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1. 发明授权

US08044500B2 Power module substrate, method for manufacturing power module substrate, and power module 有权
标题翻译：电源模块基板，电源模块基板制造方法及电源模块
公开(公告)号：US08044500B2
公开(公告)日：2011-10-25
申请号：US12446826
申请日：2007-10-26
申请人： Takeshi Kitahara , Hiroya Ishizuka , Yoshirou Kuromitsu , Tomoyuki Watanabe
发明人： Takeshi Kitahara , Hiroya Ishizuka , Yoshirou Kuromitsu , Tomoyuki Watanabe
IPC分类号： H01L23/52 , H01L29/76 , H01L23/06 , H01L23/10 , H01L23/15
CPC分类号： H01L23/3735 , H01L24/29 , H01L24/32 , H01L24/83 , H01L25/072 , H01L2224/291 , H01L2224/32225 , H01L2224/83424 , H05K1/0306 , H05K1/09 , H05K3/0061 , H05K3/202 , H05K3/38 , H05K2201/0355 , H05K2201/068 , H05K2203/0405 , H01L2924/014
摘要： Disclosed is a power module having improved joint reliability. Specifically disclosed is a power module including a power module substrate wherein a circuit layer is brazed on the front surface of a ceramic substrate, a metal layer is brazed on the rear surface of the ceramic substrate and a semiconductor chip is soldered to the circuit layer. The metal layer is composed of an Al alloy having an average purity of not less than 98.0 wt. % but not more than 99.9 wt. % as a whole. In this metal layer, the Fe concentration in the side of a surface brazed with the ceramic substrate is set at less than 0.1 wt. %, and the Fe concentration in the side of a surface opposite to the brazed surface is set at not less than 0.1 wt. %.
摘要翻译：公开了具有改进的接头可靠性的功率模块。具体公开了一种功率模块，其包括功率模块基板，其中电路层钎焊在陶瓷基板的前表面上，金属层钎焊在陶瓷基板的后表面上，半导体芯片焊接到电路层。金属层由平均纯度不小于98.0重量％的Al合金构成。％但不超过99.9wt。作为一个整体。在该金属层中，将与陶瓷基板钎焊的表面侧的Fe浓度设定为小于0.1重量％。％，并且与钎焊表面相反的表面侧的Fe浓度设定为0.1重量％以上。％。

2. 发明申请

US20090267215A1 POWER MODULE SUBSTRATE, METHOD FOR MANUFACTURING POWER MODULE SUBSTRATE, AND POWER MODULE 有权
标题翻译：功率模块基板，制造功率模块基板的方法和功率模块
公开(公告)号：US20090267215A1
公开(公告)日：2009-10-29
申请号：US12446826
申请日：2007-10-26
申请人： Takeshi Kitahara , Hiroya Ishizuka , Yoshirou Kuromitsu , Tomoyuki Watanabe
发明人： Takeshi Kitahara , Hiroya Ishizuka , Yoshirou Kuromitsu , Tomoyuki Watanabe
IPC分类号： H01L23/488 , H01L23/15 , H01L21/60
CPC分类号： H01L23/3735 , H01L24/29 , H01L24/32 , H01L24/83 , H01L25/072 , H01L2224/291 , H01L2224/32225 , H01L2224/83424 , H05K1/0306 , H05K1/09 , H05K3/0061 , H05K3/202 , H05K3/38 , H05K2201/0355 , H05K2201/068 , H05K2203/0405 , H01L2924/014
摘要： Disclosed is a power module having improved joint reliability. Specifically disclosed is a power module including a power module substrate wherein a circuit layer is brazed on the front surface of a ceramic substrate, a metal layer is brazed on the rear surface of the ceramic substrate and a semiconductor chip is soldered to the circuit layer. The metal layer is composed of an Al alloy having an average purity of not less than 98.0 wt. % but not more than 99.9 wt. % as a whole. In this metal layer, the Fe concentration in the side of a surface brazed with the ceramic substrate is set at less than 0.1 wt. %, and the Fe concentration in the side of a surface opposite to the brazed surface is set at not less than 0.1 wt. %.
摘要翻译：公开了具有改进的接头可靠性的功率模块。具体公开了一种功率模块，其包括功率模块基板，其中电路层钎焊在陶瓷基板的前表面上，金属层钎焊在陶瓷基板的后表面上，半导体芯片焊接到电路层。金属层由平均纯度不小于98.0重量％的Al合金构成。％但不超过99.9wt。作为一个整体。在该金属层中，将与陶瓷基板钎焊的表面侧的Fe浓度设定为小于0.1重量％。％，并且与钎焊表面相反的表面侧的Fe浓度设定为0.1重量％以上。％。

3. 发明申请

US20090229864A1 INSULATING CIRCUIT BOARD AND INSULATING CIRCUIT BOARD HAVING COOLING SINK 审中-公开
标题翻译：绝缘电路板和绝缘电路板有冷却水槽
公开(公告)号：US20090229864A1
公开(公告)日：2009-09-17
申请号：US11720658
申请日：2006-09-15
申请人： Yoshirou Kuromitsu , Makoto Toriumi , Yoshiyuki Nagatomo , Hiroya Ishizuka , Youichiro Baba , Tomoyuki Watanabe , Takuya Yasui
发明人： Yoshirou Kuromitsu , Makoto Toriumi , Yoshiyuki Nagatomo , Hiroya Ishizuka , Youichiro Baba , Tomoyuki Watanabe , Takuya Yasui
IPC分类号： H05K7/20 , H05K1/03
CPC分类号： H01L23/3735 , H01L23/473 , H01L2224/29111 , H01L2224/32225 , H05K1/0271 , H05K1/0306 , H05K1/09 , H05K3/0061 , H05K3/341 , H05K3/3463 , H05K2201/0352 , H05K2201/09736
摘要： An insulating circuit board includes an insulating plate, a circuit board joined to a first surface of the insulating plate, and a metal plate joined to a second surface of the insulating plate. The circuit board is formed from an Al alloy having a purity of 99.98% or more or pure Al, and the metal plate is formed from an Al alloy having a purity of 98.00% or more and 99.90% or less. The thickness (a) of the circuit board is 0.2 mm or more and 0.8 mm or less, the thickness (b) of the metal plate is 0.6 mm or more and 1.5 mm or less, and the thicknesses satisfy the expression of a/b≦1. An insulating circuit board having a cooling sink includes cooling sink joined via a second solder layer. The second solder layer contains Sn as its main component, and has a Young's modulus, 35 GPa or more, a 0.2% proof stress of, 30 MPa or more, and a tensile strength of, 40 MPa or more. The cooling sink is formed from, pure Al or an Al alloy.
摘要翻译：绝缘电路板包括绝缘板，连接到绝缘板的第一表面的电路板和连接到绝缘板的第二表面的金属板。电路板由纯度为99.98％以上的Al合金或纯Al形成，金属板由纯度为98.00％以上且99.90％以下的Al合金形成。电路板的厚度（a）为0.2mm以上且0.8mm以下，金属板的厚度（b）为0.6mm以上且1.5mm以下，厚度满足a / b <= 1。具有冷却槽的绝缘电路板包括通过第二焊料层接合的冷却水槽。第二焊料层含有Sn作为其主要成分，杨氏模量为35GPa以上，0.2％屈服应力为30MPa以上，拉伸强度为40MPa以上。冷却槽由纯Al或Al合金形成。

4. 发明授权

US09074088B2 Adhesive resin composition, and laminate using the same 有权
标题翻译：粘合树脂组合物和使用其的层压体
公开(公告)号：US09074088B2
公开(公告)日：2015-07-07
申请号：US12593791
申请日：2008-03-28
申请人： Takeyuki Igarashi , Kaoru Ikeda , Tomoyuki Watanabe
发明人： Takeyuki Igarashi , Kaoru Ikeda , Tomoyuki Watanabe
IPC分类号： B32B27/08 , B32B27/32 , C08L31/00 , C08L51/00 , B29C47/00 , C08F265/00 , C08F265/02 , C08F267/04 , C09J123/02 , C09J123/10 , C09J151/00 , C09J151/06 , B29C47/06 , C08L29/06
CPC分类号： C08L51/003 , B29C47/0021 , B29C47/06 , B32B7/12 , B32B27/08 , B32B27/18 , B32B27/306 , B32B27/32 , B32B27/34 , B32B2270/00 , B32B2307/306 , B32B2307/554 , B32B2307/558 , B32B2307/7244 , B32B2307/7246 , B32B2439/70 , B32B2439/80 , C08F265/00 , C08F265/02 , C08F267/04 , C08L29/06 , C08L2666/02 , C08L2666/04 , C09J123/02 , C09J123/10 , C09J151/003 , C09J151/06 , Y10T428/3192 , Y10T428/31938
摘要： Laminates in which a layer of a polar resin (C) is laminated with a layer of a polyolefin (D) or a recovered resin (E) via a layer of an adhesive resin composition (A), including an ethylene-vinyl alcohol copolymer, the adhesive resin composition (A) is produced by mixing a resin having an unsaturated carboxylic acid anhydride or derivative thereof (a1) with a ring-opening polymer or condensation polymer (a2) having a hydroxyl group or an amino group at both ends or at one end; or partially grafting the (a2) with the (a1).
摘要翻译：通过包含乙烯 - 乙烯醇共聚物的粘合剂树脂组合物（A）层将一层极性树脂（C）与一层聚烯烃（D）或回收树脂（E）层压，粘合树脂组合物（A）通过将具有不饱和羧酸酐或其衍生物（a1）的树脂与两端具有羟基或氨基的开环聚合物或缩聚物（a2）混合而制备，一端; 或用（a1）部分接枝（a2）。

5. 发明授权

US09034860B2 Pharmaceutical composition containing low-substituted hydroxypropyl cellulose 有权
标题翻译：含有低取代羟丙基纤维素的药物组合物
公开(公告)号：US09034860B2
公开(公告)日：2015-05-19
申请号：US12312973
申请日：2007-12-06
申请人： Tomoyuki Watanabe , Kazuko Maeda
发明人： Tomoyuki Watanabe , Kazuko Maeda
IPC分类号： A61K31/4365 , A61P7/02 , A61K9/20
CPC分类号： A61K31/4365 , A61K9/2054
摘要： Disclosed is a pharmaceutical composition containing a compound represented by the general formula (I) below or a pharmacologically acceptable salt thereof, while having improved dissolvability. Specifically disclosed is a pharmaceutical composition containing (A) a compound represented by the general formula (I) below or a pharmacologically acceptable salt thereof, and (B) a low-substituted hydroxypropyl cellulose.
摘要翻译：公开了含有下述通式（I）表示的化合物或其药理学上可接受的盐，同时具有改善的溶解性的药物组合物。具体公开的是含有（A）下述通式（I）表示的化合物或其药理学上可接受的盐和（B）低取代羟丙基纤维素的药物组合物。

6. 发明申请

US20110097527A1 MOLDED ARTICLE AND METHOD FOR PRODUCTION THEREOF 有权
标题翻译：模制品及其生产方法
公开(公告)号：US20110097527A1
公开(公告)日：2011-04-28
申请号：US12297472
申请日：2007-04-17
申请人： Kaoru Ikeda , Masakazu Nakaya , Kazuhiro Kurosaki , Tomoyuki Watanabe
发明人： Kaoru Ikeda , Masakazu Nakaya , Kazuhiro Kurosaki , Tomoyuki Watanabe
IPC分类号： B32B27/30 , C08F2/54 , C08F8/08 , C08F2/48 , C08F2/46
CPC分类号： B29C49/0005 , B29C45/0001 , B29C47/0004 , B29C47/0021 , B29C47/14 , B29C47/6056 , B29C47/6062 , B29C47/6093 , B29C47/767 , B29C49/04 , B29C51/002 , B29C61/003 , B29K2029/04 , B29K2063/00 , B29K2995/0049 , B32B27/306 , B32B2307/736 , B32B2439/00 , B32B2451/00 , B32B2597/00 , B32B2607/02 , C08J3/24 , C08J3/248 , C08J5/18 , C08J2329/02 , C08J2329/04 , C08L29/04 , Y10T428/1379 , Y10T428/31507 , Y10T428/31511
摘要： A shaped article including a modified ethylene-vinyl alcohol copolymer (C), wherein the modified ethylene-vinyl alcohol copolymer (C) is a product obtained by modifying an unmodified ethylene-vinyl alcohol copolymer (A) with an epoxy compound (B) having a double bond and has a degree of modification with the epoxy compound (B) of 0.1 to 10 mol % based on the monomer units of the ethylene-vinyl alcohol copolymer (A), and at least a part of the modified ethylene-vinyl alcohol copolymer (C) is crosslinked, and the gel fraction of the shaped article is 3% by weight or more. Thereby, a shaped article which contains almost no harmful crosslinking agent and which is excellent in hot water resistance, heat resistance and a gas barrier property is provided.
摘要翻译：一种包含改性乙烯 - 乙烯醇共聚物（C）的成型制品，其中改性乙烯 - 乙烯醇共聚物（C）是通过用未改性的乙烯 - 乙烯醇共聚物（A）与环氧化合物（B）双键，并且相对于乙烯 - 乙烯醇共聚物（A）的单体单元，环氧化合物（B）的修饰度为0.1〜10摩尔％，至少一部分改性乙烯 - 乙烯醇共聚物（C）交联，成型制品的凝胶分数为3重量％以上。因此，提供几乎不含有害交联剂并且耐热水性，耐热性和阻气性优异的成型制品。

7. 发明申请

US20100174247A1 EYE DROPS CONTAINER 失效
标题翻译：眼药水容器
公开(公告)号：US20100174247A1
公开(公告)日：2010-07-08
申请号：US12377064
申请日：2007-08-10
申请人： Takahito Kimura , Kazuhide Maeda , Nobuyuki Hanai , Tomoyuki Watanabe
发明人： Takahito Kimura , Kazuhide Maeda , Nobuyuki Hanai , Tomoyuki Watanabe
IPC分类号： A61M35/00
CPC分类号： A61F9/0008 , A61M11/02 , A61M2205/276 , A61M2210/0612 , B65D83/52 , B65D83/565
摘要： An eye drops container including a container body filled with a drug solution along with a pressurized gas and including a valve mechanism discharging a fixed amount of drug solution; a nozzle member coupled with a stem for open operation of the valve mechanism and including a drug solution drop nozzle; an operating member including an operating piece and attached to the container body; a guide member contained in the operating member and guiding the nozzle member in the axial direction; and a ball contained in the guide member. The nozzle member includes an outer flange for suspending a skirt on the lower surface thereof; the guide member includes a ring-like bottom groove into which the forward end of the skirt enters; and the ball falls into the bottom groove in an upright state to block the open operation of the valve mechanism, and falls onto the outer flange in an inverted state to permit the open operation of the valve mechanism.
摘要翻译：眼药水容器，包括充满药液的容器体以及加压气体，并且包括排出固定量的药液的阀机构; 与阀杆联接的喷嘴构件，用于阀机构的打开操作，并且包括药物液滴喷嘴; 操作构件，其包括操作件并附接到所述容器主体; 引导构件，容纳在操作构件中并沿轴向引导喷嘴构件; 以及包含在引导构件中的球。喷嘴构件包括用于将裙部悬挂在其下表面上的外凸缘; 引导构件包括裙部的前端进入的环状底部槽，并且球以直立状态落入底槽中以阻止阀机构的打开操作，并且以倒立状态落到外凸缘上，以允许阀机构的打开操作。

8. 发明申请

US20100119856A1 ADHESIVE RESIN COMPOSITION, AND LAMINATE USING THE SAME 有权
标题翻译：粘合树脂组合物和使用它的层压板
公开(公告)号：US20100119856A1
公开(公告)日：2010-05-13
申请号：US12593791
申请日：2008-03-28
申请人： Takeyuki Igarashi , Kaoru Ikeda , Tomoyuki Watanabe
发明人： Takeyuki Igarashi , Kaoru Ikeda , Tomoyuki Watanabe
IPC分类号： B32B27/08 , C08L31/00 , B32B27/32
CPC分类号： C08L51/003 , B29C47/0021 , B29C47/06 , B32B7/12 , B32B27/08 , B32B27/18 , B32B27/306 , B32B27/32 , B32B27/34 , B32B2270/00 , B32B2307/306 , B32B2307/554 , B32B2307/558 , B32B2307/7244 , B32B2307/7246 , B32B2439/70 , B32B2439/80 , C08F265/00 , C08F265/02 , C08F267/04 , C08L29/06 , C08L2666/02 , C08L2666/04 , C09J123/02 , C09J123/10 , C09J151/003 , C09J151/06 , Y10T428/3192 , Y10T428/31938
摘要： This invention provides an adhesive resin having sufficient adhesion with a polar resin in any applications at normal temperature and applications for boiling and retort processing, a resin composition comprising the adhesive resin, and further a laminate with polyolefin/polar resin including the resin composition as an intermediate layer. An adhesive resin composition (A) for a polar resin is produced by mixing a resin having a carboxylic acid anhydride or derivative thereof component (a1) with a ring-opening polymer or condensation polymer component (a2) having a hydroxyl group or an amino group at both ends or at one end; or graft-reacting the (a2) component with the (a1) component, and wherein an amount of the (a1) component is such that an acid value of the adhesive resin composition (A) is from 0.1 to 50 mg KOH/g with a potassium hydroxide/ethanol solution, and an amount of the (a2) component is such that y/(x+y)*100 is 10 or more, where x is a sum of peak heights of peaks (1713 cm−1, 1780 cm−1) derived from an acid anhydride group and y is a height of a peak (1740 cm−1) derived from an ester group, all peaks determined by infrared ray (IR) absorption spectrum measurement after melt-kneading the adhesive resin composition (A) at 220° C. for 5 minutes and then cooling to room temperature.
摘要翻译：本发明提供了在常温下任何应用中的极性树脂和沸腾和蒸煮处理的应用中具有足够粘合性的粘合剂树脂，包含粘合剂树脂的树脂组合物，还包括具有聚烯烃/极性树脂的层合物，该层压材料包括树脂组合物作为中间层。通过将具有羧酸酐或其衍生物（a1）的树脂与具有羟基或氨基的开环聚合物或缩聚物组分（a2）混合来制备用于极性树脂的粘合剂树脂组合物（A）在两端或一端; 或使（a2）成分与（a1）成分接枝反应，其中（a1）成分的含量使粘合性树脂组合物（A）的酸值为0.1〜50mgKOH / g，氢氧化钾/乙醇溶液，并且（a2）成分的量使得y /（x + y）* 100为10以上，其中x是峰的峰高（1713cm-1,1780 cm-1），y是衍生自酯基的峰（1740cm -1）的高度，所有峰均经熔融捏合粘合树脂组合物后的红外线（IR）吸收光谱测定（A）在220℃下搅拌5分钟，然后冷却至室温。

9. 发明申请

US20100055364A1 OXYGEN ABSORBING COMPOSITION AND CONTAINERS MADE BY USING THE SAME 审中-公开
标题翻译：氧气吸收组合物和使用它的容器
公开(公告)号：US20100055364A1
公开(公告)日：2010-03-04
申请号：US12088698
申请日：2006-09-21
申请人： Masayoshi Yamanaka , Mie Kanehara , Tatsuhiko Hayashibara , Tomoyuki Watanabe , Hideharu Iwasaki
发明人： Masayoshi Yamanaka , Mie Kanehara , Tatsuhiko Hayashibara , Tomoyuki Watanabe , Hideharu Iwasaki
IPC分类号： C09K3/00 , B32B27/06
CPC分类号： C08K5/151 , B01J20/22 , C08K5/098 , C08K2201/008 , C08K2201/012 , Y10T428/1379
摘要： An oxygen absorbing composition of the present invention comprises a compound with a molecular weight of less than 10000 and an oxygen absorption accelerator. The compound includes two or more ring structures that are of at least one type, each of which has an ether bond. The oxygen absorbing composition further may contain a gas barrier resin. A laminate of the present invention comprises a layer formed of an oxygen absorbing composition of the present invention.
摘要翻译：本发明的吸氧组合物包含分子量小于10000的化合物和氧吸收促进剂。该化合物包括至少一种类型的两个或更多个环结构，每个环结构具有醚键。氧吸收组合物还可以含有阻气性树脂。本发明的层压体包含由本发明的氧吸收组合物形成的层。

10. 发明授权

US07608340B2 Oxygen absorption resin composition 有权
标题翻译：吸氧树脂组合物
公开(公告)号：US07608340B2
公开(公告)日：2009-10-27
申请号：US10997867
申请日：2004-11-29
申请人： Yoshihisa Tsuji , Mie Kodani , Tomoyuki Watanabe , Hideharu Iwasaki
发明人： Yoshihisa Tsuji , Mie Kodani , Tomoyuki Watanabe , Hideharu Iwasaki
IPC分类号： B32B27/00
CPC分类号： B32B27/08 , B32B27/32 , B32B27/36 , B32B2307/7244 , C08K3/10 , C08K2201/008 , C08L9/00 , C08L11/00 , C08L15/00 , C08L23/04 , C08L23/06 , C08L29/04 , Y10T428/1352 , Y10T428/31855 , Y10T428/31931 , C08L21/00 , C08L2666/08
摘要： An oxygen absorption resin composition is provided that comprises a thermoplastic resin (A) having carbon-carbon double bonds substantially in its main chain and a transition metal salt (B). If necessary, the composition further comprises a gas barrier resin (C), a compatibilizer (D) and the like. The composition has excellent oxygen absorption properties, and when the composition is employed, generation of odorous substances derived from the decomposition of resins as a result of oxygen absorption can be suppressed.
摘要翻译：提供了一种氧吸收树脂组合物，其包含在其主链中基本上具有碳 - 碳双键的热塑性树脂（A）和过渡金属盐（B）。如果需要，组合物还包含阻气性树脂（C），增容剂（D）等。该组合物具有优异的氧吸收性能，并且当使用组合物时，可以抑制由氧吸收引起的树脂分解产生的气味物质。

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