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1. 发明专利

JP2009246067A Method for pasting heated adhesive tape to substrate and pasting equipment 有权
标题翻译：将加热胶带粘贴到基板和抛光设备的方法
公开(公告)号：JP2009246067A
公开(公告)日：2009-10-22
申请号：JP2008089329
申请日：2008-03-31
申请人： Takatori Corp , 株式会社タカトリ
发明人： ASHIDA TAKAHIRO , TANIGAWA SHIGEKI
IPC分类号： H01L21/683
摘要： PROBLEM TO BE SOLVED: To enable pasting of an adhesive tape onto a substrate with no wrinkles nor air bubbles, even though it is an adhesive tape requiring heated pasting as well as pasting an adhesive tape in a shape smaller than the contour of the substrate. SOLUTION: A substrate W is sucked and held onto a supporting pin 9 set upward apart from the placement surface of a placement table 8, a non-adhesive face of a heated adhesive tape T cut to a diameter smaller than the contour of the substrate W by a heated adhesive tape cutter f is sucked and held onto a suction table 41 that is up-down movable and capable to swing and move from the heated adhesive tape cutter f to the placement table 8, and after the heated adhesive tape T is brought in a slanted state right above the substrate, the placement table 8 is raised as far as the lower surface position of the substrate W, thus heating the substrate W by the heated placement table 8, the inclined-lowering side part of the heated adhesive tape T is superimposed onto the substrate W by the descent of the suction table 41, and by swinging the suction table 41 under a vacuum with the inclined-lowering side as a base point, the whole adhesive surface of the heated adhesive tape T is pressure-bonded onto the substrate W, thus pasting the heated adhesive tape T onto the substrate W. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了能够将粘合带粘贴到基材上而没有皱纹和气泡，即使是需要加热粘贴的粘合带以及将粘合带粘贴成小于轮廓的形状底物。解决方案：将衬底W吸附并保持在从放置台8的放置表面向上分离的支撑销9上，将加热的粘合带T的非粘合面切割成小于轮廓的直径通过加热的胶带切割器f将基板W吸引并保持在能够上下移动并能够从加热的胶带切割器f摆动并移动到放置台8的吸盘41上，并且在加热的粘合带 T被放置在基板正上方的倾斜状态下，放置台8升高到基板W的下表面位置，从而通过加热放置台8加热基板W，使基板W的倾斜下降部分加热粘合带T通过吸水台41的下降而叠加到基板W上，并且通过以倾斜下降侧作为基点在真空下摆动吸盘41，将加热的粘合带T的整个粘合表面是压力b 涂覆在基材W上，从而将加热的粘合带T粘贴到基材W上。版权所有（C）2010，JPO＆INPIT

2. 发明专利

JP2009044008A Protective tape peeling method and device for wafer 有权
标题翻译：保护胶带剥离方法及其设备
公开(公告)号：JP2009044008A
公开(公告)日：2009-02-26
申请号：JP2007208426
申请日：2007-08-09
申请人： Takatori Corp , 株式会社タカトリ
发明人： ASHIDA TAKAHIRO , OKITA YOJI
IPC分类号： H01L21/683 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a peeling method and a peeling device for peeling a protective tape off a wafer without breaking the wafer having an inner peripheral ground surface and an outer circumferential rib surface formed by grinding an inner peripheral part to a prescribed thickness while leaving an outer circumferential part of the wafer having the protective tape stuck on its surface. SOLUTION: The peeling device for the protective tape 2 which sticks a peeling tape 12 on a surface of the protective tape 2 from the wafer having the inner peripheral ground surface and an outer circumferential rib formed by grinding the inner peripheral part to the prescribed thickness while leaving a rear-surface outer circumference of the wafer 1 having the protective tape 2 stuck on the front surface and peels the protective tape 2 off the wafer surface integrally with the peeling tape 12 is provided with a sticking means for the peeling tape 12 which sticks the peeling tape on the front surface of the protective tape 2, an inner periphery table 6 supporting the inner peripheral ground surface of the wafer 1, and an outer circumference table 8 supporting the outer circumferential rib surface of the wafer 1, wherein while the outer circumference table 8 is configured to move up and down relatively to the inner periphery table 6, the inner periphery table 6 and outer circumference table 8 are configured to horizontally move in one body. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：解决的问题：提供一种剥离方法和剥离装置，用于将保护带从晶片上剥离，而不破坏具有通过研磨内周部分到内部形成的内周接地面和外周肋表面的晶片同时留下具有粘附在其表面上的保护带的晶片的外周部分。＆lt; P＆gt;解决方案：将保护带2的剥离带12从具有内周接地面的晶片和保护带2的表面上粘贴的保护带2的剥离装置和通过研磨内周部分形成的外周肋规定的厚度，同时留下具有保护带2的背面外周，并且将保护带2与剥离带12一体地剥离在保护带2之外，设置有用于剥离带的粘贴装置将剥离带粘贴在保护带2的前表面上的支撑着晶片1的内周面的内周台6和支承晶片1的外周肋面的外周台8，而外圆周台8构造成相对于内周台6，内周台6和外周上下移动表8被配置为在一个身体中水平移动。版权所有（C）2009，JPO＆INPIT

3. 发明专利

JP2006278927A Method and device for pasting tape to wafer 有权
标题翻译：用于将胶带粘贴到水中的方法和装置
公开(公告)号：JP2006278927A
公开(公告)日：2006-10-12
申请号：JP2005098903
申请日：2005-03-30
申请人： Takatori Corp , 株式会社タカトリ
发明人： UEDA YOSHIAKI , ASHIDA TAKAHIRO , TANAKA HIROTAKA
IPC分类号： H01L21/683 , H01L21/301
摘要： PROBLEM TO BE SOLVED: To provide a method of pasting which can reduce a running cost of tape, attain a process characterized by low tension for pasting tape, and generate no air bubbles under vacuum simultaneously. SOLUTION: A masking tape 3, drawn at a location just above an absorption table 39 on which a wafer 1 is mounted, is fixed by pasting to tape supporting plates 42, 43 at a raising position, then at a time of pasting work, each tape supporting plates 42, 43 is independently lowered as a paste roller 51 advances, and at least one tape supporting plate 42 is made to be movable in a tension relieving direction by a tension relieving mechanism 68. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供可以降低带的运行成本的粘贴方法，获得以粘贴带的低张力为特征的工艺，同时在真空下不产生气泡。解决方案：在位于其上安装有晶片1的吸收台39正上方的位置处的胶带3通过在提升位置粘贴到带支撑板42,43上，然后在粘贴时被固定工作时，每个胶带支撑板42,43在糊辊51前进时独立地降低，并且至少一个带支撑板42通过张力释放机构68在张力释放方向上可移动。 C）2007，JPO＆INPIT

4. 发明专利

JP2011167810A Wire saw 审中-公开
标题翻译：电线
公开(公告)号：JP2011167810A
公开(公告)日：2011-09-01
申请号：JP2010034178
申请日：2010-02-19
申请人： Takatori Corp , 株式会社タカトリ
发明人： TANIHATA YOICHI , MATSUO KATSUTOSHI , ASHIDA TAKAHIRO
IPC分类号： B24B27/06 , B28D5/04 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a wire saw which can accurately cut a workpiece into a number of pieces. SOLUTION: In the wire saw, a plurality of sets of a pair of groove rollers are provided, and at least two sets of workpiece cutting parts 11a, 11b are provided in which a wire array is formed between each of the pair of groove rollers 10a, 10b respectively by winding one wire 4 between the plurality of sets of the pair of groove rollers 10a, 10b into a multirow shape. The same number of a wire supply mechanism and a wire winding mechanism are provided as the number of the workpiece cutting parts 11 between each of pair of groove rollers 10a, 10b. Furthermore, the same number of workpiece holding tables 30 as the number of workpiece cutting parts 11 are provided. These workpiece holding tables 30 are composed of base plates 31 having free vertical movement with respect to the wire array, and workpiece holding frames 35 which are provided on the base plates 31 in parallel, holds a workpiece W, and rotatably provided around the turning shaft provided in the direction of the vertical axis of workpiece W, and performs the oscillating circular arc movement of the workpiece W itself by reciprocating the workpiece holding frame 35. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种可以将工件精确地切割成多个件的线锯。解决方案：在线锯中，设置多组一对沟槽辊，并且设置至少两组工件切削部分11a，11b，其中在一对沟槽辊10a，10b分别通过将一对丝线4缠绕在一对凹槽滚子10a，10b的多组之间成为多重的形状。作为在一对槽辊10a，10b中的每一个之间的工件切削部11的数量，设置有相同数量的供线机构和线绕机构。此外，设置与工件切割部11的数量相同数量的工件保持台30。这些工件保持台30由相对于线阵列具有自由垂直运动的基板31和平行地设置在基板31上的工件保持框35构成，保持工件W，并且可旋转地设置在转轴设置在工件W的纵轴方向上，通过使工件夹持框架35往复运动来进行工件W本身的摆动圆弧运动。（C）2011，JPO＆INPIT

5. 发明专利

JP2006073603A Alignment method of wafer 审中-公开
标题翻译： WAFER对准方法
公开(公告)号：JP2006073603A
公开(公告)日：2006-03-16
申请号：JP2004252127
申请日：2004-08-31
申请人： Takatori Corp , 株式会社タカトリ
发明人： ASHIDA TAKAHIRO , TANAKA ZENJI
IPC分类号： H01L21/68 , B65G49/07 , H01L21/677
摘要： PROBLEM TO BE SOLVED: To provide an alignment method of a wafer capable of recognizing only the outer periphery of the wafer even if a tape or the like protrudes from the outer periphery of the wafer for precision alignment with no damage on the wafer nor occurrence of dirt. SOLUTION: A wafer 1 of which at least a surface is pasted with a protection tape 2 is held and rotated by a suction turntable 21. An infrared emission element 23 of an infrared radiation unit 22 and a CCD camera 24 are used for alignment to detect the outer periphery of the wafer 1, by non-contact manner, using infrared ray. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种能够仅识别晶片的外周的晶片的对准方法，即使带等从晶片的外周突出，用于精确对准，也没有损坏晶片也不会发生污垢。解决方案：至少一个表面用保护带2粘贴的晶片1由吸入转盘21保持和转动。红外辐射单元22的红外发射元件23和CCD照相机24用于对准以通过非接触的方式使用红外线检测晶片1的外周。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2011077392A Cleaning method of wafer 审中-公开
标题翻译：清洗方法
公开(公告)号：JP2011077392A
公开(公告)日：2011-04-14
申请号：JP2009228725
申请日：2009-09-30
申请人： Takatori Corp , 株式会社タカトリ
发明人： ASHIDA TAKAHIRO , MORITA MASAHIRO
IPC分类号： H01L21/304 , B24B27/06
摘要： PROBLEM TO BE SOLVED: To provide a cleaning method of a wafer capable of effectively cleaning wafer in the state wherein the gap between wafers is maintained after a work is cut by a wire-saw. SOLUTION: A nozzle 70 for a holding liquid is advanced along a side of a work 34 in the state wherein a wire row is left between wafers 40 of the work 34 after cutting, the nozzle 70 for the holding liquid sprays the holding liquid 36 to adhere the holding liquid 36 to the side of the work 34 so as to intervene in gaps between wafers 40 and to hold gaps between wafers 40 by the holding liquid 36, a brush member 45 is contact with and is advanced toward gaps between wafers 40 by housing a removed work 34 in a lower chamber 76 where the brush member 45 contacting with the side of the wafer 40 is provided. Then a supporting plate 30 is separated from a pasting table 29, an upper chamber 82 connected to a cleaning liquid tank 54 is closed to form a vacuum chamber in a pressure reduced state, then the wafer is cleaned by feeding the cleaning liquid 83 into the vacuum chamber. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够在通过线锯切割工件之后保持晶片之间的间隙的状态下能够有效地清洁晶片的晶片的清洁方法。解决方案：用于保持液体的喷嘴70在切割后在工件34的晶片40之间留下线排的状态下沿着工件34的侧面前进，用于保持液体的喷嘴70喷射保持液体36将保持液体36粘附到工件34的侧面，以便介入晶片40之间的间隙中，并且通过保持液体36保持晶片40之间的间隙，刷构件45与第三晶片40之间的间隙接触并前进到晶片40通过在下部腔室76中容纳移除的工件34，其中刷子45与晶片40的一侧接触。然后，将支撑板30与粘贴工作台29分离，将与清洗液箱54连接的上部室82关闭，形成减压状态的真空室，然后通过将清洗液83送入真空室。版权所有（C）2011，JPO＆INPIT

7. 发明专利

JP2004087660A Method and device for transferring wafer to dicing tape 有权
标题翻译：将波形传送到定位带的方法和装置
公开(公告)号：JP2004087660A
公开(公告)日：2004-03-18
申请号：JP2002244879
申请日：2002-08-26
申请人： Takatori Corp , 株式会社タカトリ
发明人： MORITA MASAHIRO , ASHIDA TAKAHIRO
IPC分类号： H01L21/301
摘要： PROBLEM TO BE SOLVED: To provide a method for transferring a wafer for preventing air bubbles or wrinkle from being generated between contact faces of a dicing tape and the wafer, for preventing a supporting substrate and the dicing tape from being brought into contact with each other at the time of transferring the wafer to the dicing tape, and for preventing the generation of the break, crack or deformation of the wafer at the time of handling or dicing the thin wafer and caused by the lapse of time. SOLUTION: A wafer 1 whose pattern formation face is attached to a supporting member 3 with a double-sided adhesive tape 2 (i) absorbed and supported on an absorbing table 48 while the wafer 1 is positioned at the upper part, processing to reduce the adhesive force of the double-sided adhesive tape 2 is performed to the wafer 1, and a dicing frame 5 attached with the dicing tape 4 is supplied to the wafer 1. The dicing tape 4 and the wafer 1 are attached in a vacuum, the double-sided adhesive tape 2 and the wafer 1 are peeled after the adhesion, and the wafer 1 is transferred to the dicing tape 4. COPYRIGHT: (C)2004,JPO
摘要翻译：解决的问题：提供一种转印用于防止在切割带和晶片的接触面之间产生气泡或皱纹的晶片的方法，用于防止支撑衬底和切割带接触在将晶片转移到切割带的同时，并且用于防止在处理或切割薄晶片时由于时间的流逝而导致晶片的断裂，裂纹或变形的产生。解决方案：晶片1的图案形成面用双面胶带2（i）安装在支撑部件3上，（i）在晶片1位于上部时被吸收并支撑在吸收台48上，处理为了降低双面胶带2对胶片1的粘合力，将附着有切割胶带4的切割框5供给到晶片1.切割胶带4和晶片1安装在真空后，粘合后剥离双面胶带2和晶片1，将晶片1转印到切割胶带4上。（C）2004，JPO

8. 发明专利

JPH03273662A SHIFTER FOR WAFER 失效
公开(公告)号：JPH03273662A
公开(公告)日：1991-12-04
申请号：JP7380890
申请日：1990-03-23
申请人： TAKATORI HITECH CO , TAKATORI CORP
发明人： NISHIKAWA MASAO , ASHIDA TAKAHIRO
IPC分类号： H01L21/677 , H01L21/68
摘要： PURPOSE:To conduct operation, in which wafers are shifted to a board formed at pitches narrower than a wafer cassette, automatically, and to save the labor of operation and improve efficiency by altering a wafer group, held on the wafer cassette at regular intervals, at the regular intervals of pitches narrower than the wafer cassette by a pitch changing plate and shifting the wafer group to the board. CONSTITUTION:A movable carriage 11 is supported by a pair of rails 10 and 10 in the transfer line 4 of a wafer cassette 1, and the transfer line 4 is moved along the parallel direction of wafers A. A board 2 is moved in the parallel direction of the wafers A by a pair of rails 12, 12 and a movable carriage 13 in the same manner even in the transfer line 5 of the board 2. A pair of pitch changing plates 7 are fixed at the upper ends of struts 14, and arranged in opposite positions on both sides in the diametral direction of the wafers A in the upper section of the wafer cassette 1 stopped at the position X of shifting. Both pitch changing plates 7, 7 are faced oppositely at intervals slightly narrower than the diameter of the wafers A, and a large number of pitch changing grooves 15, 15, into which both side sections of the outer circumferences of the wafers A lifted between both plates 7, 7 are fitted, are formed along the vertical direction to oppositely faced surfaces.

9. 发明专利

JP2001319906A DEVICE FOR PEELING WAFER SURFACE PROTECTIVE TAPE 失效
公开(公告)号：JP2001319906A
公开(公告)日：2001-11-16
申请号：JP2000138193
申请日：2000-05-11
申请人： TAKATORI CORP
发明人： ASHIDA TAKAHIRO , OKITA YOJI
IPC分类号： H01L21/683 , H01L21/304 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide a wafer surface protective tape peeling device capable of not only automatically restraining a releasing tape from adhering to or being automatically released from a dicing tape or a ring frame when a releasing tape is pasted on the surface of a wafer, but also peeling off a wafer surface protective tape with the releasing tape without causing cracking to a wafer or giving any stress on the wafer. SOLUTION: A wafer 1 mounted in a ring frame 4 is sucked and fixed to a suction table 23, mask plates 16 covering the surfaces of a dicing tape 3 and a ring frame 4 are each disposed in a vertically swingable manner at the front or rear of the suction table 23 in the pasting direction of the releasing tape 4, a releasing tape 14 is bonded on a surface protective tape 2 between the feed part and take-up part; of the releasing tape 14, then a separating unit 33 for separating the protective tape 2 from the surface of a wafer is provided, and the surface protective tape 2 is separated off from the surface of the wafer 1, simultaneously as the protective tape peeling angle of the releasing tape 14 is made acute by the separating unit 33.

10. 发明专利

JP2001148412A METHOD AND DEVICE FOR STICKING PROTECTIVE TAPE TO SEMICONDUCTOR WAFER 失效
公开(公告)号：JP2001148412A
公开(公告)日：2001-05-29
申请号：JP32900899
申请日：1999-11-19
申请人： TAKATORI CORP
发明人： ASHIDA TAKAHIRO , TANIGAWA SHIGEKI
IPC分类号： H01L21/683 , H01L21/304 , H01L21/306 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide a method for sticking a protective tape to a semiconductor wafer capable of suppressing the infiltration of polishing liquid and etching liquid from the boundary of a wafer surface and the protective tape, by sticking the protective tape on the inner side of the outer peripheral edge of the wafer without forming wrinkles or air bubbles in the protective tape stuck to the wafer. SOLUTION: A positioned and supplied semiconductor wafer W is chucked and fixed on a mounting table 11, the protective tape T cut into a size and a shape matched with the outer shape of the semiconductor wafer W in a protective tape cutting part VI is chucked and held by a vacuum chuck table 49 vertically movable and swingable from the protective tape cutting part VI to the mounting table 11, the vacuum chuck table 49 is moved onto the mounting table 11 in a tilted state and the protective tape T is made to face right above the semiconductor wafer W. The part on a tilted lower side of the protective tape T is piled up on the semiconductor wafer W by lowering the table 49, the table 49 is horizontally swung with the inclination lower side as a base point inside a vacuum atmosphere and thus, the entire adhesive surface of the protective tape T is press-fitted onto the semiconductor wafer W.

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