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1. 发明申请

US20110143196A1 LITHIUM SECONDARY BATTERY 审中-公开
标题翻译：锂二次电池
公开(公告)号：US20110143196A1
公开(公告)日：2011-06-16
申请号：US12961693
申请日：2010-12-07
申请人： Takefumi OKUMURA , Ryo Inoue , Toshio Haba , Chieko Araki
发明人： Takefumi OKUMURA , Ryo Inoue , Toshio Haba , Chieko Araki
IPC分类号： H01M10/02
CPC分类号： H01M10/0569
摘要： Objects of the present invention are to improve the adhesion and processing characteristics of electrode composite layers and to provide a lithium secondary battery by which a decrease in battery capacity during high-temperature storage at 50° C. or higher is suppressed. The lithium secondary battery of the present invention comprises a positive electrode capable of storing and releasing lithium ions, a negative electrode capable of storing and releasing lithium ions, a separator disposed between the positive electrode and the negative electrode, and an electrolyte, wherein the negative electrode or the electrolyte contains a nonvolatile liquid.
摘要翻译：本发明的目的在于提高电极复合层的附着力和加工特性，提供抑制在50℃以上的高温保存时的电池容量降低的锂二次电池。本发明的锂二次电池包括能够储存和释放锂离子的正极，能够储存和释放锂离子的负极，设置在正极和负极之间的隔膜和电解质，其中负极电极或电解质含有非挥发性液体。

2. 发明申请

US20080299247A1 Fine Pattern Mold and Method for Producing the Same 有权
标题翻译：精细图案模具及其制作方法
公开(公告)号：US20080299247A1
公开(公告)日：2008-12-04
申请号：US12129881
申请日：2008-05-30
申请人： Masahiko Ogino , Mitsuru Hasegawa , Kenya Ohashi , Akihiro Miyauchi , Hitoshi Suzuki , Toshio Haba , Haruo Akahoshi
发明人： Masahiko Ogino , Mitsuru Hasegawa , Kenya Ohashi , Akihiro Miyauchi , Hitoshi Suzuki , Toshio Haba , Haruo Akahoshi
IPC分类号： B29C33/42 , C25D1/10
CPC分类号： B29C33/3878 , B29C33/424 , C25D1/02 , C25D1/10 , Y10S425/81 , Y10T29/49549 , Y10T29/49552
摘要： There is provided a fine pattern mold capable of transferring a fine concave/convex pattern accurately without causing deformation of the fine concave/convex pattern itself.The fine patter mold comprises: a roll; a buffer tube whose inner peripheral surface is in contact with an outer peripheral surface of the roll; and a stamper tube in which its inner peripheral surface is in contact with an outer peripheral surface of the buffer tube and a fine concave/convex pattern is formed on its outer peripheral surface, wherein the buffer tube has a larger coefficient of linear expansion and a smaller elastic modulus than those of the stamper tube.
摘要翻译：提供了能够精确地转印精细凹凸图案的精细图案模具，而不会导致精细凹凸图案本身的变形。精细模具包括：卷; 缓冲管，其内周面与所述辊的外周面接触; 以及其内周面与缓冲管的外周面接触的压模管，在其外周面上形成微细的凹凸图案，其中缓冲管具有较大的线膨胀系数和比压模管的弹性模量小。

3. 发明授权

US08083515B2 Fine pattern mold 有权
标题翻译：精细图案模具
公开(公告)号：US08083515B2
公开(公告)日：2011-12-27
申请号：US12129881
申请日：2008-05-30
申请人： Masahiko Ogino , Mitsuru Hasegawa , Kenya Ohashi , Akihiro Miyauchi , Hitoshi Suzuki , Toshio Haba , Haruo Akahoshi
发明人： Masahiko Ogino , Mitsuru Hasegawa , Kenya Ohashi , Akihiro Miyauchi , Hitoshi Suzuki , Toshio Haba , Haruo Akahoshi
IPC分类号： B29C43/46 , B29C59/04
CPC分类号： B29C33/3878 , B29C33/424 , C25D1/02 , C25D1/10 , Y10S425/81 , Y10T29/49549 , Y10T29/49552
摘要： The fine pattern mold comprises: that includes a roll, a buffer tube with inner peripheral surface is in contact with an outer peripheral surface of the roll, and a stamper tube in which its inner peripheral surface is in contact with an outer peripheral surface of the buffer tube and a fine concave/convex pattern is formed on its outer peripheral surface, wherein the buffer tube has a larger coefficient of linear expansion and a smaller elastic modulus than those of the stamper tube.
摘要翻译：精细图案模具包括：包括辊，具有内周表面的缓冲管与辊的外周表面接触;以及压模管，其内周表面与所述辊的外周表面接触在其外周面形成有缓冲管和细凹凸图案，其中缓冲管具有比压模管更大的线膨胀系数和更小的弹性模量。

4. 发明授权

US07922887B2 Metal structure and method of its production 有权
标题翻译：金属结构及其生产方法
公开(公告)号：US07922887B2
公开(公告)日：2011-04-12
申请号：US11340570
申请日：2006-01-27
申请人： Toshio Haba , Hiroshi Yoshida , Haruo Akahoshi , Hitoshi Suzuki
发明人： Toshio Haba , Hiroshi Yoshida , Haruo Akahoshi , Hitoshi Suzuki
IPC分类号： C25D5/16 , C25D5/02
CPC分类号： C25D3/38 , C25D5/02 , C25D5/56
摘要： The present invention provides a method for producing a metal structure comprising a substrate and a metal film formed on the substrate; comprising the steps of providing surface having irregularities made of a electrical conductor in the area of the substrate where the metal body or film is to be formed; and preferentially forming the metal body or film by electroplating in the area provided with the conductive surface having irregularities. The plating bath may preferably contain an additive compound such as a cyanine dye which is capable of suppressing the plating reaction, and which loses such plating-suppressing effect with the progress of the plating reaction. The metal film can be produced by electroplating in the area provided with the surface having irregularities.
摘要翻译：本发明提供一种金属结构体的制造方法，该金属结构体包括在基板上形成的基板和金属膜; 包括以下步骤：在要形成金属体或膜的基板的区域中提供具有由电导体制成的凹凸的表面; 并且优选地在设置有具有不规则性的导电表面的区域中通过电镀形成金属体或膜。电镀浴可以优选含有能够抑制电镀反应的花青染料等添加剂化合物，并且随着电镀反应的进行而失去这种电镀抑制效果。金属膜可以通过在具有不规则的表面的区域中进行电镀而制造。

5. 发明授权

US08387255B2 Fine pattern mold 有权
标题翻译：精细图案模具
公开(公告)号：US08387255B2
公开(公告)日：2013-03-05
申请号：US13307042
申请日：2011-11-30
申请人： Masahiko Ogino , Mitsuru Hasegawa , Kenya Ohashi , Akihiro Miyauchi , Hitoshi Suzuki , Toshio Haba , Haruo Akahoshi
发明人： Masahiko Ogino , Mitsuru Hasegawa , Kenya Ohashi , Akihiro Miyauchi , Hitoshi Suzuki , Toshio Haba , Haruo Akahoshi
IPC分类号： G11B7/26 , B29C33/38 , B29C59/04
CPC分类号： B29C33/3878 , B29C33/424 , C25D1/02 , C25D1/10 , Y10S425/81 , Y10T29/49549 , Y10T29/49552
摘要： The fine pattern mold that includes a roll, a buffer tube with inner peripheral surface is in contact with an outer peripheral surface of the roll, and a stamper tube in which its inner peripheral surface is in contact with an outer peripheral surface of the buffer tube and a fine concave/convex pattern is formed on its outer peripheral surface, wherein the buffer tube has a larger coefficient of linear expansion and a smaller elastic modulus than those of the stamper tube.
摘要翻译：包括辊，具有内周面的缓冲管的精细图案模具与辊的外周面接触，并且压模管的内周面与缓冲管的外周面接触并且在其外周面上形成微细的凹凸图案，其中缓冲管具有比压模管更大的线膨胀系数和更小的弹性模量。

6. 发明申请

US20050087447A1 Electric copper plating liquid and process for manufacturing semiconductor integrated circuit device using same 审中-公开
标题翻译：电镀铜液和制造半导体集成电路器件的工艺
公开(公告)号：US20050087447A1
公开(公告)日：2005-04-28
申请号：US10996382
申请日：2004-11-26
申请人： Toshio Haba , Takeyuki Itabashi , Haruo Akahoshi , Shinichi Fukada
发明人： Toshio Haba , Takeyuki Itabashi , Haruo Akahoshi , Shinichi Fukada
IPC分类号： C25D3/38 , C25D7/12 , H01L21/288 , H01L21/768 , H01L23/522 , H05K3/42
CPC分类号： C25D7/123 , C25D3/38 , H05K3/423
摘要： An object of the present invention is to improve the reliability and the yield of production of semiconductor integrated circuit devices by filling copper in the inside of features having a high aspect ratio for forming multi-layer interconnections composed of a plurality of interconnection layers which are connected to one another and to a copper electroplating bath suitable therefor. In the present invention, when the features are filled with copper, the use of a copper electroplating bath with an addition of cyanine dyes, for example, indolium compounds allows the copper plating to proceed preferentially from the bottoms of the features.
摘要翻译：本发明的目的是通过在具有高纵横比的特征内部填充铜来提高半导体集成电路器件的可靠性和生产成本，以形成由连接的多个互连层组成的多层互连彼此之间和适合于此的铜电镀浴。在本发明中，当特征填充有铜时，使用带有花青染料的铜电镀浴，例如，吲哚鎓化合物，可使铜镀层优先从特征的底部进行。

7. 发明授权

US06511588B1 Plating method using an additive 失效
标题翻译：使用添加剂的电镀方法
公开(公告)号：US06511588B1
公开(公告)日：2003-01-28
申请号：US09545093
申请日：2000-04-07
申请人： Kinya Kobayashi , Akihiro Sano , Takeyuki Itabashi , Toshio Haba , Haruo Akahoshi , Shinichi Fukada
发明人： Kinya Kobayashi , Akihiro Sano , Takeyuki Itabashi , Toshio Haba , Haruo Akahoshi , Shinichi Fukada
IPC分类号： C25D302
CPC分类号： H01L21/2885 , C25D3/38 , C25D7/123 , H01L21/76877
摘要： A plating method comprising using a plating solution containing an additive satisfying the following conditions: 0.005×h2/w
摘要翻译：一种电镀方法，其特征在于，使用含有满足以下条件的添加剂的镀液：D为添加剂的扩散系数; kappa是添加剂的吸附或消耗的表面反应速率; h是沟槽或洞的高度; w是沟槽的宽度或孔的半径; 和THETA是（存在添加剂时的镀膜生长速度）/（不存在添加剂时的镀膜生长速度）的比例，适合于在宽度为1μm以下的沟槽或孔中形成电镀金属（沟槽）或半径小于1μm的孔（孔）而不产生空隙，并且特别适合于制造半导体器件，其可以通过使用电镀条件具有形成在半导体衬底上的铜布线层的多层结构，其中至少在与铜布线层的其余部分不同的条件下对一层铜布线层进行电镀。

8. 发明申请

US20120067507A1 FINE PATTERN MOLD 有权
标题翻译：精细图案模具
公开(公告)号：US20120067507A1
公开(公告)日：2012-03-22
申请号：US13307042
申请日：2011-11-30
申请人： Masahiko OGINO , Mitsuru Hasegawa , Kenya Ohashi , Akihiro Miyauchi , Hitoshi Suzuki , Toshio Haba , Haruo Akahoshi
发明人： Masahiko OGINO , Mitsuru Hasegawa , Kenya Ohashi , Akihiro Miyauchi , Hitoshi Suzuki , Toshio Haba , Haruo Akahoshi
IPC分类号： B29C33/42 , B29C65/00
CPC分类号： B29C33/3878 , B29C33/424 , C25D1/02 , C25D1/10 , Y10S425/81 , Y10T29/49549 , Y10T29/49552
摘要： The fine pattern mold that includes a roll, a buffer tube with inner peripheral surface is in contact with an outer peripheral surface of the roll, and a stamper tube in which its inner peripheral surface is in contact with an outer peripheral surface of the buffer tube and a fine concave/convex pattern is formed on its outer peripheral surface, wherein the buffer tube has a larger coefficient of linear expansion and a smaller elastic modulus than those of the stamper tube.
摘要翻译：包括辊，具有内周面的缓冲管的精细图案模具与辊的外周面接触，并且压模管的内周面与缓冲管的外周面接触并且在其外周面上形成微细的凹凸图案，其中缓冲管具有比压模管更大的线膨胀系数和更小的弹性模量。

9. 发明申请

US20070287289A1 PRODUCTION METHOD OF CONDUCTIVE PATTERN 审中-公开
标题翻译：导电图案的制作方法
公开(公告)号：US20070287289A1
公开(公告)日：2007-12-13
申请号：US11760969
申请日：2007-06-11
申请人： Toshio Haba , Hitoshi Suzuki , Naohito Satou , Haruo Akahoshi , Hiroshi Yoshida , Akira Chinda
发明人： Toshio Haba , Hitoshi Suzuki , Naohito Satou , Haruo Akahoshi , Hiroshi Yoshida , Akira Chinda
IPC分类号： H01L21/44
CPC分类号： H01L21/2885 , C25D3/38 , C25D5/022 , C25D5/34 , H05K3/108 , H05K3/241 , H05K3/4007 , H05K2201/0367 , H05K2203/0392
摘要： [Problem to be Solved] An object of the present invention is to provide a method of forming a conductive pattern having an excellent uniformity of film thickness within the surface of a substrate independently of the density of the pattern. [Solution] The production method of a conductive pattern in accordance with the present invention comprises the step of electroplating for forming a conductive pattern by electroplating on a metal seed layer formed on an insulated substrate using a plating bath containing an accelerator for reducing the deposition overpotential of a plated metal.
摘要翻译： [待解决的问题]本发明的目的在于提供一种形成与图案的密度无关地在基板的表面内具有优异的膜厚均匀性的导电图案的方法。 [解决方案]根据本发明的导电图案的制造方法包括通过使用包含用于降低沉积超电势的促进剂的电镀液通过电镀在形成在绝缘基板上的金属种子层上形成导电图案的电镀步骤的镀金属。

10. 发明申请

US20060163725A1 Wiring board and production method thereof 审中-公开
标题翻译：接线板及其制造方法
公开(公告)号：US20060163725A1
公开(公告)日：2006-07-27
申请号：US11205175
申请日：2005-08-17
申请人： Toshio Haba , Hiroshi Yoshida , Haruo Akahoshi , Hitoshi Suzuki , Akira Chinda
发明人： Toshio Haba , Hiroshi Yoshida , Haruo Akahoshi , Hitoshi Suzuki , Akira Chinda
IPC分类号： H01L23/48 , H01L21/44
CPC分类号： H05K3/241 , H01L21/4846 , H01L23/49838 , H01L2924/0002 , H01L2924/09701 , H05K3/108 , H05K3/382 , H05K3/388 , H01L2924/00
摘要： It is an object of the present invention to provide a wiring board having high-density wiring with a controlled shape without masking by a resist film and a production method thereof. In the present invention, the production method of a wiring board having copper wiring on an insulating substrate includes the steps of forming a metal seed layer on the insulating substrate, the metal seed layer having a roughened shape in a portion on which the copper wiring or a bump is to be formed, and forming an electroplated film of copper or an alloy of copper through electroplating on the portion of the metal seed layer having the roughened shape. A substance for suppressing the plating reaction is added to a plating bath to provide an angle of 90 degrees or smaller between a surface of the insulating substrate and a side of the electroplated film.
摘要翻译：本发明的目的是提供一种具有受控形状的高密度布线而不用抗蚀剂膜掩蔽的布线板及其制造方法。在本发明中，在绝缘基板上具有铜布线的布线基板的制造方法包括以下步骤：在绝缘基板上形成金属籽晶层，金属种子层的粗糙化部分在铜布线或形成凸起，并且通过电镀在具有粗糙形状的金属种子层的部分上形成铜或铜的合金的电镀膜。在镀浴中加入抑制电镀反应的物质，在绝缘性基材的表面与电镀膜的一侧之间形成90度以下的角度。

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