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1. 发明授权

US08360325B2 Wireless IC device, electronic apparatus, and method for adjusting resonant frequency of wireless IC device 有权
标题翻译：无线IC器件，电子设备及调整无线IC器件谐振频率的方法
公开(公告)号：US08360325B2
公开(公告)日：2013-01-29
申请号：US12861945
申请日：2010-08-24
申请人： Takeshi Kataya , Noboru Kato , Satoshi Ishino , Nobuo Ikemoto , Ikuhei Kimura , Koji Shiroki , Yuya Dokai
发明人： Takeshi Kataya , Noboru Kato , Satoshi Ishino , Nobuo Ikemoto , Ikuhei Kimura , Koji Shiroki , Yuya Dokai
IPC分类号： G06K19/06 , G06K19/00 , H01Q1/38 , H01Q9/28
CPC分类号： H01Q9/40 , H01L2224/16225 , H01L2224/73204 , H01Q1/2225 , H01Q1/38 , H01Q7/00 , H01Q9/285 , H05K1/16 , Y10T29/49016
摘要： A wireless IC device and an electronic apparatus are obtained, which can achieve miniaturization and improve the gain of a radiator plate (electrode) without providing a dedicated antenna. A wireless IC device is provided, in which a loop electrode is provided in a ground electrode provided on a printed wiring circuit board, and in which a wireless IC chip that processes a transmission/reception signal or an electromagnetic coupling module is coupled to the loop electrode. The ground electrode is coupled to the wireless IC chip or the electromagnetic coupling module via the loop electrode, and transmits or receives a high-frequency signal. The ground electrode is formed with a slit for adjusting a resonant frequency thereof.
摘要翻译：获得无线IC器件和电子设备，其可以在不提供专用天线的情况下实现小型化并且提高散热器板（电极）的增益。提供了一种无线IC器件，其中在设置在印刷布线电路板上的接地电极中设置环形电极，并且其中处理发送/接收信号的无线IC芯片或电磁耦合模块耦合到环路电极。接地电极通过环形电极耦合到无线IC芯片或电磁耦合模块，并且发送或接收高频信号。接地电极形成有用于调节其谐振频率的狭缝。

2. 发明授权

US09460376B2 Radio IC device 有权
标题翻译：无线IC设备
公开(公告)号：US09460376B2
公开(公告)日：2016-10-04
申请号：US12688072
申请日：2010-01-15
申请人： Noboru Kato , Satoshi Ishino , Takeshi Kataya , Ikuhei Kimura , Nobuo Ikemoto , Yuya Dokai
发明人： Noboru Kato , Satoshi Ishino , Takeshi Kataya , Ikuhei Kimura , Nobuo Ikemoto , Yuya Dokai
IPC分类号： H01Q1/22 , H01Q1/24 , G06K19/06 , G06K19/077 , H01Q1/36 , H01Q1/38 , H01Q1/42 , H01Q1/44 , H01Q7/00 , H01Q9/16 , H01Q9/30 , H01Q13/10 , H05K1/14 , H05K1/02 , H05K1/16
CPC分类号： G06K19/07749 , G06K19/06187 , G06K19/0723 , G06K19/07756 , G06K19/07773 , G06K19/07779 , G06K19/07783 , G06K19/07784 , G06K19/07786 , H01L23/49838 , H01L23/552 , H01L23/66 , H01L2223/6655 , H01L2223/6677 , H01L2224/16227 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01Q1/36 , H01Q1/38 , H01Q1/42 , H01Q1/44 , H01Q7/00 , H01Q9/16 , H01Q9/30 , H01Q13/10 , H05K1/0216 , H05K1/0237 , H05K1/0239 , H05K1/141 , H05K1/16 , H05K1/181 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10098 , H05K2201/10371 , H05K2201/10522 , H01L2924/00014 , H01L2924/00
摘要： A radio IC device includes an electromagnetic coupling module includes a radio IC chip arranged to process transmitted and received signals and a feed circuit board including an inductance element. The feed circuit board includes an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case or a wiring cable. The shielding case or the wiring cable functions as a radiation plate. The radio IC chip is operated by a signal received by the shielding case or the wiring, and the answer signal from the radio IC chip is radiated from the shielding case or the wiring cable to the outside. A metal component functions as the radiation plate, and the metal component may be a ground electrode disposed on the printed wiring board.
摘要翻译：无线IC器件包括：电磁耦合模块，包括布置成处理发送和接收信号的无线IC芯片和包括电感元件的馈电电路板。馈电电路板包括电磁耦合到馈电电路的外部电极，并且外部电极电连接到屏蔽壳体或布线电缆。屏蔽壳或接线电缆用作辐射板。无线IC芯片由屏蔽壳或布线接收到的信号进行操作，来自无线IC芯片的应答信号从屏蔽壳或布线电缆向外部辐射。金属部件用作辐射板，并且金属部件可以是布置在印刷线路板上的接地电极。

3. 发明授权

US08400307B2 Radio frequency IC device and electronic apparatus 有权
标题翻译：射频IC器件和电子设备
公开(公告)号：US08400307B2
公开(公告)日：2013-03-19
申请号：US12959454
申请日：2010-12-03
申请人： Takeshi Kataya , Noboru Kato , Satoshi Ishino , Nobuo Ikemoto , Ikuhei Kimura , Yuya Dokai
发明人： Takeshi Kataya , Noboru Kato , Satoshi Ishino , Nobuo Ikemoto , Ikuhei Kimura , Yuya Dokai
IPC分类号： G08B13/14 , H04Q5/22 , H01L27/08 , H01Q1/38 , H01Q21/00
CPC分类号： G06K19/07749 , G06K19/0775 , H01L2224/16225 , H01L2224/16227 , H01Q1/2225 , H01Q1/38 , H01Q1/48 , H01Q7/00 , H04Q2213/13095 , H05K1/0239 , H05K1/0243 , H05K1/141 , H05K1/16 , H05K2201/10098
摘要： A radio frequency IC device includes a radio frequency IC chip arranged to process a transmitted/received signal, a printed circuit board on which the radio frequency IC chip is mounted, an electrode arrange on the circuit board, and a loop electrode that is arranged on the circuit board so that the loop electrode is electrically connected to the radio frequency IC chip and is coupled to the electrode by electromagnetic coupling. The electrode is coupled to the radio frequency IC chip via the loop electrode so as to transmit or receive a high-frequency signal. A power supply circuit board including a resonance circuit and/or a matching circuit may be disposed between the radio frequency IC chip and the loop electrode.
摘要翻译：射频IC器件包括布置成处理发送/接收信号的射频IC芯片，安装射频IC芯片的印刷电路板，布置在电路板上的电极和布置在电路板上的环形电极电路板，使得环形电极电连接到射频IC芯片，并通过电磁耦合耦合到电极。电极通过环形电极耦合到射频IC芯片，以便发送或接收高频信号。包括谐振电路和/或匹配电路的电源电路板可以设置在射频IC芯片和环形电极之间。

4. 发明授权

US08413907B2 Wireless IC device and electronic apparatus 有权
标题翻译：无线IC器件和电子设备
公开(公告)号：US08413907B2
公开(公告)日：2013-04-09
申请号：US13468058
申请日：2012-05-10
申请人： Nobuo Ikemoto , Satoshi Ishino , Yuya Dokai , Noboru Kato , Takeshi Kataya , Ikuhei Kimura , Mikiko Tanaka
发明人： Nobuo Ikemoto , Satoshi Ishino , Yuya Dokai , Noboru Kato , Takeshi Kataya , Ikuhei Kimura , Mikiko Tanaka
IPC分类号： G06K19/06
CPC分类号： H01Q1/243 , H01L2224/13139 , H01L2224/13144 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/1531 , H01L2924/19041 , H01L2924/19042 , H01L2924/19105 , H01Q1/38 , H01Q1/40 , H01Q9/28 , H03H7/38 , H03H2007/386 , H05K1/0237 , H05K1/0239 , H05K1/141 , H05K1/165 , H05K2201/10098 , H01L2924/00012
摘要： A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.
摘要翻译：小型化的无线IC器件允许无线IC的简单且低成本的安装，并且消除了由静电引起的对无线IC的损害的可能性，并且配备有无线IC器件的电子设备包括无线处理发送和接收信号的IC芯片，以及包括具有电感元件的谐振电路的馈电电路基板。馈电电极设置在馈电电路基板的表面上，并与谐振电路电磁耦合。馈电电极并且电磁耦合到辐射板并提供给印刷线路板。无线IC芯片由辐射板接收的信号激活，来自无线IC芯片的响应信号从辐射板向外辐射。

5. 发明授权

US08191791B2 Wireless IC device and electronic apparatus 有权
标题翻译：无线IC器件和电子设备
公开(公告)号：US08191791B2
公开(公告)日：2012-06-05
申请号：US13022695
申请日：2011-02-08
申请人： Nobuo Ikemoto , Satoshi Ishino , Yuya Dokai , Noboru Kato , Takeshi Kataya , Ikuhei Kimura , Mikiko Tanaka
发明人： Nobuo Ikemoto , Satoshi Ishino , Yuya Dokai , Noboru Kato , Takeshi Kataya , Ikuhei Kimura , Mikiko Tanaka
IPC分类号： G06K19/06
CPC分类号： H01Q1/243 , H01L2224/13139 , H01L2224/13144 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/1531 , H01L2924/19041 , H01L2924/19042 , H01L2924/19105 , H01Q1/38 , H01Q1/40 , H01Q9/28 , H03H7/38 , H03H2007/386 , H05K1/0237 , H05K1/0239 , H05K1/141 , H05K1/165 , H05K2201/10098 , H01L2924/00012
摘要： A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.
摘要翻译：小型化的无线IC器件允许无线IC的简单且低成本的安装，并且消除了由静电引起的对无线IC的损害的可能性，并且配备有无线IC器件的电子设备包括无线处理发送和接收信号的IC芯片，以及包括具有电感元件的谐振电路的馈电电路基板。馈电电极设置在馈电电路基板的表面上，并与谐振电路电磁耦合。馈电电极并且电磁耦合到辐射板并提供给印刷线路板。无线IC芯片由辐射板接收的信号激活，来自无线IC芯片的响应信号从辐射板向外辐射。

6. 发明授权

US07997501B2 Wireless IC device and electronic apparatus 有权
标题翻译：无线IC器件和电子设备
公开(公告)号：US07997501B2
公开(公告)日：2011-08-16
申请号：US12503188
申请日：2009-07-15
申请人： Nobuo Ikemoto , Satoshi Ishino , Yuya Dokai , Noboru Kato , Takeshi Kataya , Ikuhei Kimura , Mikiko Tanaka
发明人： Nobuo Ikemoto , Satoshi Ishino , Yuya Dokai , Noboru Kato , Takeshi Kataya , Ikuhei Kimura , Mikiko Tanaka
IPC分类号： G06K19/06
CPC分类号： H01Q1/243 , H01L2224/13139 , H01L2224/13144 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/1531 , H01L2924/19041 , H01L2924/19042 , H01L2924/19105 , H01Q1/38 , H01Q1/40 , H01Q9/28 , H03H7/38 , H03H2007/386 , H05K1/0237 , H05K1/0239 , H05K1/141 , H05K1/165 , H05K2201/10098 , H01L2924/00012
摘要： A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.
摘要翻译：小型化的无线IC器件允许无线IC的简单且低成本的安装，并且消除了由静电引起的对无线IC的损害的可能性，并且配备有无线IC器件的电子设备包括无线处理发送和接收信号的IC芯片，以及包括具有电感元件的谐振电路的馈电电路基板。馈电电极设置在馈电电路基板的表面上，并与谐振电路电磁耦合。馈电电极并且电磁耦合到辐射板并提供给印刷线路板。无线IC芯片由辐射板接收的信号激活，来自无线IC芯片的响应信号从辐射板向外辐射。

7. 发明授权

US07905421B2 Wireless IC device and electronic apparatus 有权
公开(公告)号：US07905421B2
公开(公告)日：2011-03-15
申请号：US12503188
申请日：2009-07-15
申请人： Nobuo Ikemoto , Satoshi Ishino , Yuya Dokai , Noboru Kato , Takeshi Kataya , Ikuhei Kimura , Mikiko Tanaka
发明人： Nobuo Ikemoto , Satoshi Ishino , Yuya Dokai , Noboru Kato , Takeshi Kataya , Ikuhei Kimura , Mikiko Tanaka
IPC分类号： G06K19/06
摘要： A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.

8. 发明授权

US07830311B2 Wireless IC device and electronic device 有权
标题翻译：无线IC器件和电子设备
公开(公告)号：US07830311B2
公开(公告)日：2010-11-09
申请号：US11851661
申请日：2007-09-07
申请人： Takeshi Kataya , Noboru Kato , Satoshi Ishino , Nobuo Ikemoto , Ikuhei Kimura
发明人： Takeshi Kataya , Noboru Kato , Satoshi Ishino , Nobuo Ikemoto , Ikuhei Kimura
IPC分类号： H01Q1/38
CPC分类号： H01Q7/00 , G06K19/07749 , G06K19/0775 , H01L2224/16225 , H01L2224/16227 , H01Q1/2225 , H01Q1/38 , H05K1/0239 , H05K1/0243 , H05K1/141 , H05K1/16 , H05K2201/10098
摘要： A wireless IC device includes a wireless IC chip for processing a transmission/reception signal, a printed wiring circuit board on which the wireless IC chip is mounted, a ground electrode disposed on the circuit board, and a substantially loop-shaped electrode that is electrically conducted to the wireless IC chip and disposed on the circuit board so as to be coupled to the ground electrode by an electromagnetic field. The ground electrode is coupled to the wireless IC chip via the substantially loop-shaped electrode to transmit/receive a radio frequency signal. A feeder circuit board including a resonant circuit and/or a matching circuit may be interposed between the wireless IC chip and the substantially loop-shaped electrode.
摘要翻译：无线IC器件包括用于处理发送/接收信号的无线IC芯片，安装无线IC芯片的印刷布线电路板，布置在电路板上的接地电极和电气基本上环形的电极传导到无线IC芯片并且设置在电路板上，以便通过电磁场耦合到接地电极。接地电极通过大致环形的电极耦合到无线IC芯片，以发射/接收射频信号。包括谐振电路和/或匹配电路的馈电电路板可以插在无线IC芯片和基本上环形的电极之间。

9. 发明授权

US6104255A Voltage controlled oscillator with a resonator common to a resonance circuit and an oscillation circuit and a capacitor 有权
标题翻译：具有谐振电路和振荡电路以及电容器共用的谐振器的压控振荡器
公开(公告)号：US6104255A
公开(公告)日：2000-08-15
申请号：US131667
申请日：1998-08-10
申请人： Shinji Goma , Takeshi Kataya
发明人： Shinji Goma , Takeshi Kataya
IPC分类号： H03B5/18
CPC分类号： H03B5/1847
摘要： A voltage controlled oscillation circuit includes a resonance circuit and an oscillation circuit. The oscillation circuit includes a capacitor, a variable capacitance diode, and a resonator composed of a strip line one end of which is grounded. The oscillation circuit includes an oscillation transistor, bias resistors, and, a Colpitts capacitor, a harmonic bypass capacitor, and a chip capacitor, one end of which is connected in series with a resistor and the other end of which is grounded. A node between the bias resistor and the chip capacitor connects the resonator composed of a strip line provided within the resonance circuit via a connection line, whereby the emitter of the oscillation transistor provided within the resonance circuit is grounded via the bias resistor and the resonator. In addition, a parallel resonance circuit is composed of the resonator and the chip capacitor.
摘要翻译：压控振荡电路包括谐振电路和振荡电路。振荡电路包括电容器，可变电容二极管和由带状线一端接地的谐振器。振荡电路包括振荡晶体管，偏置电阻器，Colpitts电容器，谐波旁路电容器和芯片电容器，其一端与电阻器串联连接，另一端接地。偏置电阻与片式电容器之间的节点通过连接线将由谐振电路内设置的带状线组成的谐振器连接起来，由此设置在谐振电路内的振荡晶体管的发射极通过偏置电阻和谐振器接地。此外，并联谐振电路由谐振器和片式电容器组成。

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