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1. 发明申请

US20070104973A1 Low-temperature setting adhesive and anisotropically electroconductive adhesive film using the same 审中-公开
标题翻译：低温固化粘合剂和使用其的各向异性导电粘合剂膜
公开(公告)号：US20070104973A1
公开(公告)日：2007-05-10
申请号：US11514192
申请日：2006-09-01
申请人： Masao Saito , Osamu Takamatsu , Takayuki Matsushima
发明人： Masao Saito , Osamu Takamatsu , Takayuki Matsushima
IPC分类号： B32B27/30 , B32B33/00 , C08F30/08
CPC分类号： H05K3/323 , C08F290/062 , C08L71/12 , C08L2205/02 , C08L2312/00 , C08L2666/02 , C09J4/00 , C09J7/10 , C09J9/02 , C09J11/08 , C09J133/068 , C09J163/10 , C09J2201/602 , C09J2463/00 , H01L21/6835 , H01L24/29 , H01L24/83 , H01L2224/16 , H01L2224/2919 , H01L2224/83101 , H01L2224/8319 , H01L2224/838 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/07811 , H05K2201/0239 , Y10T428/14 , Y10T428/1462 , Y10T428/31935 , C08F220/32 , H01L2924/00 , H01L2924/3512
摘要： An insulating adhesive film and an anisotropically electroconductive adhesive film satisfying low-temperature curability, high adhesion and high reliability are provided. An anisotropically electroconductive adhesive film of the present invention is so configured that electroconductive particles 7 are dispersed in an insulating adhesive resin 6, comprising as main components: a radical polymerizable resin component having an unsaturated double bond; a resin component having no unsaturated double bond; a phosphoric acid-containing resin component; and a radical polymerization initiator.
摘要翻译：提供了一种满足低温固化性，高粘合性和高可靠性的绝缘粘合膜和各向异性导电粘合剂膜。本发明的各向异性导电粘合剂膜是这样构成的，其中导电颗粒7分散在绝缘粘合树脂6中，其包括作为主要成分的具有不饱和双键的自由基聚合性树脂组分; 不具有不饱和双键的树脂组分; 含磷酸树脂组分; 和自由基聚合引发剂。

2. 发明申请

US20050257886A1 Process for producing electrical apparatus 审中-公开
标题翻译：电气设备制造工艺
公开(公告)号：US20050257886A1
公开(公告)日：2005-11-24
申请号：US10505342
申请日：2003-02-14
申请人： Takayuki Matsushima , Masao Saito
发明人： Takayuki Matsushima , Masao Saito
IPC分类号： C09J5/00 , C09J5/06 , H05K3/32 , B32B31/26
CPC分类号： H05K3/323 , C09J5/06 , H01L2924/01019 , H05K2201/0239 , H05K2203/1163 , H05K2203/1189 , H05K2203/121
摘要： Disclosed is a method for producing an electrical device by electrically and mechanically interconnecting two objects for bonding. When an adhesive layer (25) provided to an LCD (11) and a layer of a second curing agent (28) provided to a TCP (15) are brought into tight contact with each other and thrust in this state to each other under heating, a first curing agent in the adhesive layer (25) and a second curing agent forming the layer of the second curing agent react with each other so that the thermosetting resin in the adhesive layer is polymerized to bond the LCD (11) and the TCP (15) together to produce an electrical device. In case a metal chelate or a metal alcoholate and a silane coupling agent are used as the first and second curing agents, respectively, the silane coupling agent and the metal chelate react with each other to yield cations and, by these cations, the thermosetting resin undergoes cationic polymerization. The adhesive may be cured to bond the LCD (11) and the TCP (15) together in a shorter time at a lower temperature than in case the conventional adhesive is used.
摘要翻译：公开了一种通过电气和机械地互连两个物体进行接合来制造电气装置的方法。当提供给LCD（11）的粘合剂层（25）和设置在TCP（15）上的第二固化剂（28）的层彼此紧密接触并且在加热下彼此以这种状态推进在粘合剂层（25）中形成第一固化剂和形成第二固化剂层的第二固化剂彼此反应，使粘合剂层中的热固性树脂聚合以将LCD（11）和TCP （15）一起产生电气设备。在金属螯合物或金属醇化物和硅烷偶联剂分别用作第一和第二固化剂的情况下，硅烷偶联剂和金属螯合物彼此反应以产生阳离子，并且通过这些阳离子，热固性树脂进行阳离子聚合。粘合剂可以固化以在比使用常规粘合剂的情况更低的温度下在更短的时间内将LCD（11）和TCP（15）结合在一起。

3. 发明申请

US20100227101A1 Peeling Sheet With Adhesive of Epoxy Acrylate, Non-Unsaturated Resin and Bis(methacryloyloxyethyl) Hydrogen Phosphate 有权
标题翻译：环氧丙烯酸酯，非不饱和树脂和双（甲基丙烯酰氧基乙基）磷酸酯胶粘剂的剥离片
公开(公告)号：US20100227101A1
公开(公告)日：2010-09-09
申请号：US12662931
申请日：2010-05-12
申请人： Masao Saito , Osamu Takamatsu , Takayuki Matsushima
发明人： Masao Saito , Osamu Takamatsu , Takayuki Matsushima
IPC分类号： B32B33/00
CPC分类号： H05K3/323 , C08F290/062 , C08L71/12 , C08L2205/02 , C08L2312/00 , C08L2666/02 , C09J4/00 , C09J7/10 , C09J9/02 , C09J11/08 , C09J133/068 , C09J163/10 , C09J2201/602 , C09J2463/00 , H01L21/6835 , H01L24/29 , H01L24/83 , H01L2224/16 , H01L2224/2919 , H01L2224/83101 , H01L2224/8319 , H01L2224/838 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/07811 , H05K2201/0239 , Y10T428/14 , Y10T428/1462 , Y10T428/31935 , C08F220/32 , H01L2924/00 , H01L2924/3512
摘要： An insulating adhesive film and an anisotropically electroconductive adhesive film satisfying low-temperature curability, high adhesion and high reliability are provided. An anisotropically electroconductive adhesive film of the present invention is so configured that electroconductive particles 7 are dispersed in an insulating adhesive resin 6, comprising as main components: a radical polymerizable resin component having an unsaturated double bond; a resin component having no unsaturated double bond; a phosphoric acid-containing resin component; and a radical polymerization initiator.
摘要翻译：提供了一种满足低温固化性，高粘合性和高可靠性的绝缘粘合膜和各向异性导电粘合剂膜。本发明的各向异性导电粘合剂膜是这样构成的，其中导电颗粒7分散在绝缘粘合树脂6中，其包括作为主要成分的具有不饱和双键的自由基聚合性树脂组分; 不具有不饱和双键的树脂组分; 含磷酸树脂组分; 和自由基聚合引发剂。

4. 发明申请

US20050107494A1 Latent hardener, process for producing the same, and adhesive containing latent hardener 审中-公开
标题翻译：潜在硬化剂，其制造方法和含有潜在硬化剂的粘合剂
公开(公告)号：US20050107494A1
公开(公告)日：2005-05-19
申请号：US10504769
申请日：2003-02-14
申请人： Takayuki Matsushima , Masao Saito
发明人： Takayuki Matsushima , Masao Saito
IPC分类号： B01J13/04 , C08G59/18 , C08G59/40 , C08G59/68 , C08G59/70 , C08J3/24 , C09J11/00 , C09J163/00 , C09J201/00 , C08K9/10 , C09K3/00
CPC分类号： C09J163/00 , C08G59/18 , C08G59/188 , C08G59/682 , C08G59/70 , C08J3/241 , Y10T156/10 , Y10T428/2998
摘要： A latent curing agent (30) of the present invention includes a core member (31) and a capsule (37) covering up the surface of the core member (31). The core member (31) includes a secondary particle (32) and a curing agent (35) retained in a gap (38) of the secondary particle (32). The curing agent (35) is liquid at ambient temperature. When the capsule (37) is destructed so that the curing agent (35) is emitted into an adhesive, the curing agent (35) is mixed with other ingredients in the adhesive. A metal alcoholate which is liquid at ambient temperature or a metal chelate which is liquid at ambient temperature is used as the curing agent (35), while a silane coupling agent is added to the adhesive. A reaction takes place between the curing agent (35) and the silane coupling agent to yield cations. By these cations, the epoxy resin undergoes cation in polymerization. Since the cation generating reaction proceeds at a temperature lower than in the case of the conventional adhesive, curing proceeds more promptly and at a lower temperature than in the case of the conventional adhesive.
摘要翻译：本发明的潜在性固化剂（30）包括芯部件（31）和覆盖在芯部件（31）的表面上的胶囊（37）。芯构件（31）包括保留在二次颗粒（32）的间隙（38）中的二次颗粒（32）和固化剂（35）。固化剂（35）在环境温度下为液体。当胶囊（37）被破坏使得固化剂（35）被发射到粘合剂中时，固化剂（35）与粘合剂中的其它成分混合。在环境温度下为液体的金属醇化物或在环境温度下为液体的金属螯合物用作固化剂（35），同时将硅烷偶联剂加入到粘合剂中。在固化剂（35）和硅烷偶联剂之间发生反应以产生阳离子。通过这些阳离子，环氧树脂在聚合中经历阳离子。由于阳离子产生反应在比常规粘合剂的情况下低的温度下进行，所以在常规粘合剂的情况下，固化进行得更快且温度更低。

5. 发明申请

US20050096432A1 Two-pack type adhesive 有权
标题翻译：双组分胶粘剂
公开(公告)号：US20050096432A1
公开(公告)日：2005-05-05
申请号：US10505489
申请日：2003-02-14
申请人： Takayuki Matsushima , Masao Saito
发明人： Takayuki Matsushima , Masao Saito
IPC分类号： C09J201/00 , C08G59/18 , C08G59/70 , C08J3/24 , C08L63/00 , C09J5/00 , C09J9/02 , C09J163/00 , H01B1/20 , H01L21/60 , H05K3/32 , C08F8/00
CPC分类号： H05K3/323 , C08G59/18 , C08J3/243 , C08L63/00 , C09J9/02 , C09J163/00 , H01L2224/16 , H01L2224/83101 , H05K2201/0239 , H05K2201/0379 , H05K2203/1163 , H05K2203/121 , Y10T428/31511 , Y10T428/31515
摘要： Disclosed is a two-component adhesive used for electrically and mechanically interconnecting two objects for bonding. The two-component adhesive is made up by first and second adhesive materials separately containing first and second curing agents, respectively. It is only after reaction of the first and second curing agents that the first and second resin components are polymerized. As long as the two adhesive materials are isolated from each other, the adhesive is not cured. In case a metal chelate or a metal alcoholate is used as the first curing agent and a silane coupling agent is used as the second curing agent, cations as a curing component are isolated to cause cationinc polymerization of the first and second resin components to allow for curing at a lower temperature in a shorter time than in case a conventional adhesive is used.
摘要翻译：公开了一种双组分粘合剂，用于将两个物体电连接和机械互连以进行粘结。双组分粘合剂分别由分别含有第一和第二固化剂的第一和第二粘合剂材料制成。仅在第一和第二固化剂反应之后，第一和第二树脂组分聚合。只要两种粘合剂材料彼此分离，粘合剂就不会固化。在使用金属螯合物或金属醇化物作为第一固化剂并且使用硅烷偶联剂作为第二固化剂的情况下，分离作为固化组分的阳离子以使第一和第二树脂组分的阳离子聚合以允许在比使用常规粘合剂的情况下更短的时间内在较低温度下固化。

6. 发明授权

US08044117B2 Latent hardener, process for producing the same, and adhesive containing latent hardener 有权
标题翻译：潜在硬化剂，其制造方法和含有潜在硬化剂的粘合剂
公开(公告)号：US08044117B2
公开(公告)日：2011-10-25
申请号：US12703104
申请日：2010-02-09
申请人： Takayuki Matsushima , Masao Saito
发明人： Takayuki Matsushima , Masao Saito
IPC分类号： C08K9/06 , C08K5/24 , B32B9/00 , B29C65/00
CPC分类号： C09J163/00 , C08G59/18 , C08G59/188 , C08G59/682 , C08G59/70 , C08J3/241 , Y10T156/10 , Y10T428/2998
摘要： A latent curing agent (30) of the present invention includes a core member (31) and a capsule (37) covering up the surface of the core member (31). The core member (31) includes a secondary particle (32) and a curing agent (35) retained in a gap (38) of the secondary particle (32). The curing agent (35) is liquid at ambient temperature. When the capsule (37) is destructed so that the curing agent (35) is emitted into an adhesive, the curing agent (35) is mixed with other ingredients in the adhesive. A metal alcoholate which is liquid at ambient temperature or a metal chelate which is liquid at ambient temperature is used as the curing agent (35), while a silane coupling agent is added to the adhesive. A reaction takes place between the curing agent (35) and the silane coupling agent to yield cations. By these cations, the epoxy resin undergoes cation in polymerization. Since the cation generating reaction proceeds at a temperature lower than in the case of the conventional adhesive, curing proceeds more promptly and at a lower temperature than in the case of the conventional adhesive.
摘要翻译：本发明的潜在性固化剂（30）包括芯部件（31）和覆盖在芯部件（31）的表面上的胶囊（37）。芯构件（31）包括保留在二次颗粒（32）的间隙（38）中的二次颗粒（32）和固化剂（35）。固化剂（35）在环境温度下为液体。当胶囊（37）被破坏使得固化剂（35）被发射到粘合剂中时，固化剂（35）与粘合剂中的其它成分混合。在环境温度下为液体的金属醇化物或在环境温度下为液体的金属螯合物用作固化剂（35），同时将硅烷偶联剂加入到粘合剂中。在固化剂（35）和硅烷偶联剂之间发生反应以产生阳离子。通过这些阳离子，环氧树脂在聚合中经历阳离子。由于阳离子产生反应在比常规粘合剂的情况下低的温度下进行，所以在常规粘合剂的情况下，固化进行得更快且温度更低。

7. 发明申请

US20100143604A1 LATENT HARDENER, PROCESS FOR PRODUCING THE SAME, AND ADHESIVE CONTAINING LATENT HARDENER 有权
标题翻译：最佳硬化剂，其生产方法和含有最终硬化剂的胶粘剂
公开(公告)号：US20100143604A1
公开(公告)日：2010-06-10
申请号：US12703104
申请日：2010-02-09
申请人： Takayuki Matsushima , Masao Saito
发明人： Takayuki Matsushima , Masao Saito
IPC分类号： B05D1/18
CPC分类号： C09J163/00 , C08G59/18 , C08G59/188 , C08G59/682 , C08G59/70 , C08J3/241 , Y10T156/10 , Y10T428/2998
摘要： A latent curing agent (30) of the present invention includes a core member (31) and a capsule (37) covering up the surface of the core member (31). The core member (31) includes a secondary particle (32) and a curing agent (35) retained in a gap (38) of the secondary particle (32). The curing agent (35) is liquid at ambient temperature. When the capsule (37) is destructed so that the curing agent (35) is emitted into an adhesive, the curing agent (35) is mixed with other ingredients in the adhesive. A metal alcoholate which is liquid at ambient temperature or a metal chelate which is liquid at ambient temperature is used as the curing agent (35), while a silane coupling agent is added to the adhesive. A reaction takes place between the curing agent (35) and the silane coupling agent to yield cations. By these cations, the epoxy resin undergoes cation in polymerization. Since the cation generating reaction proceeds at a temperature lower than in the case of the conventional adhesive, curing proceeds more promptly and at a lower temperature than in the case of the conventional adhesive.
摘要翻译：本发明的潜在性固化剂（30）包括芯部件（31）和覆盖在芯部件（31）的表面上的胶囊（37）。芯构件（31）包括保留在二次颗粒（32）的间隙（38）中的二次颗粒（32）和固化剂（35）。固化剂（35）在环境温度下为液体。当胶囊（37）被破坏使得固化剂（35）被发射到粘合剂中时，固化剂（35）与粘合剂中的其它成分混合。在环境温度下为液体的金属醇化物或在环境温度下为液体的金属螯合物用作固化剂（35），同时将硅烷偶联剂加入到粘合剂中。在固化剂（35）和硅烷偶联剂之间发生反应以产生阳离子。通过这些阳离子，环氧树脂在聚合中经历阳离子。由于阳离子产生反应在比常规粘合剂的情况下低的温度下进行，所以在常规粘合剂的情况下，固化进行得更快且温度更低。

8. 发明授权

US07491290B2 Two-pack type adhesive 有权
标题翻译：双组分胶粘剂
公开(公告)号：US07491290B2
公开(公告)日：2009-02-17
申请号：US10505489
申请日：2003-02-14
申请人： Takayuki Matsushima , Masao Saito
发明人： Takayuki Matsushima , Masao Saito
IPC分类号： C09J163/00 , B32B27/38
CPC分类号： H05K3/323 , C08G59/18 , C08J3/243 , C08L63/00 , C09J9/02 , C09J163/00 , H01L2224/16 , H01L2224/83101 , H05K2201/0239 , H05K2201/0379 , H05K2203/1163 , H05K2203/121 , Y10T428/31511 , Y10T428/31515
摘要： Disclosed is a two-component adhesive used for electrically and mechanically interconnecting two objects for bonding. The two-component adhesive is made up by first and second adhesive materials separately containing first and second curing agents, respectively. It is only after reaction of the first and second curing agents that the first and second resin components are polymerized. As long as the two adhesive materials are isolated from each other, the adhesive is not cured. In case a metal chelate or a metal alcoholate is used as the first curing agent and a silane coupling agent is used as the second curing agent, cations as a curing component are isolated to cause cationinc polymerization of the first and second resin components to allow for curing at a lower temperature in a shorter time than in case a conventional adhesive is used.
摘要翻译：公开了一种双组分粘合剂，用于将两个物体电连接和机械互连以进行粘结。双组分粘合剂分别由分别含有第一和第二固化剂的第一和第二粘合剂材料制成。仅在第一和第二固化剂反应之后，第一和第二树脂组分聚合。只要两种粘合剂材料彼此分离，粘合剂就不会固化。在使用金属螯合物或金属醇化物作为第一固化剂并且使用硅烷偶联剂作为第二固化剂的情况下，分离作为固化组分的阳离子以使第一和第二树脂组分的阳离子聚合以允许在比使用常规粘合剂的情况下更短的时间内在较低温度下固化。

9. 发明申请

US20080157030A1 Low-temperature setting adhesive and anisotropically electroconductive adhesive film using the same 有权
标题翻译：低温固化粘合剂和使用其的各向异性导电粘合膜
公开(公告)号：US20080157030A1
公开(公告)日：2008-07-03
申请号：US12010172
申请日：2008-01-22
申请人： Masao Saito , Osamu Takamatsu , Takayuki Matsushima
发明人： Masao Saito , Osamu Takamatsu , Takayuki Matsushima
IPC分类号： H01B1/02 , C08L85/02
CPC分类号： H05K3/323 , C08F290/062 , C08L71/12 , C08L2205/02 , C08L2312/00 , C08L2666/02 , C09J4/00 , C09J7/10 , C09J9/02 , C09J11/08 , C09J133/068 , C09J163/10 , C09J2201/602 , C09J2463/00 , H01L21/6835 , H01L24/29 , H01L24/83 , H01L2224/16 , H01L2224/2919 , H01L2224/83101 , H01L2224/8319 , H01L2224/838 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/07811 , H05K2201/0239 , Y10T428/14 , Y10T428/1462 , Y10T428/31935 , C08F220/32 , H01L2924/00 , H01L2924/3512
摘要： An insulating adhesive film and an anisotropically electroconductive adhesive film satisfying low-temperature curability, high adhesion and high reliability are provided. An anisotropically electroconductive adhesive film of the present invention is so configured that electroconductive particles 7 are dispersed in an insulating adhesive resin 6, comprising as main components: a radical polymerizable resin component having an unsaturated double bond; a resin component having no unsaturated double bond; a phosphoric acid-containing resin component; and a radical polymerization initiator.
摘要翻译：提供了一种满足低温固化性，高粘合性和高可靠性的绝缘粘合膜和各向异性导电粘合剂膜。本发明的各向异性导电粘合剂膜是这样构成的，其中导电颗粒7分散在绝缘粘合树脂6中，其包括作为主要成分的具有不饱和双键的自由基聚合性树脂组分; 不具有不饱和双键的树脂组分; 含磷酸树脂组分; 和自由基聚合引发剂。

10. 发明授权

US06831117B2 Hardener particle, manufacturing method for hardener particle and adhesive 有权
标题翻译：硬化剂颗粒，硬化剂颗粒和粘合剂的制造方法
公开(公告)号：US06831117B2
公开(公告)日：2004-12-14
申请号：US10310517
申请日：2002-12-05
申请人： Takayuki Matsushima
发明人： Takayuki Matsushima
IPC分类号： C08K906
CPC分类号： C08K5/544 , C08K9/08 , Y10T428/2962 , Y10T428/2982 , Y10T428/2995 , Y10T428/31663
摘要： With the hardener particle of the present invention, because siloxane or an alkoxy group is bonded to a central metal located on a surface, an adhesive prepared by dispersing the hardener particles in an epoxy resin together with a silane coupling agent hardly causes reaction between the hardener particles and the silane coupling agent at ambient temperature whereby the preserving property of the adhesive is high. Because no siloxane is bonded to metal chelate or metal alcoholate at the part other than the surface of the hardener particles, the hardener particles are broken when the adhesive is heated, and the metal chelate and the metal alcoholate on the part other than the surface of the hardener particles reacts with the silane coupling agent to form cation, thereby polymerizing the epoxy resin with the cation to harden the adhesive even at low temperature within shorter time.
摘要翻译：对于本发明的固化剂颗粒，由于硅氧烷或烷氧基与位于表面的中心金属结合，通过将固化剂颗粒与硅烷偶联剂一起分散在环氧树脂中而制备的粘合剂几乎不引起固化剂颗粒和硅烷偶联剂，从而粘合剂的保存性能很高。由于在硬化剂颗粒表面以外的部分没有硅氧烷键合到金属螯合物或金属醇化物上，所以当加热粘合剂时，硬化剂颗粒破裂，金属螯合物和金属醇化物硬化剂颗粒与硅烷偶联剂反应形成阳离子，从而使环氧树脂与阳离子聚合，即使在较短时间内也在低温下硬化粘合剂。

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