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1. 发明授权

US08963324B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US08963324B2
公开(公告)日：2015-02-24
申请号：US14225519
申请日：2014-03-26
申请人： Takato Sato , Yukio Onishi , Hiroyuki Kono , Hiroaki Yoshizawa , Toshio Watari , Hiromi Yamasaki
发明人： Takato Sato , Yukio Onishi , Hiroyuki Kono , Hiroaki Yoshizawa , Toshio Watari , Hiromi Yamasaki
IPC分类号： H01L23/34 , H01L23/40 , H01L23/367
CPC分类号： H01L23/40 , H01L23/3672 , H01L23/4006 , H01L23/4338 , H01L2924/0002 , H01L2924/00
摘要： In a semiconductor device, a semiconductor module is pressed against a cooler by a spring member. The spring member is compressed by a beam member that is connected with a strut fixed to the cooler. The cooler has a pressed part in which the semiconductor module is pressed, and a strut fixing part to which the strut is fixed. The strut fixing part has higher rigidity than the pressed part.
摘要翻译：在半导体器件中，半导体模块通过弹簧部件压靠在冷却器上。弹簧构件由与固定到冷却器的支柱连接的梁构件压缩。冷却器具有按压部件，半导体模块被按压在其中，支柱固定部分固定支柱。支柱固定部件具有比被按压部件更高的刚性。

2. 发明授权

US09326409B2 Electric component 有权
标题翻译：电气部件
公开(公告)号：US09326409B2
公开(公告)日：2016-04-26
申请号：US14398793
申请日：2012-09-26
申请人： Takato Sato
发明人： Takato Sato
IPC分类号： H01L23/48 , H05K7/02 , B60K6/00 , B60W10/00
CPC分类号： H05K7/02 , B60K6/00 , B60L3/003 , B60L15/02 , B60L2210/10 , B60W10/00 , H01L23/48 , H01L2924/0002 , Y02T10/7216 , H01L2924/0001 , H01L2924/00
摘要： The electric component includes first and second members 30 and 40, at least one of which being used as an electric conductor. The first member includes a bus bar 31 and a resin member 32 for covering the bar and has a predetermined area where they expose to the exterior. The second member has an exposing portion where the surface of the aluminum wire 44 exposes and the exposing portion faces portions (H1, H3) where the bar 31 exposes to the exterior at the predetermined area. The first and second members are supported by a housing 10 including a resin at least having a part exposing to the exterior. In this electric component, the first member is configured such that the contact angle of the water droplet relative to the surface of the resin member 32 within the predetermined area is smaller than or equal to 70 degrees.
摘要翻译：电气部件包括第一和第二部件30和40，其中至少一个被用作电导体。第一构件包括母线31和用于覆盖杆的树脂构件32，并且具有暴露于外部的预定区域。第二构件具有暴露部分，其中铝线44的表面暴露，并且曝光部分面对条31在预定区域处暴露于外部的部分（H1，H3）。第一和第二构件由包括至少具有暴露于外部的部分的树脂的壳体10支撑。在该电气部件中，第一部件被配置为使得水滴相对于树脂部件32在规定区域内的表面的接触角小于或等于70度。

3. 发明申请

US20150116949A1 ELECTRIC COMPONENT 有权
标题翻译：电气部件
公开(公告)号：US20150116949A1
公开(公告)日：2015-04-30
申请号：US14398793
申请日：2012-09-26
申请人： Takato Sato
发明人： Takato Sato
IPC分类号： H05K7/02
CPC分类号： H05K7/02 , B60K6/00 , B60L3/003 , B60L15/02 , B60L2210/10 , B60W10/00 , H01L23/48 , H01L2924/0002 , Y02T10/7216 , H01L2924/0001 , H01L2924/00
摘要： The electric component includes first and second members 30 and 40, at least one of which being used as an electric conductor. The first member includes a bus bar 31 and a resin member 32 for covering the bar and has a predetermined area where they expose to the exterior. The second member has an exposing portion where the surface of the aluminum wire 44 exposes and the exposing portion faces portions (H1, H3) where the bar 31 exposes to the exterior at the predetermined area. The first and second members are supported by a housing 10 including a resin at least having a part exposing to the exterior. In this electric component, the first member is configured such that the contact angle of the water droplet relative to the surface of the resin member 32 within the predetermined area is smaller than or equal to 70 degrees.
摘要翻译：电气部件包括第一和第二部件30和40，其中至少一个被用作电导体。第一构件包括母线31和用于覆盖杆的树脂构件32，并且具有暴露于外部的预定区域。第二构件具有暴露部分，其中铝线44的表面暴露，并且曝光部分面对条31在预定区域处暴露于外部的部分（H1，H3）。第一和第二构件由包括至少具有暴露于外部的部分的树脂的壳体10支撑。在该电气部件中，第一部件被配置为使得水滴相对于树脂部件32在规定区域内的表面的接触角小于或等于70度。

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