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1. 发明授权

US08581247B2 Flexible semiconductor device having gate electrode disposed within an opening of a resin film 有权
标题翻译：具有设置在树脂膜的开口内的栅电极的柔性半导体器件
公开(公告)号：US08581247B2
公开(公告)日：2013-11-12
申请号：US13256457
申请日：2010-02-02
申请人： Takeshi Suzuki , Kenichi Hotehama , Seiichi Nakatani , Koichi Hirano , Tatsuo Ogawa
发明人： Takeshi Suzuki , Kenichi Hotehama , Seiichi Nakatani , Koichi Hirano , Tatsuo Ogawa
IPC分类号： H01L29/10 , H01L29/12 , H01L21/02
CPC分类号： H01L29/66742 , H01L27/1218 , H01L29/66757 , H01L29/78603 , H01L29/78675 , H01L29/7869 , H01L51/0097 , H01L51/0512
摘要： There is provided a flexible semiconductor device. The flexible semiconductor device of the present invention comprising a support layer, a semiconductor structure portion formed on the support layer, and a resin film formed on the semiconductor structure portion. The resin film comprises an opening formed by a laser irradiation therein, and also an electroconductive member which is in contact with the surface of the semiconductor structure portion is disposed within the opening of the resin film.
摘要翻译：提供了一种柔性半导体器件。本发明的柔性半导体器件包括支撑层，形成在支撑层上的半导体结构部分和形成在半导体结构部分上的树脂膜。树脂膜包括通过激光照射形成的开口，并且与树脂膜的开口部内的导电构件与半导体结构部的表面接触。

2. 发明申请

US20120001173A1 FLEXIBLE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME 有权
标题翻译：柔性半导体器件及其制造方法
公开(公告)号：US20120001173A1
公开(公告)日：2012-01-05
申请号：US13256457
申请日：2010-02-02
申请人： Takeshi Suzuki , Kenichi Hotehama , Seiichi Nakatani , Koichi Hirano , Tatsuo Ogawa
发明人： Takeshi Suzuki , Kenichi Hotehama , Seiichi Nakatani , Koichi Hirano , Tatsuo Ogawa
IPC分类号： H01L29/786 , H01L21/336
CPC分类号： H01L29/66742 , H01L27/1218 , H01L29/66757 , H01L29/78603 , H01L29/78675 , H01L29/7869 , H01L51/0097 , H01L51/0512
摘要： There is provided a flexible semiconductor device. The flexible semiconductor device of the present invention comprising a support layer, a semiconductor structure portion formed on the support layer, and a resin film formed on the semiconductor structure portion. The resin film comprises an opening formed by a laser irradiation therein, and also an electroconductive member which is in contact with the surface of the semiconductor structure portion is disposed within the opening of the resin film.
摘要翻译：提供了一种柔性半导体器件。本发明的柔性半导体器件包括支撑层，形成在支撑层上的半导体结构部分和形成在半导体结构部分上的树脂膜。树脂膜包括通过激光照射形成的开口，并且与树脂膜的开口部内的导电构件与半导体结构部的表面接触。

3. 发明授权

US08343822B2 Flexible semiconductor device and method for manufacturing same 有权
标题翻译：柔性半导体器件及其制造方法
公开(公告)号：US08343822B2
公开(公告)日：2013-01-01
申请号：US12681445
申请日：2009-07-30
申请人： Koichi Hirano , Seiichi Nakatani , Tatsuo Ogawa , Takashi Ichiryu , Takeshi Suzuki
发明人： Koichi Hirano , Seiichi Nakatani , Tatsuo Ogawa , Takashi Ichiryu , Takeshi Suzuki
IPC分类号： H01L21/84 , H01L21/00
CPC分类号： H01L29/78651 , H01L27/1218 , H01L27/124 , H01L27/1266 , H01L29/41733 , H01L29/42384 , H01L29/78603 , H01L29/7869
摘要： A method for manufacturing a flexible semiconductor device includes (i) forming an insulating film on the upper surface of metal foil, (ii) forming an extraction electrode pattern on the upper surface of the metal foil, (iii) forming a semiconductor layer on the insulating film such that the semiconductor layer is in contact with the extraction electrode pattern, (iv) forming a sealing resin layer on the upper surface of the metal foil such that the sealing resin layer covers the semiconductor layer and the extraction electrode pattern, and (v) forming electrodes by etching the metal foil, the metal foil being used as a support for the insulating film, the extraction electrode pattern, the semiconductor layer, and the sealing resin layer formed in (i) to (iv) and used as a constituent material for the electrodes in (v). The metal foil need not be stripped, and a high-temperature process can be used.
摘要翻译：一种制造柔性半导体器件的方法包括：（i）在金属箔的上表面上形成绝缘膜，（ii）在金属箔的上表面上形成引出电极图案，（iii）在金属箔的上表面上形成半导体层绝缘膜，使得半导体层与引出电极图案接触，（iv）在金属箔的上表面上形成密封树脂层，使得密封树脂层覆盖半导体层和引出电极图案，和（ v）通过蚀刻金属箔形成电极，金属箔用作绝缘膜的支撑体，引出电极图案，半导体层和形成在（i）至（iv）中的密封树脂层，并用作（v）中的电极的构成材料。金属箔不需要剥离，可以使用高温工艺。

4. 发明申请

US20100283054A1 FLEXIBLE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME 有权
标题翻译：柔性半导体器件及其制造方法
公开(公告)号：US20100283054A1
公开(公告)日：2010-11-11
申请号：US12681445
申请日：2009-07-30
申请人： Koichi Hirano , Seiichi Nakatani , Tatsuo Ogawa , Takashi Ichiryu , Takeshi Suzuki
发明人： Koichi Hirano , Seiichi Nakatani , Tatsuo Ogawa , Takashi Ichiryu , Takeshi Suzuki
IPC分类号： H01L29/786 , H01L21/336
CPC分类号： H01L29/78651 , H01L27/1218 , H01L27/124 , H01L27/1266 , H01L29/41733 , H01L29/42384 , H01L29/78603 , H01L29/7869
摘要： There is provided a method for manufacturing a flexible semiconductor device characterized by comprising (i) a step of forming an insulating film on the upper surface of metal foil, (ii) a step of forming an extraction electrode pattern on the upper surface of the metal foil, (iii) a step of forming a semiconductor layer on the insulating film in such a manner that the semiconductor layer is in contact with the extraction electrode pattern, (iv) a step of forming a sealing resin layer on the upper surface of the metal foil in such a manner that the sealing resin layer covers the semiconductor layer and the extraction electrode pattern, and (v) a step of forming electrodes by etching the metal foil, wherein the metal foil is used as a support for the insulating film, the extraction electrode pattern, the semiconductor layer, and the sealing resin layer formed in (i) to (iv) and used as a constituent material for the electrodes in (v). A TFT element can be fabricated by a simple process because the metal foil serving as the support need not be finally stripped off. Further, a high-temperature process can be introduced to the fabrication of the insulating film and the semiconductor layer because the metal foil is used as the support, whereby the TFT characteristic is improved.
摘要翻译：提供了一种制造柔性半导体器件的方法，其特征在于包括：（i）在金属箔的上表面上形成绝缘膜的步骤，（ii）在金属的上表面上形成引出电极图案的步骤箔，（iii）以半导体层与引出电极图案接触的方式在绝缘膜上形成半导体层的步骤，（iv）在所述绝缘膜的上表面上形成密封树脂层的步骤金属箔以密封树脂层覆盖半导体层和引出电极图案，以及（v）通过蚀刻金属箔形成电极的步骤，其中金属箔用作绝缘膜的支撑体，（i）〜（iv）中形成的并用作（v）中的电极的构成材料的引出电极图案，半导体层和密封树脂层。由于作为支撑体的金属箔不需要最终被剥离，所以可以通过简单的工艺制造TFT元件。此外，由于使用金属箔作为支撑体，因此可以将绝缘膜和半导体层的制造引入高温处理，从而提高TFT特性。

5. 发明申请

US20100261321A1 METHOD FOR MANUFACTURING FLEXIBLE SEMICONDUCTOR DEVICE 有权
标题翻译：制造柔性半导体器件的方法
公开(公告)号：US20100261321A1
公开(公告)日：2010-10-14
申请号：US12681399
申请日：2009-07-30
申请人： Koichi Hirano , Seiichi Nakatani , Tatsuo Ogawa
发明人： Koichi Hirano , Seiichi Nakatani , Tatsuo Ogawa
IPC分类号： H01L21/336
CPC分类号： H01L51/0541 , H01L51/0004 , H01L51/0022 , H01L51/0097 , H01L51/107 , Y02E10/549 , Y02P70/521
摘要： There is provided a method for manufacturing a flexible semiconductor device. The manufacturing method is characterized by comprising (i) a step of forming an insulating film on the upper surface of a resin film, (ii) a step of forming a pattern of extraction electrodes on the upper surface of the resin film, (iii) a step of forming a semiconductor layer on the insulating film in such a manner that the semiconductor layer is in contact with the pattern of extraction electrodes, and (iv) a step of forming a sealing resin layer on the upper surface of the resin film in such a manner that the sealing resin layer covers the semiconductor layer and the pattern of extraction electrodes, wherein at least one forming step among the above (i) to (iv) is carried out by a printing method. In the manufacturing method, various layers can be formed by a simple printing process without using a vacuum process, photolithography, or the like.
摘要翻译：提供了一种用于制造柔性半导体器件的方法。（i）在树脂膜的上表面形成绝缘膜的工序，（ii）在树脂膜的上表面形成引出电极的图案的工序，（iii）以使得半导体层与引出电极的图案接触的方式在绝缘膜上形成半导体层的步骤，以及（iv）在树脂膜的上表面上形成密封树脂层的步骤密封树脂层覆盖半导体层和提取电极的图案的方式，其中上述（i）至（iv）中的至少一个形成步骤通过印刷方法进行。在制造方法中，可以通过简单的印刷工艺形成各种层，而不使用真空工艺，光刻等。

6. 发明授权

US08435842B2 Method for manufacturing flexible semiconductor device 有权
标题翻译：柔性半导体器件的制造方法
公开(公告)号：US08435842B2
公开(公告)日：2013-05-07
申请号：US12681399
申请日：2009-07-30
申请人： Koichi Hirano , Seiichi Nakatani , Tatsuo Ogawa
发明人： Koichi Hirano , Seiichi Nakatani , Tatsuo Ogawa
IPC分类号： H01L21/00
CPC分类号： H01L51/0541 , H01L51/0004 , H01L51/0022 , H01L51/0097 , H01L51/107 , Y02E10/549 , Y02P70/521
摘要： A method for manufacturing a flexible semiconductor device comprises (i) forming an insulating film on the upper surface of a resin film, (ii) forming a pattern of extraction electrodes on the upper surface of the resin film, (iii) forming a semiconductor layer on the insulating film in such a manner that the semiconductor layer is in contact with the pattern of extraction electrodes, and (iv) forming a sealing resin layer on the upper surface of the resin film in such a manner that the sealing resin layer covers the semiconductor layer and the pattern of extraction electrodes, wherein at least one of the stepsof the above steps (i) to (iv) is carried out by a printing method. With this manufacturing method, various layers can be formed by a simple printing process without using a vacuum process, photolithography, or the like.
摘要翻译：一种制造柔性半导体器件的方法包括：（i）在树脂膜的上表面上形成绝缘膜，（ii）在树脂膜的上表面上形成提取电极的图案，（iii）形成半导体层以使得半导体层与提取电极的图案接触的方式在绝缘膜上，以及（iv）在树脂膜的上表面上形成密封树脂层，使得密封树脂层覆盖半导体层和提取电极的图案，其中通过印刷方法进行上述步骤（i）至（iv）中的步骤中的至少一个。利用该制造方法，可以通过简单的印刷工艺形成各种层，而不使用真空工艺，光刻等。

7. 发明授权

US08063486B2 Circuit board, method for manufacturing the same, and semiconductor device 有权
标题翻译：电路基板及其制造方法以及半导体装置
公开(公告)号：US08063486B2
公开(公告)日：2011-11-22
申请号：US11748111
申请日：2007-05-14
申请人： Koichi Hirano , Tsukasa Shiraishi , Seiichi Nakatani , Tatsuo Ogawa
发明人： Koichi Hirano , Tsukasa Shiraishi , Seiichi Nakatani , Tatsuo Ogawa
IPC分类号： H01L23/48
CPC分类号： H05K1/0271 , H01L23/49811 , H01L24/12 , H01L24/16 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/13011 , H01L2224/13099 , H01L2224/13111 , H01L2224/16 , H01L2224/81191 , H01L2224/81801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15787 , H01L2924/351 , H05K1/09 , H05K1/111 , H05K3/243 , H05K2201/0338 , H05K2201/0355 , H05K2201/09109 , H01L2924/00 , H01L2224/05599
摘要： A circuit board 1 having a base material 10 and an electrode 11 formed on at least one main surface of the base material 10 includes an easy peeling portion 12 formed in at least one of an inner portion and a side portion of the electrode 11, with the adhesive strength between the electrode 11 and the easy peeling portion 12 being less than the adhesive strength between the electrode 11 and the base material 10. A circuit board that has high connection reliability and enables narrow pitch mounting thereby can be provided.
摘要翻译：具有基材10和形成在基材10的至少一个主表面上的电极11的电路板1包括形成在电极11的内部和侧部中的至少一个中的易剥离部分12，电极11和容易剥离部12之间的粘合强度小于电极11与基材10之间的粘合强度。可以提供具有高连接可靠性并能实现窄间距安装的电路板。

8. 发明授权

US06326694B1 Printed circuit board 有权
标题翻译：印刷电路板
公开(公告)号：US06326694B1
公开(公告)日：2001-12-04
申请号：US09337407
申请日：1999-06-21
申请人： Akihito Hatakeyama , Seiichi Nakatani , Kouji Kawakita , Hiroshi Sogou , Tatsuo Ogawa , Tamao Kojima
发明人： Akihito Hatakeyama , Seiichi Nakatani , Kouji Kawakita , Hiroshi Sogou , Tatsuo Ogawa , Tamao Kojima
IPC分类号： H01L2348
CPC分类号： H05K3/462 , H05K1/0366 , H05K3/4069 , H05K3/4614 , H05K3/4652 , H05K2201/0116 , H05K2201/0154 , H05K2201/0278 , H05K2201/0355 , H05K2201/10378 , H05K2201/2072 , H05K2203/0191 , H05K2203/1461 , Y10S428/901 , Y10T29/49126 , Y10T29/49155 , Y10T428/24917 , Y10T428/249953 , Y10T428/249996
摘要： A printed circuit board includes an uncured substrate material with closed voids which are disposed with a through-hole. When the through-hole is formed, voids which exist in the substrate material open from inner wall of the through-hole to form a hollow-shaped part. By filling the through-hole and the hollow-shaped part with conductive paste, the adhesion improves by the increased holding effect between the conductive paste and the wall surface of the through-hole.
摘要翻译：印刷电路板包括具有封闭空隙的未固化衬底材料，所述未固化衬底材料设置有通孔。当形成通孔时，存在于基板材料中的空隙从通孔的内壁开口形成中空形部分。通过用导电膏填充通孔和中空形部分，通过导电膏和通孔的壁表面之间的保持效果增加，粘附性得到改善。

9. 发明授权

US6108903A Connecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the same 失效
标题翻译：电路基板的连接部件和使用该电路基板的多层电路基板的制造方法
公开(公告)号：US6108903A
公开(公告)日：2000-08-29
申请号：US582930
申请日：1996-01-04
申请人： Seiichi Nakatani , Akihito Hatakeyama , Kouji Kawakita , Hiroshi Sogou , Tatsuo Ogawa , Tamao Kojima
发明人： Seiichi Nakatani , Akihito Hatakeyama , Kouji Kawakita , Hiroshi Sogou , Tatsuo Ogawa , Tamao Kojima
IPC分类号： H05K3/40 , H05K3/42 , H05K3/46 , H05K3/10 , H05K3/36
CPC分类号： H05K3/462 , H01R12/523 , H05K3/4069 , H05K2201/0116 , H05K2201/0355 , H05K2201/09536 , H05K2201/10378 , H05K2203/0191 , H05K2203/1461 , H05K3/4623 , H05K3/4652 , Y10S428/901 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T428/24273 , Y10T428/24322 , Y10T428/24917
摘要： A connecting member of circuit substrates includes an organic porous base material provided with tackfree films on both sides, through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films. This structure enables inner-via-hole connection and can therefore attain a connecting member of circuit substrates and an electrical connector of high reliability and high quality. By using a connecting member of circuit substrates including the organic porous base material provided with tackfree films on both sides and through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films, it is possible to form a high-multilayer substrate easily from double sided boards or four-layer substrates which can be manufactured rather stably. In addition to that, since the conductive paste is filled up to the surface of the tackfree films, the conductive paste sticks out from the surface of the organic porous base material when the tackfree films are separated. As a result, the filled amount of the conductive substance increases after the lamination, and thus, the connection resistance is reduced considerably.
摘要翻译：电路基板的连接构件包括在两侧设置有无粘性薄膜的有机多孔基材，设置在要求位置的通孔，其填充有导电树脂组合物直到无粘膜的表面。这种结构能够实现内通孔连接，从而可以获得电路基板的连接构件和高可靠性和高质量的电连接器。通过使用包括在两侧设置有无粘膜的有机多孔基材的电路基板的连接构件，以及设置在填充有导电树脂组合物的所需位置的通孔，直到无粘膜的表面，可以形成来自可以制造得相当稳定的双面板或四层基板的高多层基板。除此之外，由于导电膏被填充到无粘性膜的表面，所以当无粘性膜分离时，导电糊从有机多孔基材的表面突出出来。结果，在层压之后导电物质的填充量增加，因此连接电阻显着降低。

10. 发明授权

US5972482A Printed circuit board and method of manufacturing the same 失效
标题翻译：印刷电路板及其制造方法
公开(公告)号：US5972482A
公开(公告)日：1999-10-26
申请号：US740261
申请日：1996-10-25
申请人： Akihito Hatakeyama , Seiichi Nakatani , Kouji Kawakita , Hiroshi Sogou , Tatsuo Ogawa , Tamao Kojima
发明人： Akihito Hatakeyama , Seiichi Nakatani , Kouji Kawakita , Hiroshi Sogou , Tatsuo Ogawa , Tamao Kojima
IPC分类号： H05K1/03 , H05K3/40 , H05K3/46 , B32B9/00
CPC分类号： H05K3/462 , H05K3/4069 , H05K1/0366 , H05K2201/0116 , H05K2201/0154 , H05K2201/0278 , H05K2201/0355 , H05K2201/10378 , H05K2201/2072 , H05K2203/0191 , H05K2203/1461 , H05K3/4614 , H05K3/4652 , Y10S428/901 , Y10T29/49126 , Y10T29/49155 , Y10T428/24917 , Y10T428/249953 , Y10T428/249996
摘要： A printed circuit board includes an uncured substrate material with closed voids which are disposed with a through-hole. When the through-hole is formed, voids which exist in the substrate material open from inner wall of the through-hole to form a hollow-shaped part. By filling the through-hole and the hollow-shaped part with conductive paste, the adhesion improves by the increased holding effect between the conductive paste and the wall surface of the through-hole.
摘要翻译：印刷电路板包括具有封闭空隙的未固化衬底材料，所述未固化衬底材料设置有通孔。当形成通孔时，存在于基板材料中的空隙从通孔的内壁开口形成中空形部分。通过用导电膏填充通孔和中空形部分，通过导电膏和通孔的壁表面之间的保持效果增加，粘附性得到改善。

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