L2924/00 , H01L2224/45099
摘要： An electric power conversion apparatus includes: a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that comprises an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module comprises a first and a second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further comprises a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.
摘要翻译：电力转换装置包括：形成冷却水通道的通道壳体; 包括逆变器电路的上臂和下臂串联电路的双面冷却半导体模块; 电容器模块; 直流连接器; 和备用电流连接器。半导体模块包括第一和第二散热金属，其外表面是散热表面，上下臂串联电路紧密地设置在第一散热金属和第二散热金属之间，并且半导体模块还包括直流正极端子，直流负极端子和突出到外部的交流电流端子。通道壳体设置有从冷却水入口延伸到冷却水出口的冷却水通道以及通向冷却水通道的第一开口。

3. 发明申请

US20080251909A1 Power Semiconductor Module for Inverter Circuit System 有权
标题翻译：用于逆变器电路系统的功率半导体模块
公开(公告)号：US20080251909A1
公开(公告)日：2008-10-16
申请号：US12060629
申请日：2008-04-01
申请人： Takeshi TOKUYAMA , Kinya NAKATSU , Ryuichi SAITO
发明人： Takeshi TOKUYAMA , Kinya NAKATSU , Ryuichi SAITO
IPC分类号： H01L23/367
CPC分类号： H01L25/115 , H01L23/473 , H01L25/072 , H01L2224/48091 , H01L2224/48472 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/30107 , H02M7/003 , H02M7/81 , H05K7/20927 , H01L2924/00014 , H01L2924/00
摘要： A double-face-cooled semiconductor module with an upper arm and a lower arm of an inverter circuit includes first and second heat dissipation members, each having a heat dissipation surface on one side and a conducting member formed on another side through an insulation member. On the conducting member on the first dissipation plate is provided with a fixing portion that fixes a collector surface of the semiconductor chip and a gate conductor connected to a gate terminal of the semiconductor module. The gate electrode terminal and the gate conductor are wire bonded. The conducting member on the second heat dissipation member is connected to an emitter surface of the semiconductor chip connected to the first heat dissipation member. The productivity and reliability are improved by most of formation operations for the upper and lower arms series circuit on one of the heat dissipation member.
摘要翻译：具有逆变器电路的上臂和下臂的双面冷却半导体模块包括第一和第二散热构件，每个散热构件具有一侧的散热面和通过绝缘构件形成在另一侧的导电构件。在第一散热板上的导电部件上设置有固定部分，该固定部分固定半导体芯片的集电极表面和连接到半导体模块的栅极端子的栅极导体。栅电极端子和栅极导体线接合。第二散热构件上的导电构件连接到连接到第一散热构件的半导体芯片的发射极表面。通过在散热构件之一上的上下臂系列电路的大多数形成操作来提高生产率和可靠性。

4. 发明申请

US20080186751A1 POWER CONVERSION APPARATUS 有权
标题翻译：功率转换装置
公开(公告)号：US20080186751A1
公开(公告)日：2008-08-07
申请号：US12019990
申请日：2008-01-25
申请人： Takeshi TOKUYAMA , Kinya Nakatsu , Ryuichi Saito
发明人： Takeshi TOKUYAMA , Kinya Nakatsu , Ryuichi Saito
IPC分类号： H02M7/537 , H05K7/20
CPC分类号： H05K7/20927 , H01L23/473 , H01L23/50 , H01L2924/0002 , H01L2924/3011 , H02M7/003 , H02M7/537 , H02M7/5387 , H05K7/209 , H01L2924/00
摘要： Technology leading to a size reduction in a power conversion apparatus comprising a cooling function and technology relating to enhancing productivity and enhancing reliability necessary for commercial production are provided. Series circuits comprising an upper arm and lower arm of an inverter circuit are built in a single semiconductor module 500. The semiconductor module has cooling metal on two sides. An upper arm semiconductor chip and lower arm semiconductor chip are wedged between the cooling metals. The semiconductor module is inserted inside a channel case main unit 214. A DC positive electrode terminal 532, a DC negative electrode terminal 572, and an alternating current terminal 582 of a semiconductor chip are disposed in the semiconductor module. The DC terminals 532 and 572 are electrically connected with a terminal of a capacitor module. The alternating current terminal 582 is electrically connected with a motor generator via an AC connector.
摘要翻译：提供了一种功率转换装置的尺寸减小的技术，其包括与提高生产率并提高商业生产所需的可靠性相关的冷却功能和技术。包括逆变器电路的上臂和下臂的串联电路内置在单个半导体模块500中。半导体模块在两侧具有冷却金属。上臂半导体芯片和下臂半导体芯片楔入冷却金属之间。半导体模块插入通道壳体主单元214内。在半导体模块中设置有直流正极端子532，直流负极端子572和半导体芯片的交流端子582。直流端子532和572与电容器模块的端子电连接。交流端子582经由AC连接器与电动发电机电连接。

5. 发明申请

US20100165577A1 Electric Circuit Device, Electric Circuit Module, and Power Converter 有权
标题翻译：电路设备，电路模块和电源转换器
公开(公告)号：US20100165577A1
公开(公告)日：2010-07-01
申请号：US12715025
申请日：2010-03-01
申请人： Takeshi TOKUYAMA , Kinya Nakatsu , Atushi Kawabata
发明人： Takeshi TOKUYAMA , Kinya Nakatsu , Atushi Kawabata
IPC分类号： H05K7/20
CPC分类号： H05K7/02 , H01G2/08 , H01G4/224 , H01L24/73 , H01L2224/32245 , H01L2224/45124 , H01L2224/48091 , H01L2224/48247 , H01L2224/73215 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/30107 , H01L2924/3025 , H02M7/003 , Y02T10/7022 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The present invention provides an electric circuit device in which it is possible to achieve simultaneously the improvement of cooling performance and reduction in operating loss due to line inductance.The above object can be attained by constructing multiple plate-like conductors so that each of these conductors electrically connected to multiple semiconductor chips is also thermally connected to both chip surfaces of each such semiconductor chip to release heat from the chip surfaces of each semiconductor chip, and so that among the above conductors, a DC positive-polarity plate-like conductor and a DC negative-polarity plate-like conductor are opposed to each other at the respective conductor surfaces.
摘要翻译：本发明提供一种电路装置，其中可以同时实现冷却性能的提高和由于线路电感引起的工作损耗的降低。上述目的可以通过构造多个板状导体来实现，使得电连接到多个半导体芯片的这些导体中的每一个也热连接到每个这样的半导体芯片的两个芯片表面，以从每个半导体芯片的芯片表面释放热量，并且使得在上述导体中，DC正极板状导体和DC负极板状导体在各导体表面处彼此相对。

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