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    • 1. 发明授权
    • Automatic testing system and method for semiconductor devices
    • 半导体器件自动测试系统和方法
    • US5788084A
    • 1998-08-04
    • US648060
    • 1996-07-01
    • Takeshi OnishiTadashi KainumaKatsumi KojimaBannai KuniakiTanaka KoichiYamada Naruhito
    • Takeshi OnishiTadashi KainumaKatsumi KojimaBannai KuniakiTanaka KoichiYamada Naruhito
    • G01R31/04G01R31/28B07C5/344
    • G01R31/043G01R31/04G01R31/2893
    • An automatic testing system and method for inspecting the contact characteristics of the contact pins of each of sockets of an IC tester disposed in the testing zone of an IC handler in an automatic and efficient fashion prior to testing semiconductor devices under test is provided. A test device which is identical in shape to semiconductor devices to be tested and the electric characteristics of which are known is provided and is carried on a test tray and conveyed from the loader section to the testing zone where the test device is brought into contact with a socket to measure the contact characteristics of the socket. Upon completion of the measurement, the test device is transferred from the test tray to the customer tray, and the customer tray with the test device thereon is then temporarily stored in a tray storing means in the unloader section. Thereafter, the customer tray is conveyed to the loader section where the test device is transferred from the customer tray to the test tray. Then, the test tray with the test device thereon is conveyed from the loader section back to the test section. These procedures are repeated until all of the sockets in the test section are automatically checked for their contact characteristics.
    • PCT No.PCT / JP95 / 01751 Sec。 371日期:1996年7月1日 102(e)日期1996年7月1日PCT提交1995年9月4日PCT公布。 第WO96 / 09556号公报 日期1996年3月28日在测试半导体器件被测试之前,自动测试系统和方法,用于以自动高效的方式检测IC处理器的测试区域中设置的IC测试器的每个插座的接触针的接触特性。 被提供。 提供了与被测试的半导体器件的形状相同的测试装置及其电气特性已知的测试装置,并且被携带在测试托盘上并从装载器部分传送到测试装置与测试装置接触的测试区域 一个插座来测量插座的接触特性。 测量完成后,将测试装置从测试盘传送到客户托盘,然后将其上具有测试装置的顾客托盘临时存储在卸载机部分中的托盘存放装置中。 此后,客户托盘被传送到装载部分,其中测试装置从顾客托盘传送到测试托盘。 然后,其上具有测试装置的测试托盘从装载器部分返回到测试部分。 重复这些步骤,直到测试部分的所有插座自动检查其接触特性。