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    • 1. 发明授权
    • Method of manufacturing schottky barrier gate type fet
    • 制造肖特基势垒栅型的方法
    • US5405792A
    • 1995-04-11
    • US941151
    • 1992-09-04
    • Takeshi NogamiHiroshi Iwasaki
    • Takeshi NogamiHiroshi Iwasaki
    • H01L21/266H01L21/338H01L21/306H01L21/44
    • H01L29/66878H01L21/266Y10S148/14
    • The method of manufacturing the SB FET according to the present invention includes a first step of forming a refractory metal film on a semiconductor substrate, a second step of forming a first ion-implanted region within the semiconductor substrate, by an ion implantation process, a third step, independent of the second step, of forming second and third ion implantation regions in the semiconductor substrate by an ion implantation process during which impurity ions pass through the first film, with the second and third ion implantation regions being adjacent to the first ion implanted region. A fourth step of forming a channel region, source region and drain region by annealing to activate said first, second, and third ion implanted regions using the first film as a protective film, and bringing the first film in Schottky contact with the channel region, a fifth step of forming a Schottky gate electrode in Schottky contact with the channel region by patterning the first film after the channel, source and drain regions have been formed, with the first film being selectively maintained to prevent exposure of the channel region underlying the Schottky gate electrode, and a sixth step of forming a second film made of a refractory metal or a refractory metal compound on the first film forming a portion of said Schottky gate electrode.
    • 根据本发明的制造SB FET的方法包括在半导体衬底上形成难熔金属膜的第一步骤,通过离子注入工艺在半导体衬底内形成第一离子注入区域的第二步骤, 第三步,独立于第二步骤,通过离子注入工艺在半导体衬底中形成第二和第三离子注入区,在该过程中,杂质离子通过第一膜,第二和第三离子注入区与第一离子相邻 植入区域。 通过退火形成沟道区域,源极区域和漏极区域的第四步骤,以使用第一膜膜作为保护膜来激活所述第一,第二和第三离子注入区域,并使第一膜片与沟道区域肖特基接触, 通过在沟道,源极和漏极区域形成之后对第一膜进行构图而形成肖特基接触的肖特基栅电极的第五步骤,其中第一膜被选择性地保持以防止肖特基下方的沟道区域的暴露 栅电极,以及在形成所述肖特基栅电极的一部分的第一膜上形成由难熔金属或难熔金属化合物制成的第二膜的第六步骤。
    • 2. 发明授权
    • Method of manufacturing Schottky barrier gate FET
    • 制造肖特基势垒栅极的方法
    • US5187111A
    • 1993-02-16
    • US688711
    • 1991-04-23
    • Takeshi NogamiHiroshi Iwasaki
    • Takeshi NogamiHiroshi Iwasaki
    • H01L21/266H01L21/338
    • H01L29/66878H01L21/266Y10S148/14
    • The method of manufacturing the SB FET according to the present invention includes a first step of forming a first WN metal film on a GaAs substrate, a second step of forming a first ion-implanted region within the GaAs substrate, by ion implantation of n-type impurities, a third step of forming a second Mo metal film, a fourth step of forming second and third ion-implanted regions adjacent to said first ion-implanted region, within the GaAs substrate, and a fifth step of activating said first, second, and third ion-implanted regions. In the ion implantation of the second step, impurity ions are implanted into the GaAs substrate, through the first metal film. In the fifth step, the first metal film serves as a protective film during the activation of the first, second, and third ion-implanted regions.
    • 根据本发明的制造SB FET的方法包括在GaAs衬底上形成第一WN金属膜的第一步骤,通过n型离子注入形成GaAs衬底内的第一离子注入区域的第二步骤, 形成第二Mo金属膜的第三步骤,在GaAs衬底内形成与所述第一离子注入区域相邻的第二和第三离子注入区域的第四步骤,以及第五步骤,激活所述第一,第二 ,和第三离子注入区域。 在第二步的离子注入中,通过第一金属膜将杂质离子注入到GaAs衬底中。 在第五步骤中,第一金属膜在第一,第二和第三离子注入区域的激活期间用作保护膜。
    • 9. 发明授权
    • Article moving apparatus and direction changing apparatus for sticks
    • 物品移动装置和方向改变装置
    • US07025194B2
    • 2006-04-11
    • US10652490
    • 2003-09-02
    • Tadashi TakigawaHiroshi Iwasaki
    • Tadashi TakigawaHiroshi Iwasaki
    • B65G47/24
    • B65G47/90B65G47/252
    • A motor has its rotating shaft fixed by a fixing member so as to be inclined at an angle of θ to the horizontal direction. A supporting member is attached to the rotating shaft of the motor. A plurality of accommodating units are distributed at equal spacing along the circumference, centered on the rotating shaft of the motor, of the supporting member. A pair of peripheral surface members in each of the accommodating units is attached to the fixing member so as to be capable of freely opening and closing by a supporting shaft, and has an approximately square columnar shape in its closed state. An opening at one end of the pair of peripheral surface members having the approximately square columnar shape is opened, and a bottom surface member is arranged on an opening at the other end thereof. Each of the accommodating units is attached to the supporting member such that the supporting shaft is inclined at an angle of α to the rotating shaft of the motor.
    • 电动机的旋转轴由固定部件固定,以与水平方向成θ角倾斜。 支撑构件附接到电动机的旋转轴。 多个容纳单元沿着圆周以相等的间隔分布在中心于电动机的旋转轴的支撑构件上。 每个容纳单元中的一对周边表面构件被附接到固定构件,以便能够由支撑轴自由地打开和关闭,并且在其闭合状态下具有大致正方形的柱状形状。 打开具有大致正方形柱状的一对外周面构件的一端的开口,在其另一端的开口部配置有底面构件。 每个容纳单元附接到支撑构件,使得支撑轴以与电动机的旋转轴成α角的方式倾斜。
    • 10. 发明申请
    • Storage apparatus, card type string apparatus, and electronic apparatus
    • 存储装置,卡式串装置和电子装置
    • US20050167809A1
    • 2005-08-04
    • US11091773
    • 2005-03-29
    • Hiroshi Iwasaki
    • Hiroshi Iwasaki
    • H01L23/31H01L23/498H01L21/48H01L29/73
    • G06K19/07739G06K19/07743H01L23/3121H01L23/49855H01L24/48H01L2224/05599H01L2224/48091H01L2224/48227H01L2224/4847H01L2224/48472H01L2224/73265H01L2224/85399H01L2924/00014H01L2924/01079H01L2924/15153H01L2924/15165H01L2924/181H01L2924/00H01L2924/00012H01L2224/45015H01L2924/207H01L2224/45099
    • A storage apparatus 10 is disclosed, that comprises a wiring substrate 11 having a first surface and a second surface, a flat type external connection terminal 12a disposed on the first surface of the wiring substrate 11, a semiconductor device 14 disposed on the second surface of the wiring substrate 11 and having a connection terminal 14a connected to the flat type external connection terminal 12a, a molding resin 15 for coating the semiconductor device 14 on the second surface of the wiring substrate 11, a card type supporting frame 10a having a concave portion or a hole portion fitting the wiring substrate 11, the semiconductor device 14, and the molding resin 15 in such a manner that the flat type external connection terminal 12a is exposed to the first surface of the wiring substrate 11, and adhesive resin a adhering integrally the flat type external connection terminal 12a, the wiring substrate 11, the semiconductor device 14, the molding resin 15, and the card type supporting frame 10a. In addition, the storage apparatus 10 can be combined with a card type supporting means 21 that supports detachably with the flat type external connection terminal 12a exposed to one of the surfaces so as to be used as a card type storage apparatus 20 having bigger size.
    • 公开了一种存储装置10,其包括具有第一表面和第二表面的布线基板11,布置在布线基板11的第一表面上的平面型外部连接端子12a,设置在第二表面上的半导体装置14 的布线基板11,并且具有连接到扁平型外部连接端子12a的连接端子14a,用于在布线基板11的第二表面上涂覆半导体器件14的模制树脂15,卡式支撑框架10a 具有将布线基板11,半导体装置14和成型树脂15嵌合的凹部或孔部,使得平面型外部连接端子12a暴露于布线基板11的第一面,并且 平面型外部连接端子12a,布线基板11,半导体器件14,成型树脂15和卡片型号 e支撑框架10a。 此外,存储装置10可以与能够与露出到其中一个表面的平面型外部连接端子12a可拆卸地支撑的卡式支撑装置21组合,以用作具有较大尺寸的卡式存储装置20 。