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    • 1. 发明授权
    • Pattern creation method, mask manufacturing method and semiconductor device manufacturing method
    • 图案形成方法,掩模制造方法和半导体器件制造方法
    • US07669172B2
    • 2010-02-23
    • US12050764
    • 2008-03-18
    • Takeshi ItoSatoshi TanakaToshiya KotaniTadahito FujisawaKoji Hashimoto
    • Takeshi ItoSatoshi TanakaToshiya KotaniTadahito FujisawaKoji Hashimoto
    • G06F17/50
    • G03F1/00
    • A pattern creation method, including laying out data of a most extreme end pattern of integrated circuit patterns on a first layer and laying out data of the integrated circuit patterns excluding the most extreme end pattern on a second layer, extracting data of a first most proximate pattern being most proximate to the most extreme end pattern from the second layer and converting the extracted data to a third layer, generating data of a contacting pattern which contacts both the first most proximate pattern and the most extreme end pattern in a fourth layer, generating data of a non-overlapping pattern of the contacting pattern excluding overlapping portions with the most extreme end pattern and the first most proximate pattern in a fifth layer, extracting data of a second most proximate pattern being most proximate to the non-overlapping pattern and converting the extracted data to the first layer.
    • 一种图案创建方法,包括在第一层上布置集成电路图案的最极端格式的数据,并且在第二层上布置不包括最末端图案的集成电路图案的数据,提取第一最接近的数据 图案最接近于来自第二层的最末端图案,并将所提取的数据转换为第三层,产生在第四层中接触第一最近图案和最末端图案的接触图案的数据,产生 接触图案的非重叠图案的数据,不包括在第五层中具有最末端图案和最前端图案和第一最近图案的重叠部分,提取最接近图案的第二最接近图案的数据,其最接近非重叠图案并且转换 提取的数据到第一层。
    • 2. 发明申请
    • PATTERN CREATION METHOD, MASK MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
    • 图形创建方法,掩模制造方法和半导体器件制造方法
    • US20080235650A1
    • 2008-09-25
    • US12050764
    • 2008-03-18
    • Takeshi ItoSatoshi TanakaToshiya KotaniTadahito FujisawaKoji Hashimoto
    • Takeshi ItoSatoshi TanakaToshiya KotaniTadahito FujisawaKoji Hashimoto
    • G06F17/50
    • G03F1/00
    • A pattern creation method, including laying out data of a most extreme end pattern of integrated circuit patterns on a first layer and laying out data of the integrated circuit patterns excluding the most extreme end pattern on a second layer, extracting data of a first most proximate pattern being most proximate to the most extreme end pattern from the second layer and converting the extracted data to a third layer, generating data of a contacting pattern which contacts both the first most proximate pattern and the most extreme end pattern in a fourth layer, generating data of a non-overlapping pattern of the contacting pattern excluding overlapping portions with the most extreme end pattern and the first most proximate pattern in a fifth layer, extracting data of a second most proximate pattern being most proximate to the non-overlapping pattern and converting the extracted data to the first layer.
    • 一种图案创建方法,包括在第一层上布置集成电路图案的最极端格式的数据,并且在第二层上布置不包括最末端图案的集成电路图案的数据,提取第一最接近的数据 图案最接近于来自第二层的最末端图案,并将所提取的数据转换为第三层,产生在第四层中接触第一最近图案和最末端图案的接触图案的数据,产生 接触图案的非重叠图案的数据,不包括在第五层中具有最末端图案和最前端图案和第一最近图案的重叠部分,提取最接近图案的第二最接近图案的数据,其最接近非重叠图案并且转换 提取的数据到第一层。
    • 3. 发明申请
    • Method for forming pattern and method for manufacturing semiconductor device
    • 形成图案的方法和制造半导体器件的方法
    • US20050123858A1
    • 2005-06-09
    • US10969174
    • 2004-10-21
    • Takeshi ItoKoji HashimotoTadahito Fujisawa
    • Takeshi ItoKoji HashimotoTadahito Fujisawa
    • G03F7/00G03F7/20G03F7/40H01L21/027H01L21/28
    • G03F7/40G03F7/0035
    • A method for forming a pattern having holes arrayed with spacing less than resolution of exposure tool, includes forming first resist pattern including first resist openings having width and spacing equal to or greater than the resolution, in first resist film coated on underlying film. First shrank pattern including first holes having dimension equal to or less than the resolution in the underlying film is formed by first shrink process to the first resist pattern. Second resist pattern including second resist openings arrayed between the first holes having width equal to or greater than the resolution, is formed in second resist film coated on the underlying film. Second shrank pattern including second holes having dimension equal to or less than the resolution in the underlying film is formed by second shrink process to the second resist pattern.
    • 一种用于形成具有间隔小于曝光工具的分辨率的孔的图案的方法,包括在涂覆在下面的膜上的第一抗蚀剂膜中形成包括具有等于或大于分辨率的宽度和间距的第一抗蚀剂开口的第一抗蚀剂图案。 通过对第一抗蚀剂图案进行第一收缩处理,形成包括尺寸等于或小于底层膜中的分辨率的第一孔的第一缩小图案。 第二抗蚀剂图案包括排列在宽度等于或大于分辨率的第一孔之间的第二抗蚀剂孔,形成在涂覆在下面的膜上的第二抗蚀剂膜中。 通过对第二抗蚀剂图案的第二收缩工艺形成包括尺寸等于或小于底层膜中的分辨率的第二孔的第二缩小图案。
    • 4. 发明授权
    • Photo mask, exposure method using the same, and method of generating data
    • 照片掩模,使用其的曝光方法以及生成数据的方法
    • US07384712B2
    • 2008-06-10
    • US10832995
    • 2004-04-28
    • Koji HashimotoTadahito FujisawaYuko KonoTakashi Obara
    • Koji HashimotoTadahito FujisawaYuko KonoTakashi Obara
    • G03F1/00
    • G03F1/36G03F1/30G03F1/32
    • A photo mask formed with patterns to be transferred to a substrate using an exposure apparatus, the photo mask comprising a pattern row having three or more hole patterns surrounded by a shielding portion or a semitransparent film and arranged along one direction, and an assist pattern surrounded by the shielding portion or semitransparent film and having a longitudinal direction and a latitudinal direction, the assist pattern being located at a specified distance from the pattern row in a direction orthogonal to the one direction, the longitudinal direction of the assist pattern being substantially parallel with the one direction, the longitudinal length of the assist pattern being equivalent to or larger than the longitudinal length of the pattern row, the assist pattern being not transferred to the substrate.
    • 一种光掩模,其形成有使用曝光装置转印到基板的图案,所述光掩模包括具有由屏蔽部分或半透明膜围绕并沿着一个方向布置的三个或更多孔图案的图案行和辅助图案包围 通过屏蔽部分或半透明膜并具有纵向方向和纬度方向,辅助图案位于与图案行在与该一个方向正交的方向上特定距离处,辅助图案的纵向方向基本上平行于 一个方向,辅助图案的纵向长度等于或大于图案行的纵向长度,辅助图案不被转印到基底。
    • 10. 发明授权
    • Photo mask, exposure method using the same, and method of generating data
    • 照片掩模,使用其的曝光方法以及生成数据的方法
    • US07794899B2
    • 2010-09-14
    • US12118578
    • 2008-05-09
    • Koji HashimotoTadahito FujisawaYuko KonoTakashi Obara
    • Koji HashimotoTadahito FujisawaYuko KonoTakashi Obara
    • G03F1/00
    • G03F1/36G03F1/30G03F1/32
    • A photo mask formed with patterns to be transferred to a substrate using an exposure apparatus, the photo mask comprising a pattern row having three or more hole patterns surrounded by a shielding portion or a semitransparent film and arranged along one direction, and an assist pattern surrounded by the shielding portion or semitransparent film and having a longitudinal direction and a latitudinal direction, the assist pattern being located at a specified distance from the pattern row in a direction orthogonal to the one direction, the longitudinal direction of the assist pattern being substantially parallel with the one direction, the longitudinal length of the assist pattern being equivalent to or larger than the longitudinal length of the pattern row, the assist pattern being not transferred to the substrate.
    • 一种光掩模,其形成有使用曝光装置转印到基板的图案,所述光掩模包括具有由屏蔽部分或半透明膜围绕并沿着一个方向布置的三个或更多孔图案的图案行和辅助图案包围 通过屏蔽部分或半透明膜并具有纵向方向和纬度方向,辅助图案位于与图案行在与该一个方向正交的方向上特定距离处,辅助图案的纵向方向基本上平行于 一个方向,辅助图案的纵向长度等于或大于图案行的纵向长度,辅助图案不被转印到基底。