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1. 发明申请

US20090051860A1 BLANK, BLACK MATRIX, AND COLOR FILTER 审中-公开
标题翻译：空白，黑色矩阵和彩色滤镜
公开(公告)号：US20090051860A1
公开(公告)日：2009-02-26
申请号：US12257771
申请日：2008-10-24
申请人： Takehiko HIRUMA , Masahiko Nakamori , Ryoichi Uryu
发明人： Takehiko HIRUMA , Masahiko Nakamori , Ryoichi Uryu
IPC分类号： G02F1/1335 , G02F1/1333
CPC分类号： G02B5/201 , G02B5/003 , G02F1/133512 , G02F1/133514 , G02F2203/02 , Y10T428/1059
摘要： An object of the present invention is to provide a black matrix excellent in durability (e.g., water resistance) and patterning property, a color filter formed from the black matrix, and a black matrix. The present invention relates to a blank for a black matrix, comprising a substrate having laminated thereon a light-shielding film and a low-reflection film, wherein the uppermost layer of the blank is the light-shielding film or the low-reflection film, the uppermost layer has an Ni content of from 80 to atm % based on the total metal components, the uppermost layer has an Mo content of from 8 to 15 atm % based on the total metal components, and the uppermost layer is free from Ta.
摘要翻译：本发明的目的是提供耐久性（例如耐水性）和图案形成性优异的黑色矩阵，由黑色矩阵形成的滤色器和黑色矩阵。本发明涉及一种用于黑色矩阵的坯料，其包括在其上层叠有遮光膜和低反射膜的基板，其中坯料的最上层是遮光膜或低反射膜，最上层的总金属成分的Ni含量为80〜atm％，最上层的金属成分总含有8〜15atm％的Mo含量，最上层不含Ta。

2. 发明授权

US08845852B2 Polishing pad and method of producing semiconductor device 有权
标题翻译：抛光垫及半导体装置的制造方法
公开(公告)号：US08845852B2
公开(公告)日：2014-09-30
申请号：US10536621
申请日：2003-11-27
申请人： Masahiko Nakamori , Tetsuo Shimomura , Takatoshi Yamada , Kazuyuki Ogawa , Atsushi Kazuno , Masahiro Watanabe
发明人： Masahiko Nakamori , Tetsuo Shimomura , Takatoshi Yamada , Kazuyuki Ogawa , Atsushi Kazuno , Masahiro Watanabe
IPC分类号： C23F1/00 , B24B37/20 , B24B37/013
CPC分类号： B24B37/205 , B24B37/013
摘要： A polishing pad enabling a highly precise optical endpoint sensing during the polishing process and thus having excellent polishing characteristics (such as surface uniformity and in-plane uniformity) is disclosed. A polishing pad enabling to obtain the polishing profile of a large area of a wafer is also disclosed. A polishing pad of a first invention comprises a light-transmitting region having a transmittance of not less than 50% over the wavelength range of 400 to 700 nm. A polishing pad of a second invention comprises a light-transmitting region having a thickness of 0.5 to 4 mm and a transmittance of not less than 80% over the wavelength range of 600 to 700 nm. A polishing pad of a third invention comprises a light-transmitting region arranged between the central portion and the peripheral portion of the polishing pad and having a length (D) in the diametrical direction which is three times or more longer than the length (L) in the circumferential direction.
摘要翻译：公开了一种抛光垫，其能够在抛光过程中进行高精度的光学终点感测，因此具有优异的抛光特性（例如表面均匀性和面内均匀性）。还公开了能够获得大面积晶片的抛光轮廓的抛光垫。第一发明的抛光垫包括在400〜700nm的波长范围内具有不小于50％透射率的透光区域。第二发明的抛光垫包括在600至700nm的波长范围内具有0.5至4mm厚度的透光区域和不小于80％的透光率。第三发明的抛光垫包括布置在抛光垫的中心部分和周边部分之间的透光区域，其沿直径方向的长度（D）比长度（L）长三倍或更长，在圆周方向。

3. 发明申请

US20130005228A1 POLISHING PAD 有权
标题翻译：抛光垫
公开(公告)号：US20130005228A1
公开(公告)日：2013-01-03
申请号：US13607125
申请日：2012-09-07
申请人： Atsushi Kazuno , Kazuyuki Ogawa , Masahiko Nakamori , Takatoshi Yamada , Tetsuo Shimomura
发明人： Atsushi Kazuno , Kazuyuki Ogawa , Masahiko Nakamori , Takatoshi Yamada , Tetsuo Shimomura
IPC分类号： B24D3/00 , B24D11/00
CPC分类号： B24B37/24 , B24D3/28 , B24D3/32 , C08G18/12 , C08G18/4238 , C08G18/4854 , C08G18/724 , C08G18/758 , C08G18/7621 , C08G2101/0025 , C08G2101/0066 , C08J9/30 , C08J2375/08 , C08G18/3814 , C08G18/48 , C08G18/3865
摘要： A polishing pad generates very few scratches on a surface of a polishing object, and is excellent in planarization property. The polishing pad has a high polishing rate and is excellent in planarization property. The polishing pad grooves become very little clogged with abrasive grains or polishing swarf during polishing and, even when continuously used for a long period of time, the polishing rate is scarcely reduced.
摘要翻译：抛光垫在抛光对象的表面上产生很少的划痕，并且平坦化性能优异。抛光垫具有高的抛光速率，并且平坦化性能优异。抛光垫槽在抛光过程中变得很少被磨粒或抛光屑堵塞，并且即使长时间连续使用，抛光速率几乎不降低。

4. 发明授权

US08309466B2 Polishing pad 有权
标题翻译：抛光垫
公开(公告)号：US08309466B2
公开(公告)日：2012-11-13
申请号：US12065219
申请日：2006-08-22
申请人： Kazuyuki Ogawa , Tetsuo Shimomura , Yoshiyuki Nakai , Masahiko Nakamori , Takatoshi Yamada
发明人： Kazuyuki Ogawa , Tetsuo Shimomura , Yoshiyuki Nakai , Masahiko Nakamori , Takatoshi Yamada
IPC分类号： H01L21/302 , H01L21/461 , B32B5/00 , B32B3/26
CPC分类号： B24B37/24 , B24D3/32 , C08G18/36 , C08G2101/00 , Y10T428/24 , Y10T428/249953
摘要： A polishing pad has an excellent polishing rate and is superior in longevity without generating center slow. A method of manufacturing a semiconductor device with the polishing pad is also provided. The polishing pad has a polishing layer consisting of a polyurethane foam having fine cells, wherein a high-molecular-weight polyol component that is a starting component of the polyurethane foam contains a hydrophobic high-molecular-weight polyol A having a number-average molecular weight of 550 to 800 and a hydrophobic high-molecular-weight polyol B having a number-average molecular weight of 950 to 1300 in an A/B ratio of from 10/90 to 50/50 by weight.
摘要翻译：抛光垫具有优异的抛光速率，寿命长，不会产生中心慢。还提供了一种制造具有抛光垫的半导体器件的方法。抛光垫具有由具有细小细胞的聚氨酯泡沫构成的抛光层，其中作为聚氨酯泡沫的起始成分的高分子量多元醇成分含有具有数均分子量的疏水性高分子量多元醇A 重量为550〜800的疏水性高分子量多元醇B，A / B比为10/90〜50/50的数均分子量为950〜1300的疏水性高分子量多元醇B.

5. 发明申请

US20110218263A1 POLISHING PAD 有权
标题翻译：抛光垫
公开(公告)号：US20110218263A1
公开(公告)日：2011-09-08
申请号：US13107347
申请日：2011-05-13
申请人： Atsushi KAZUNO , Kazuyuki Ogawa , Masahiko Nakamori , Takatoshi Yamada , Tetsuo Shimomura
发明人： Atsushi KAZUNO , Kazuyuki Ogawa , Masahiko Nakamori , Takatoshi Yamada , Tetsuo Shimomura
IPC分类号： C08J9/228
CPC分类号： B24B37/24 , B24D3/28 , B24D3/32 , C08G18/12 , C08G18/4238 , C08G18/4854 , C08G18/724 , C08G18/758 , C08G18/7621 , C08G2101/0025 , C08G2101/0066 , C08J9/30 , C08J2375/08 , C08G18/3814 , C08G18/48 , C08G18/3865
摘要： A polishing pad generates very few scratches on a surface of a polishing object, and is excellent in planarization property. The polishing pad has a high polishing rate and is excellent in planarization property. The polishing pad grooves become very little clogged with abrasive grains or polishing swarf during polishing and, even when continuously used for a long period of time, the polishing rate is scarcely reduced.
摘要翻译：抛光垫在抛光对象的表面上产生很少的划痕，并且平坦化性能优异。抛光垫具有高的抛光速率，并且平坦化性能优异。抛光垫槽在抛光过程中变得很少被磨粒或抛光屑堵塞，并且即使长时间连续使用，抛光速率几乎不降低。

6. 发明申请

US20070190905A1 Polishing pad and semiconductor device manufacturing method 有权
标题翻译：抛光垫和半导体器件的制造方法
公开(公告)号：US20070190905A1
公开(公告)日：2007-08-16
申请号：US10598717
申请日：2004-10-20
申请人： Tetsuo Shimomura , Masahiko Nakamori , Takatoshi Yamada , Kazuyuki Ogawa , Atsushi Kazuno , Masahiro Watanabe
发明人： Tetsuo Shimomura , Masahiko Nakamori , Takatoshi Yamada , Kazuyuki Ogawa , Atsushi Kazuno , Masahiro Watanabe
IPC分类号： B24B1/00 , H01L21/461 , H01L21/302
CPC分类号： B24B37/205 , H01L21/30625
摘要： The object of the invention is to provide a polishing pad capable of maintaining high-precision end-point optical detection over a long period from the start of use to the end of use even if polishing is performed with an alkaline or acid slurry, as well as a method of manufacturing a semiconductor device with this polishing pad. The polishing pad of the invention is used in chemical mechanical polishing and has a polishing region and a light-transmitting region, wherein the light-transmitting region satisfies that the difference ΔT (ΔT=T0−T1) (%) between T0 and T1 is within 10(%) over the whole range of measurement wavelengths of from 400 to 700 nm, wherein T1 is the light transmittance (%) of the light-transmitting region measured at the measurement wavelength λ after dipping for 24 hours in a KOH aqueous solution at pH 11 or an H2O2 aqueous solution at pH 4 and T0 is the light-transmittance (%) measured at the measurement wavelength λ before the dipping.
摘要翻译：本发明的目的是提供一种抛光垫，即使在用碱性或酸性浆料进行研磨的同时，也能够在从使用开始到使用结束的长时间内保持高精度的端点光学检测作为使用该研磨垫的半导体装置的制造方法。本发明的抛光垫用于化学机械抛光，并具有抛光区域和透光区域，其中透光区域满足差值DeltaT（ΔT= T 0 -T < 在0至100nm的测量波长的整个范围内，T 0和T 1之间的平均值（％）在10（％）以内其中T 1是在pH 11或KOH 2的KOH水溶液中浸渍24小时后在测量波长λ下测量的透光区的透光率（％）在pH 4和T 0 <0> 2水溶液中的透光率（％）是在浸渍之前在测量波长λ下测量的。

7. 发明授权

US06245483B1 Photosensitive resin composition 失效
标题翻译：感光树脂组合物
公开(公告)号：US06245483B1
公开(公告)日：2001-06-12
申请号：US09088505
申请日：1998-06-01
申请人： Chihiro Oshimo , Tohru Wada , Masahiko Nakamori
发明人： Chihiro Oshimo , Tohru Wada , Masahiko Nakamori
IPC分类号： G03F7027
CPC分类号： G03F7/035 , G03F7/032 , Y10T428/2989
摘要： A photosensitive resin composition for flexographic printing comprising dispersed particles of (1) a core phase mainly composed of a non-crosslinkable hydrophobic polymer (A) having a glass transition temperature at 5° C. or lower, and (2) a shell phase covering the core phase which is mainly composed of a hydrophilic polymer; and (3) a matrix phase mainly composed of a mixture of a hydrophobic polymer (B) which is immiscible with the hydrophobic polymer (A) and a non gaseous ethylenic unsaturated compound. The difference between refractive index of said hydrophobic polymer (A) of the core phase (1) and that of the mixture of said hydrophobic polymer (B) and said ethylenic unsaturated compound of the matrix phase (3) is 0.010 or less, thereby decreasing light scattering in the resin. The photosensitive resin composition can be developed with an aqueous developer and has wide light exposure latitude, improved printing reproducibility and improved aqueous ink resistance.
摘要翻译：一种用于柔性版印刷的感光性树脂组合物，其包含（1）主要由玻璃化转变温度为5℃以下的不可交联的疏水性聚合物（A）构成的芯相的分散粒子，（2）壳相覆盖核心相主要由亲水性聚合物组成; 和（3）主要由与疏水性聚合物（A）不混溶的疏水性聚合物（B）和非气态烯键式不饱和化合物的混合物组成的基体相。所述芯相（1）的所述疏水性聚合物（A）与所述疏水性聚合物（B）与所述基体相（3）的所述烯键式不饱和化合物的混合物的折射率之差为0.010以下，由此降低树脂中的光散射。感光性树脂组合物可以用水性显影剂显影，具有宽的曝光宽容度，改善的印刷再现性和改善的耐水性油墨性。

8. 发明授权

US09394638B2 Polyimide nonwoven fabric and process for production thereof 有权
标题翻译：聚酰亚胺无纺布及其制造方法
公开(公告)号：US09394638B2
公开(公告)日：2016-07-19
申请号：US12305722
申请日：2007-06-19
申请人： Masahiko Nakamori , Satoshi Maeda , Tooru Kitagawa , Hisato Kobayashi , Yasuo Ohta
发明人： Masahiko Nakamori , Satoshi Maeda , Tooru Kitagawa , Hisato Kobayashi , Yasuo Ohta
IPC分类号： D04H1/72 , D04H3/16 , D01D5/00 , D01F6/74 , D04H1/42
CPC分类号： D04H3/16 , D01D5/0038 , D01F6/74 , D04H1/42 , D04H1/4334 , D04H1/4382 , D04H1/72 , Y10T442/626
摘要： A non-woven fabric which is excellent in thermal resistance, mechanical strength, and thermal dimensional stability for applications exposed to high temperature circumstance and has an extremely large surface area and exhibit an excellent filter performance is obtained. The non-woven fabric is composed of polyimide fibers which are obtained by polycondensation of at least an aromatic tetracarboxylic acid and an aromatic diamine having a benzoxazole structure and have a fiber diameter in the range of 0.001 μm to 1 μm. The non-woven fabric is obtained by the steps of preparing a polyamic acid by polycondensation of an aromatic tetracarboxylic acid and an aromatic diamine having a benzoxazole structure, and electro-spinning the polyamic acid to form a polyimide precursor non-woven fabric; and imidizing a polyimide precursor fiber bundle.
摘要翻译：获得了耐高温环境下使用的耐热性，机械强度和热尺寸稳定性优异，表面积极高，过滤性能优异的无纺布。无纺布由聚酰亚胺纤维构成，该聚酰亚胺纤维通过至少一种芳香族四羧酸和具有苯并恶唑结构的芳香族二胺的缩聚得到，纤维直径在0.001μm〜1μm的范围内。通过以下步骤获得无纺织物：通过芳族四羧酸和具有苯并恶唑结构的芳族二胺的缩聚制备聚酰胺酸，并将聚酰胺酸电纺丝以形成聚酰亚胺前体无纺织物; 并酰亚胺化聚酰亚胺前体纤维束。

9. 发明授权

US08779020B2 Polishing pad 有权
标题翻译：抛光垫
公开(公告)号：US08779020B2
公开(公告)日：2014-07-15
申请号：US13607125
申请日：2012-09-07
申请人： Atsushi Kazuno , Kazuyuki Ogawa , Masahiko Nakamori , Takatoshi Yamada , Tetsuo Shimomura
发明人： Atsushi Kazuno , Kazuyuki Ogawa , Masahiko Nakamori , Takatoshi Yamada , Tetsuo Shimomura
IPC分类号： C08G18/10
CPC分类号： B24B37/24 , B24D3/28 , B24D3/32 , C08G18/12 , C08G18/4238 , C08G18/4854 , C08G18/724 , C08G18/758 , C08G18/7621 , C08G2101/0025 , C08G2101/0066 , C08J9/30 , C08J2375/08 , C08G18/3814 , C08G18/48 , C08G18/3865
摘要： A polishing pad generates very few scratches on a surface of a polishing object, and is excellent in planarization property. The polishing pad has a high polishing rate and is excellent in planarization property. The polishing pad grooves become very little clogged with abrasive grains or polishing swarf during polishing and, even when continuously used for a long period of time, the polishing rate is scarcely reduced.
摘要翻译：抛光垫在抛光对象的表面上产生很少的划痕，并且平坦化性能优异。抛光垫具有高的抛光速率，并且平坦化性能优异。抛光垫槽在抛光过程中变得很少被磨粒或抛光屑堵塞，并且即使长时间连续使用，抛光速率也几乎不降低。

10. 发明授权

US08304467B2 Polishing pad 有权
标题翻译：抛光垫
公开(公告)号：US08304467B2
公开(公告)日：2012-11-06
申请号：US11914547
申请日：2006-05-10
申请人： Atsushi Kazuno , Kazuyuki Ogawa , Masahiko Nakamori , Takatoshi Yamada , Tetsuo Shimomura
发明人： Atsushi Kazuno , Kazuyuki Ogawa , Masahiko Nakamori , Takatoshi Yamada , Tetsuo Shimomura
IPC分类号： C08G18/28
CPC分类号： B24B37/24 , B24D3/28 , B24D3/32 , C08G18/12 , C08G18/4238 , C08G18/4854 , C08G18/724 , C08G18/758 , C08G18/7621 , C08G2101/0025 , C08G2101/0066 , C08J9/30 , C08J2375/08 , C08G18/3814 , C08G18/48 , C08G18/3865
摘要： A polishing pad generates very few scratches on a surface of a polishing object, and is excellent in planarization property. The polishing pad has a high polishing rate and is excellent in planarization property. The polishing pad grooves become very little clogged with abrasive grains or polishing swarf during polishing and, even when continuously used for a long period of time, the polishing rate is scarcely reduced.
摘要翻译：抛光垫在抛光对象的表面上产生很少的划痕，并且平坦化性能优异。抛光垫具有高的抛光速率，并且平坦化性能优异。抛光垫槽在抛光过程中变得很少被磨粒或抛光屑堵塞，并且即使长时间连续使用，抛光速率几乎不降低。

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