专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US4115211A Process for metal plating on aluminum and aluminum alloys 失效
标题翻译：铝和铝合金镀金工艺
公开(公告)号：US4115211A
公开(公告)日：1978-09-19
申请号：US753555
申请日：1976-12-22
申请人： Takeo Tsukamoto , Miyoshi Okamura , Toshio Kutami
发明人： Takeo Tsukamoto , Miyoshi Okamura , Toshio Kutami
IPC分类号： C25D5/44 , C25D5/50 , C25D11/06 , C25D11/20
CPC分类号： C25D5/50 , C25D11/06 , C25D5/44
摘要： Metal plated aluminum product with good adhesion between aluminum substrate and plated metal are found to be producible by the process which comprises: electrolyzing aluminum or aluminum alloys by A.C. or superimposed A.C. and D.C. in an electrolytic solution capable of producing a growth type or barrier type anodic oxide coating onto the surface of the aluminum or aluminum alloy and comprising an aqueous solution containing a water-soluble acid and a water-soluble heavy metal salt, thereby to impart good adhesion properties to the aluminum or aluminum alloy surface and render it suitable as a substrate for plating of additional metal thereon, metal plating on the resulting aluminum substrate, and subjecting said plated substrate to a heat treatment to enhance the adhesion between the substrate and the additional metal plated thereon.
摘要翻译：发现铝基体和电镀金属之间具有良好粘附性的金属镀铝产品可通过以下方法生产，该方法包括：通过AC或叠加的AC和DC电解铝或铝合金，在能够产生生长型或阻挡型阳极的电解溶液中氧化物涂层在铝或铝合金的表面上，并且包含含有水溶性酸和水溶性重金属盐的水溶液，从而赋予铝或铝合金表面良好的粘附性，并使其适合作为用于在其上镀敷附加金属的基板，在所得铝基板上进行金属电镀，以及对所述电镀基板进行热处理，以增强基板与其上镀敷的附加金属之间的粘附。

IPRDB

热门服务

关于我们

友情链接

联系方式