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1. 发明授权

US06577000B2 Premold type semiconductor package 失效
标题翻译：预制型半导体封装
公开(公告)号：US06577000B2
公开(公告)日：2003-06-10
申请号：US10020222
申请日：2001-12-18
申请人： Takeshi Sato , Hiromi Tokunaga , Kenichi Sakaguchi
发明人： Takeshi Sato , Hiromi Tokunaga , Kenichi Sakaguchi
IPC分类号： H01L2304
CPC分类号： H01L23/055 , H01L21/565 , H01L23/057 , H01L23/49816 , H01L23/49861 , H01L24/45 , H01L24/48 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/85455 , H01L2924/00014 , H01L2924/00015 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15311 , H01L2924/16195 , H01L2924/181 , H01L2924/30107 , H01L2924/3025 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2224/45015 , H01L2924/207
摘要： A premold type semiconductor package includes a plurality of leads arranged side by side and having upper and lower common surfaces, a mold resin integrally molded with the leads for securing them from the upper and lower surfaces thereof. The mold resin defines a chip mounting recess at an upper side on the first surfaces of the leads, so that a semiconductor chip is to be mounted in the recess. The upper surfaces of the leads are partially exposed in the recess so as to define internal connecting terminals to which the semiconductor chip is to be electrically connected. The mold resin is provided with a plurality of holes by which the lower surfaces of the leads are partially exposed to define external connecting terminals.
摘要翻译：预成型半导体封装包括并排布置的多个引线，具有上和下公共表面，与引线一体成型的模制树脂，用于将它们从上表面和下表面固定。模具树脂在引线的第一表面上的上侧限定了芯片安装凹部，从而将半导体芯片安装在凹部中。引线的上表面部分地露出在凹部中，以便限定半导体芯片要被电连接到的内部连接端子。模具树脂设置有多个孔，引线的下表面部分地露出以限定外部连接端子。

2. 发明授权

US06333211B1 Process for manufacturing a premold type semiconductor package using support pins in the mold and external connector bumps 失效
标题翻译：使用模具中的支撑销和外部连接器凸块来制造预制型半导体封装的工艺
公开(公告)号：US06333211B1
公开(公告)日：2001-12-25
申请号：US09383577
申请日：1999-08-25
申请人： Takeshi Sato , Hiromi Tokunaga , Kenichi Sakaguchi
发明人： Takeshi Sato , Hiromi Tokunaga , Kenichi Sakaguchi
IPC分类号： H01L2144
CPC分类号： H01L23/055 , H01L21/565 , H01L23/057 , H01L23/49816 , H01L23/49861 , H01L24/45 , H01L24/48 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/85455 , H01L2924/00014 , H01L2924/00015 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15311 , H01L2924/16195 , H01L2924/181 , H01L2924/30107 , H01L2924/3025 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2224/45015 , H01L2924/207
摘要： A premold type semiconductor package includes a plurality of leads arranged side by side and having upper and lower common surfaces, a mold resin integrally molded with the leads for securing them from the upper and lower surfaces thereof. The mold resin defines a chip mounting recess at an upper side on the first surfaces of the leads, so that a semiconductor chip is to be mounted in the recess. The upper surfaces of the leads are partially exposed in the recess so as to define internal connecting terminals to which the semiconductor chip is to be electrically connected. The mold resin is provided with a plurality of holes by which the lower surfaces of the leads are partially exposed to define external connecting terminals.
摘要翻译：预成型半导体封装包括并排布置的多个引线，具有上和下公共表面，与引线一体成型的模制树脂，用于将它们从上表面和下表面固定。模具树脂在引线的第一表面上的上侧限定了芯片安装凹部，从而将半导体芯片安装在凹部中。引线的上表面部分地露出在凹部中，以便限定半导体芯片要被电连接到的内部连接端子。模具树脂设置有多个孔，引线的下表面部分地露出以限定外部连接端子。

3. 发明授权

US6097101A Package for semiconductor device having frame-like molded portion and producing method of the same 失效
标题翻译：具有框状模制部件的半导体器件用封装件及其制造方法
公开(公告)号：US6097101A
公开(公告)日：2000-08-01
申请号：US240652
申请日：1999-01-29
申请人： Takeshi Sato , Kenichi Sakaguchi , Hiromi Tokunaga
发明人： Takeshi Sato , Kenichi Sakaguchi , Hiromi Tokunaga
IPC分类号： H01L23/055 , H04L3/28
CPC分类号： H01L23/055 , H01L2224/05599 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/85399 , H01L2224/92247 , H01L24/48 , H01L2924/00014 , H01L2924/01078 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/16195
摘要： The object of the present invention is to provide a premolded-type package for a semiconductor device which can be produced easily and exhibits a good airtightness, and to provide a method for effectively producing the same. A package for a semiconductor device has a wiring substrate 32 having a resin substrate 35 which is provided on its one surface with a wiring pattern 37, a chip-mounting portion 36 and a frame-like pattern 38 of a metal surrounding the wiring pattern 37 and the chip-mounting portion 36, and on the other surface with a plurality of terminals 41 electrically connected to the wiring pattern, and a frame-like molded portion 45 of thermosetting resin, molded on the frame-like pattern 38 on the wiring substrate 32.
摘要翻译：本发明的目的是提供一种用于半导体器件的预成型封装，其可以容易地制造并且表现出良好的气密性，并提供一种有效地制造该半导体器件的方法。用于半导体器件的封装具有布线基板32，该布线基板32具有树脂基板35，该树脂基板35在其一个表面上设置有布线图案37，金属芯片安装部36和围绕布线图案37的金属的框状图案38 和芯片安装部36，在与布线图形电连接的多个端子41的另一面上形成有在布线基板上的框状图案38上成型的热固性树脂的框状的成型部45 32。

4. 发明授权

US5945688A Optical semiconductor device and lead frame used in such a device 失效
标题翻译：在这种装置中使用的光学半导体装置和引线框架
公开(公告)号：US5945688A
公开(公告)日：1999-08-31
申请号：US85361
申请日：1998-05-27
申请人： Masataka Kasahara , Kenichi Sakaguchi
发明人： Masataka Kasahara , Kenichi Sakaguchi
IPC分类号： G02B6/42 , H01L23/28 , H01L23/48 , H01L31/0232 , H01L33/62 , H01L27/15 , H01L23/495 , H01L31/12 , H01L33/00
CPC分类号： G02B6/4248 , G02B6/4251 , G02B6/4274 , G02B6/4239 , G02B6/4243 , G02B6/4286 , H01L2924/0002
摘要： A lead frame for mounting thereon an optical semiconductor device includes a stage, a plurality of leads arranged in a peripheral region of the stage and a support member extended from said stage. An optical semiconductor device includes such a lead frame, a substrate mounted on the stage of the lead frame, an optical semiconductor chip mounted on the substrate and having electrodes which are electrically connected to the electrodes. An optical fiber has a leading end which is mounted on the substrate and an intermediate portion which is fixedly secured to the support member so that the leading end portion is located at a predetermined position with respect to the chip. An insulating sealing material hermetically seals the optical semiconductor chip, the leading end portion of the optical fiber and at least a part of the support member.
摘要翻译：用于在其上安装光学半导体器件的引线框架包括台，布置在台的周边区域中的多个引线和从所述台延伸的支撑构件。一种光学半导体器件包括这样的引线框架，安装在引线框架的台上的基板，安装在基板上并具有电连接到电极的电极的光学半导体芯片。光纤具有安装在基板上的前端和固定地固定在支撑部件上的中间部分，使得前端部相对于芯片位于预定位置。绝缘密封材料密封光学半导体芯片，光纤的前端部分和支撑部件的至少一部分。

5. 发明申请

US20080067654A1 Electronic component package and electronic component device 审中-公开
标题翻译：电子元件封装和电子元器件
公开(公告)号：US20080067654A1
公开(公告)日：2008-03-20
申请号：US11898239
申请日：2007-09-11
申请人： Kenichi Sakaguchi
发明人： Kenichi Sakaguchi
IPC分类号： H01L23/02
CPC分类号： H01L23/047 , H01L23/3677 , H01L2224/48091 , H01L2224/48247 , H01S5/02216 , H01S5/02244 , H01S5/02248 , H01S5/02276 , H01S5/02469 , H01L2924/00014
摘要： An electronic component package includes, a die pad on which an electronic component is mounted, a radiation plate disposed to be connected to part of the die pad and bent downward, a plurality of leads disposed side by side on a periphery of the die pad, each lead composed of an inner lead disposed on the die pad side and an outer lead connected to the inner lead and bent downward, and a resin portion composed of a lower resin portion formed under the die pad and the inner lead, and a frame-like resin portion formed in a ring shape to stand up on the lower resin portion so that a connection part of the inner lead and an upper surface of the die pad can be exposed, wherein the die pad, the radiation plate and the leads are supported by the resin portion and integrated with each other.
摘要翻译：一种电子部件封装，其具有安装有电子部件的芯片焊盘，设置为与芯片焊盘的一部分连接并向下弯曲的放射板，并排设置在芯片焊盘的周围的多个引线，每个引线由设置在芯片焊盘侧的内部引线和与内部引线连接并向下弯曲的外部引线构成，并且由形成在管芯焊盘和下部引线下方的下部树脂部分构成的树脂部分，形成为环状的环状树脂部分，以立起在下部树脂部分上，使得内部引线的连接部分和管芯焊盘的上表面能够被暴露，其中，管芯焊盘，辐射板和引线被支撑通过树脂部分并且彼此一体化。

6. 发明授权

US4755125A Compression molding apparatus 失效
公开(公告)号：US4755125A
公开(公告)日：1988-07-05
申请号：US887399
申请日：1986-07-21
申请人： Hiroshi Takeda , Noritsugu Oshima , Tateo Kubo , Kenichi Sakaguchi
发明人： Hiroshi Takeda , Noritsugu Oshima , Tateo Kubo , Kenichi Sakaguchi
IPC分类号： B29C43/00 , B29B9/08 , B29B11/10 , B29C31/04 , B29C31/06 , B29C37/00 , B29C43/08 , B29C43/34 , B29C43/36 , B29C43/42 , B29C47/00 , B29C69/00 , B29L31/56 , B29C45/06
CPC分类号： B29C43/08 , B29B11/10 , B29B9/08 , B29C31/048 , B29C37/0096 , B29C43/34 , B29C47/0066 , B29C2043/3222 , B29C2043/3288 , B29C2043/3433 , B29C2043/3678 , B29C2793/0027 , B29C31/06 , B29C43/42 , B29C47/00 , B29C47/0011 , B29C47/004 , B29L2031/565
摘要： A compression molding apparatus comprising a rotary compression molding means, a material feed means and an article carrying means. The rotary compression molding means includes a rotating supporting member mounted rotatably about its central axis, a plurality of molding die means mounted on said rotating supporting member at circumferentially spaced intervals, each of said molding die means having an upper die assembly and a lower die assembly cooperating with each other, at least one of the upper die assembly and lower die assembly being freely movable with respect to the other, a driving source for rotating said rotating supporting member in a predetermined direction and moving said molding die means through a circular conveying passage including a material charging zone, a molding zone, a cooling zone and an article discharging zone located successively, and a die opening and closing means for moving at least one of said upper and lower die assemblies in a predetermined manner with respect to the other according to the movement of the molding die means. The material feed means feeds a plastic material to the molding die means in the material charging means. The article carrying means carries the molded article from the molding die means in the article discharging zone.

7. 发明授权

US4640673A Compression molding apparatus 失效
标题翻译：压缩成型设备
公开(公告)号：US4640673A
公开(公告)日：1987-02-03
申请号：US730534
申请日：1985-05-03
申请人： Hiroshi Takeda , Noritsugu Oshima , Tateo Kubo , Kenichi Sakaguchi
发明人： Hiroshi Takeda , Noritsugu Oshima , Tateo Kubo , Kenichi Sakaguchi
IPC分类号： B29C43/00 , B29B9/08 , B29B11/10 , B29C31/04 , B29C31/06 , B29C37/00 , B29C43/08 , B29C43/34 , B29C43/36 , B29C43/42 , B29C47/00 , B29C69/00 , B29L31/56 , B29C45/06
CPC分类号： B29C43/08 , B29B11/10 , B29B9/08 , B29C31/048 , B29C37/0096 , B29C43/34 , B29C47/0066 , B29C2043/3222 , B29C2043/3288 , B29C2043/3433 , B29C2043/3678 , B29C2793/0027 , B29C31/06 , B29C43/42 , B29C47/00 , B29C47/0011 , B29C47/004 , B29L2031/565
摘要： A compression molding apparatus comprising a rotary compression molding means, a material feed means and an article carrying means. The rotary compression molding means includes a rotating supporting member mounted rotatably about its central axis, a plurality of molding die means mounted on said rotating supporting member at circumferentially spaced intervals, each of said molding die means having an upper die assembly and a lower die assembly cooperating with each other, at least one of upper die assembly and lower die assembly being freely movable with respect to the other, a driving source for rotating said rotating supporting member in a predetermined direction and moving said molding die means through a circular conveying passage including a material charging zone, a molding zone, a cooling zone and an article discharging zone located successively, and a die opening and closing means for moving at least one of said upper and lower die assemblies in a predetermined manner with respect to the other according to the movement of the molding die means.
摘要翻译：一种压缩成型设备，包括旋转压缩模制装置，材料供给装置和物品承载装置。旋转压缩成型装置包括围绕其中心轴线可旋转地安装的旋转支撑构件，多个成型模具装置，其周向隔开间隔安装在所述旋转支撑构件上，每个模具模具具有上模组件和下模组件彼此配合，上模组件和下模组件中的至少一个相对于另一个可自由移动;驱动源，用于沿预定方向旋转所述旋转支撑构件，并通过圆形输送通道移动所述成型模具装置，所述圆形输送通道包括一个材料装料区，一个成型区，一个冷却区和一个连续定位的物品排放区，以及一个模具打开和关闭装置，用于相对于另一个以预定方式相对于另一个移动至少一个所述上模组件和下模组件成型模具的移动。

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