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1. 发明授权

US06878441B2 Pressure sensitive adhesive sheet 有权
标题翻译：压敏胶片
公开(公告)号：US06878441B2
公开(公告)日：2005-04-12
申请号：US10342838
申请日：2003-01-15
申请人： Takeshi Kondo , Kazuhiro Takahashi , Yoshihisa Mineura
发明人： Takeshi Kondo , Kazuhiro Takahashi , Yoshihisa Mineura
IPC分类号： B32B27/36 , C09J7/02 , B32B7/12
CPC分类号： H01L21/6836 , B32B27/36 , C09J7/29 , C09J2201/162 , C09J2203/31 , C09J2203/326 , C09J2433/00 , C09J2433/006 , C09J2475/006 , H01L2221/68327 , Y10T428/28 , Y10T428/2848 , Y10T428/2852 , Y10T428/2861
摘要： A pressure sensitive adhesive sheet comprising a substrate, an intermediate layer superimposed thereon and a pressure sensitive adhesive layer superimposed on the intermediate layer, characterized in that the pressure sensitive adhesive layer exhibiting an elastic modulus at 23° C. ranging from 5.0×104 to 1.0×107 Pa, the intermediate layer exhibiting an elastic modulus at 23° C. which is not greater than the elastic modulus at 23° C. of the pressure sensitive adhesive layer, or the intermediate layer exhibiting an elastic modulus at 40° C. of less than 1.0×106 Pa. At the time of working of the back of an adherend having a surface whose unevenness height differences are large, this pressure sensitive adhesive sheet is preferably stuck to the adherend surface to thereby protect it during the working and to enable performing the grinding at a uniform thickness without the occurrence of dimples.
摘要翻译：一种压敏粘合剂片，其包含基材，叠加在其上的中间层和叠加在所述中间层上的压敏粘合剂层，其特征在于，在23℃下的弹性模量为5.0×10 4，至1.0×10 7 Pa，中间层在23℃下表现出弹性模量，其不大于压敏粘合剂层的23℃下的弹性模量或在40℃下显示弹性模量的中间层 ℃小于1.0×10 6 Pa。在具有不平坦度高差大的表面的被粘物的背面加工时，该压敏粘合片优选粘贴到被粘物表面上，从而在加工过程中保护其，并且能够以均匀的厚度进行研磨没有发生凹坑。

2. 发明授权

US06793762B1 Method of using a pressure sensitive adhesive sheet 有权
标题翻译：使用压敏粘合片的方法
公开(公告)号：US06793762B1
公开(公告)日：2004-09-21
申请号：US09322333
申请日：1999-05-28
申请人： Takeshi Kondo , Kazuhiro Takahashi , Yoshihisa Mineura
发明人： Takeshi Kondo , Kazuhiro Takahashi , Yoshihisa Mineura
IPC分类号： C09J702
CPC分类号： H01L21/6836 , C09J7/22 , C09J2203/326 , H01L2221/68327 , Y10T156/1089 , Y10T428/14 , Y10T428/28
摘要： The invention is concerned with a pressure sensitive adhesive sheet comprising a substrate and, superimposed thereon, a pressure sensitive adhesive layer, said substrate exhibiting a maximum value of dynamic viscoelasticity tan &dgr; of at least 0.5 at a temperature ranging from −5 to 80° C. At the time of working of the back of an adherend having a surface whose irregular height differences are large, this pressure sensitive adhesive sheet is preferably stuck to the adherend surface to thereby protect it during the working.
摘要翻译：本发明涉及一种压敏粘合片，其包含基底并且叠加在其上的压敏粘合剂层，所述基底在-5至80℃的温度下表现出至少为0.5的动态粘弹性tanδ的最大值在具有不规则高度差大的表面的被粘物的背面加工时，优选将粘合片粘贴到被粘物表面，从而在加工过程中保护其。

3. 发明授权

US06524701B1 Pressure sensitive adhesive sheet and method of use thereof 有权
标题翻译：压敏胶片
公开(公告)号：US06524701B1
公开(公告)日：2003-02-25
申请号：US09443569
申请日：1999-11-19
申请人： Takeshi Kondo , Kazuhiro Takahashi , Yoshihisa Mineura
发明人： Takeshi Kondo , Kazuhiro Takahashi , Yoshihisa Mineura
IPC分类号： B32B712
CPC分类号： H01L21/6836 , B32B27/36 , C09J7/29 , C09J2201/162 , C09J2203/31 , C09J2203/326 , C09J2433/00 , C09J2433/006 , C09J2475/006 , H01L2221/68327 , Y10T428/28 , Y10T428/2848 , Y10T428/2852 , Y10T428/2861
摘要： A pressure sensitive adhesive sheet comprising a substrate, an intermediate layer superimposed thereon and a pressure sensitive adhesive layer superimposed on the intermediate layer, characterized in that the pressure sensitive adhesive layer exhibiting an elastic modulus at 23° C. ranging from 5.0×104 to 1.0×107 Pa, the intermediate layer exhibiting an elastic modulus at 23° C. which is not greater than the elastic modulus at 23° C. of the pressure sensitive adhesive layer, or the intermediate layer exhibiting an elastic modulus at 40° C. of less than 1.0×106 Pa. At the time of working of the back of an adherend having a surface whose unevenness height differences are large, this pressure sensitive adhesive sheet is preferably stuck to the adherend surface to thereby protect it during the working. In particular, when the adherend is to be ground to an extremely small thickness, the pressure sensitive adhesive sheet enables performing the grinding at a uniform thickness without the occurrence of dimples.
摘要翻译：一种压敏粘合剂层，包括基材，叠加在其上的中间层和叠加在中间层上的压敏粘合剂层，其特征在于，在23℃下的弹性模量为5.0×10 4至1.0×10 7 Pa的压敏粘合剂层中间层在23℃下表现出弹性模量，其不大于压敏粘合剂层的23℃下的弹性模量或在40℃下显示小于1.0×10 6的弹性模量的中间层 Pa。在具有不平坦度高差大的表面的被粘物的背面加工时，该压敏粘合片优选粘贴在被粘物表面上，从而在加工过程中保护它。特别是，当被粘物被研磨成非常小的厚度时，压敏粘合片能够以均匀的厚度进行研磨，而不会发生凹痕。

4. 发明授权

US07105226B2 Pressure sensitive adhesive double coated sheet and method of use thereof 有权
标题翻译：压敏粘合剂双面涂布片及其使用方法
公开(公告)号：US07105226B2
公开(公告)日：2006-09-12
申请号：US10140355
申请日：2002-05-06
申请人： Hayato Noguchi , Yoshihisa Mineura , Kazuyosi Ebe , Katsuhiko Horigome
发明人： Hayato Noguchi , Yoshihisa Mineura , Kazuyosi Ebe , Katsuhiko Horigome
IPC分类号： C09J7/02
CPC分类号： B24B37/345 , B24B7/228 , B24B37/30 , B24B41/068 , C09J7/22 , C09J7/38 , C09J2201/128 , C09J2433/00 , H01L21/67132 , H01L21/6835 , H01L21/6836 , H01L2221/68327 , H01L2221/6834 , Y10T156/11 , Y10T428/28 , Y10T428/2809 , Y10T428/2848 , Y10T428/2891
摘要： Disclosed herein is a pressure sensitive adhesive double coated sheet comprising a shrink substrate and, superimposed on one side thereof, an energy radiation curable pressure sensitive adhesive layer and, superimposed on the other side thereof, a removable pressure sensitive adhesive layer composed of an adhesive having a modulus of elasticity at 120° C. of 5×105 Pa or less.The pressure sensitive adhesive double coated sheet according to the invention enables efficiently processing a work piece with high precision. In particular the pressure sensitive adhesive double coated sheet is suitable to a process capable of producing IC chips of high thickness precision with high yield by reducing warp and minimizing carrying breakage in the grinding of extremely thin or large diameter silicon wafers and capable of performing back grinding and dicing in the same configuration. Further, the invention provides a process of producing semiconductors of high reliability in which the above pressure sensitive adhesive double coated sheet is used.
摘要翻译：本发明公开了一种压敏粘合剂双重涂布片，其包括收缩基片，并且在其一侧叠加能量辐射固化压敏粘合剂层，并且在其另一侧上叠加由可粘合剂组成的可去除的压敏粘合剂层，在120℃下的弹性模量为5×10 5 Pa以下。根据本发明的压敏双面涂布片能够高精度地高效地加工工件。特别地，压敏粘合剂双面涂布片适用于能够通过减少经纱并且最小化在极薄或大直径硅晶片的研磨中的携带断裂并且能够进行背面磨削而以高产率制造高密度IC芯片的方法并以相同的配置进行切割。此外，本发明提供了使用上述压敏粘合剂双面涂布片材的可靠性高的半导体的制造方法。

5. 发明授权

US06235366B1 Adhesive sheet 有权
标题翻译：粘合片
公开(公告)号：US06235366B1
公开(公告)日：2001-05-22
申请号：US09234828
申请日：1999-01-21
申请人： Masatoshi Matsumoto , Mitsugu Koike , Hitoshi Maruhashi , Yoshihisa Mineura
发明人： Masatoshi Matsumoto , Mitsugu Koike , Hitoshi Maruhashi , Yoshihisa Mineura
IPC分类号： B32B304
CPC分类号： H01L21/6836 , H01L2221/68327 , Y10T428/1481 , Y10T428/1486 , Y10T428/24215 , Y10T428/2848
摘要： An adhesive sheet used for semiconductor wafer processing; with the adhesive sheet consisting of a release liner, an adhesive layer and a base film which are laminated in order of description, having a great length and being folded zigzag into equal sections so that one section is superposed exactly upon another.
摘要翻译：用于半导体晶片加工的粘合片; 其中粘合片由释放衬垫，粘合剂层和基底膜组成，它们按照描述的顺序层叠，具有很长的长度并且被折弯成相等的部分，使得一个部分精确地重叠在另一个部分上。

6. 发明授权

US5955512A Pressure sensitive adhesive composition and sheet having layer thereof 失效
标题翻译：压敏粘合剂组合物和具有层的片材
公开(公告)号：US5955512A
公开(公告)日：1999-09-21
申请号：US847560
申请日：1997-04-24
申请人： Hideki Numazawa , Yoshihisa Mineura
发明人： Hideki Numazawa , Yoshihisa Mineura
IPC分类号： C09J7/02 , C09J4/00 , C09J4/02 , C09J175/16 , C08G18/62
CPC分类号： C09J175/16 , C08G2170/40 , Y10T428/28 , Y10T428/2809 , Y10T428/2878 , Y10T428/2896
摘要： A pressure sensitive adhesive composition is disclosed which comprises an acrylic copolymer (A), an energy beam polymerizable urethane acrylate oligomer (B) and an energy beam polymerizable compound having one acryloyl group or methacryloyl group in each molecule thereof (C). This composition is preferred to further contain a plasticizer (D), a crosslinking agent (E) and/or a photopolymerization initiator (F) according to necessity. The pressure sensitive adhesive composition has satisfactory pressure sensitive adherence and initial adhesion before the irradiation with energy beam and the adhesive strength thereof is sharply reduced with maintaining the rubber elasticity after the irradiation with energy beam. Further, the pressure sensitive adhesive composition ensures excellent chip alignability in the expanding step subsequent to dicing. The pressure sensitive adhesive composition provides a pressure sensitive adhesive sheet, especially, a wafer processing pressure sensitive adhesive sheet or a surface protective pressure sensitive adhesive sheet.
摘要翻译：公开了一种压敏粘合剂组合物，其包含丙烯酸共聚物（A），能量束聚合性氨基甲酸酯丙烯酸酯低聚物（B）和在其各分子中具有一个丙烯酰基或甲基丙烯酰基的能量束聚合性化合物（C）。该组合物优选根据需要进一步含有增塑剂（D），交联剂（E）和/或光聚合引发剂（F）。压敏粘合剂组合物在能量束照射之前具有令人满意的压敏粘合性和初始粘合性，并且通过在用能量束照射之后保持橡胶弹性，其粘合强度急剧降低。此外，压敏粘合剂组合物确保在切割之后的扩展步骤中优异的芯片对准性。压敏粘合剂组合物提供压敏粘合片，特别是晶片加工压敏粘合片或表面保护压敏粘合片。

7. 发明授权

US06544371B2 Method of using a transfer tape 失效
标题翻译：使用转印带的方法
公开(公告)号：US06544371B2
公开(公告)日：2003-04-08
申请号：US09881632
申请日：2001-06-14
申请人： Hideo Senoo , Yoshihisa Mineura
发明人： Hideo Senoo , Yoshihisa Mineura
IPC分类号： B44C1165
CPC分类号： H01L24/83 , B32B15/04 , H01L21/6835 , H01L24/27 , H01L24/29 , H01L24/31 , H01L24/743 , H01L24/75 , H01L2221/68359 , H01L2224/2919 , H01L2224/83101 , H01L2224/83192 , H01L2224/83194 , H01L2224/8385 , H01L2924/01004 , H01L2924/01006 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , Y10S428/914 , Y10T428/1476 , Y10T428/1486 , Y10T428/24826 , Y10T428/24843 , Y10T428/2486 , Y10T428/28 , Y10T428/2817 , H01L2924/00
摘要： A method of securing semiconductor chips comprises the steps of: sticking semiconductor chips at their backs to a transfer tape having an adhesive superimposed thereon at spaced intervals; peeling the semiconductor chips from the transfer tape such that the adhesive is transferred onto the backs of the semiconductor chips; and securing the semiconductor chips by way of the adhesive onto a substrate. The method also includes variations such as sticking the transfer tape to a substrate at predetermined sites for securing semiconductor chips and then peeling the base material of the transfer tape to transfer the adhesive to the predetermined sites on the substrate, followed by securing the semiconductor chips thereto.
摘要翻译：一种固定半导体芯片的方法包括以下步骤：将半导体芯片的背面粘贴到具有以间隔间隔叠加的粘合剂的转移带; 从转移带剥离半导体芯片，使得粘合剂转移到半导体芯片的背面上; 以及通过粘合剂将半导体芯片固定到基板上。该方法还包括诸如在预定位置处将转印带粘附到基板以固定半导体芯片，然后剥离转印带的基材以将粘合剂转移到基板上的预定位置，然后将半导体芯片固定到其上的变化。

8. 发明授权

US4841652A Adhesive sheet 失效
标题翻译：粘合片
公开(公告)号：US4841652A
公开(公告)日：1989-06-27
申请号：US18387
申请日：1987-02-25
申请人： Hitoshi Sakashita , Yoshihisa Mineura , Toshihiko Sato
发明人： Hitoshi Sakashita , Yoshihisa Mineura , Toshihiko Sato
IPC分类号： G09F3/02 , G09F3/10
CPC分类号： G09F3/10 , G09F3/02 , G09F3/0292 , G09F2003/0264 , G09F2003/0267 , Y10S428/915
摘要： An adhesive sheet which comprises a support sheet and an adhesive layer containing a migratory substance, disposed on one side of the support sheet. This adhesive sheet may be applied to many types of articles and will leave behind a dye mark on the article indicating that it has been applied and subsequently removed.
摘要翻译：一种粘合片，其包括支撑片和包含迁移物质的粘合剂层，其设置在所述支撑片的一侧上。该粘合片可以应用于许多类型的制品，并且在物品上留下染料标记，表明其已被施加并随后被去除。

9. 发明授权

US06225194B1 Process for producing chip and pressure sensitive adhesive sheet for said process 有权
标题翻译：制造芯片的工艺
公开(公告)号：US06225194B1
公开(公告)日：2001-05-01
申请号：US09354515
申请日：1999-07-15
申请人： Hayato Noguchi , Yoshihisa Mineura , Hideki Numazawa , Kazuyoshi Ebe
发明人： Hayato Noguchi , Yoshihisa Mineura , Hideki Numazawa , Kazuyoshi Ebe
IPC分类号： H01L2146
CPC分类号： B32B7/12 , B32B2310/0831 , B32B2457/00 , H01L21/6836 , H01L24/27 , H01L24/83 , H01L2221/68327 , H01L2224/2919 , H01L2224/8319 , H01L2224/8385 , H01L2924/01006 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01061 , H01L2924/01082 , H01L2924/0132 , H01L2924/0665 , H01L2924/07802 , H01L2924/10329 , Y10T428/28 , Y10T428/2809 , Y10T428/2848 , Y10T428/2852 , Y10T428/2861 , H01L2924/00 , H01L2924/01031
摘要： A process for producing a chip, comprising the steps of: attaching an object to be diced on a pressure sensitive adhesive sheet comprising at least one layer of shrinkable film and a pressure sensitive adhesive layer; dicing the object into chips, and shrinking the shrinkable film to thereby reduce an area in which the chips are in contact with the pressure sensitive adhesive. In this process, chips of small thickness and large area can easily be picked up without the need to use a thrust needle in the chip pickup step.
摘要翻译：一种芯片的制造方法，其特征在于，包括以下步骤：在包含至少一层可收缩膜和压敏粘合剂层的压敏粘合片上粘贴待切割物体;将所述物体切割成芯片，将所述可收缩膜收缩到从而减少芯片与压敏粘合剂接触的面积。在该方法中，可以容易地拾取厚度小，面积大的芯片，而不需要在芯片拾取步骤中使用推力针。

10. 发明授权

US06398892B1 Method of using pressure sensitive adhesive double coated sheet 有权
标题翻译：使用压敏双面涂布纸的方法
公开(公告)号：US06398892B1
公开(公告)日：2002-06-04
申请号：US09382965
申请日：1999-08-25
申请人： Hayato Noguchi , Yoshihisa Mineura , Kazuyoshi Ebe
发明人： Hayato Noguchi , Yoshihisa Mineura , Kazuyoshi Ebe
IPC分类号： B32B3100
CPC分类号： H01L21/6835 , B24B7/228 , B24B41/061 , C09J7/22 , H01L21/67132 , H01L21/6836 , H01L2221/68327 , H01L2221/6834 , Y10T156/1184
摘要： Disclosed herein is a pressure sensitive adhesive double coated sheet comprising a shrink substrate and, superimposed on both sides thereof, pressure sensitive adhesive layers, at least one of the pressure sensitive adhesive layers being composed of an energy radiation curable pressure sensitive adhesive. The pressure sensitive adhesive double coated sheet according to the invention enables efficiently processing a work piece with high precision. In particular the pressure sensitive adhesive double coated sheet is suitable to a process capable of producing IC chips of high thickness precision with high yield by reducing warpage and minimizing carrying breakage in the grinding of extremely thin or large diameter silicon wafers and capable of performing back grinding and dicing in the same configuration. Further, the invention provides a process of producing semiconductors of high reliability in which the above pressure sensitive adhesive double coated sheet is used.
摘要翻译：本发明公开了一种压敏粘合剂双层纸，其包含收缩基材，并且在其两侧叠加有压敏粘合剂层，至少一个压敏粘合剂层由能量辐射固化型压敏粘合剂构成。根据本发明的压敏双面涂布片能够高精度地高效地加工工件。特别地，压敏粘合剂双面涂布片适用于能够通过减少翘曲并且最小化在极薄或大直径硅晶片的研磨中的携带断裂并且能够进行背面磨削而以高产率制造高密度IC芯片的工艺并以相同的配置进行切割。此外，本发明提供了使用上述压敏粘合剂双面涂布片材的可靠性高的半导体的制造方法。

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