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1. 发明授权

US08535159B2 Information processing method and server system 有权
标题翻译：信息处理方法和服务器系统
公开(公告)号：US08535159B2
公开(公告)日：2013-09-17
申请号：US12368613
申请日：2009-02-10
申请人： Takashi Umaki , Kunihiko Minakata , Kazuo Takahashi , Hironori Ikeda
发明人： Takashi Umaki , Kunihiko Minakata , Kazuo Takahashi , Hironori Ikeda
IPC分类号： A63F9/24
CPC分类号： A63F13/798 , A63F13/00 , A63F13/46 , A63F2300/5593 , A63F2300/61
摘要： A league is formed by a given number of teams formed by a plurality of players and having an identical team level, and the teams compete for league ranking based on team points obtained in a given period. A team level of each team is changed based on the league ranking. The player plays a game using a game device to obtain the team points.
摘要翻译：联盟由多名球员组成的队伍组成，具有相同的队伍水平，球队根据给定时间段内获得的球队积分，争取联赛排名。每个队伍的队伍水平根据联赛排名而改变。玩家使用游戏设备玩游戏以获得团队积分。

2. 发明授权

US08052532B2 Information processing method and server system 有权
标题翻译：信息处理方法和服务器系统
公开(公告)号：US08052532B2
公开(公告)日：2011-11-08
申请号：US12368664
申请日：2009-02-10
申请人： Takashi Umaki , Kunihiko Minakata , Kazuo Takahashi , Hironori Ikeda
发明人： Takashi Umaki , Kunihiko Minakata , Kazuo Takahashi , Hironori Ikeda
IPC分类号： A63F9/24
CPC分类号： A63F13/795 , A63F13/00 , A63F13/46 , A63F2300/61
摘要： A league is formed by a given number of teams formed by a plurality of players and having an identical team level, and the teams compete for league ranking based on team points obtained in a given period. A team level of each team is changed based on the league ranking. A player plays a game using a game device to obtain the team points. When the number of teams is less than the given number when forming a league, a mirror team of the team that belongs to another league is added. The team points of the mirror team are calculated separately from the team points of the actual team to determine league ranking in the league of the mirror team. The team level of the actual team of the mirror team is changed based on the league ranking of the actual team and the league ranking of the mirror team.
摘要翻译：联盟由多名球员组成的队伍组成，具有相同的队伍水平，球队根据给定时间段内获得的球队积分，争取联赛排名。每个队伍的队伍水平根据联赛排名而改变。玩家使用游戏设备玩游戏以获得团队积分。当组队数量少于特定数量时，加入属于另一个联盟的队伍的镜像队。镜队的团队点与实际队伍的团队点分开计算，以确定镜队联赛中的联赛排名。镜队实战队伍的队伍水平根据实际球队的联赛排名和镜像队的联赛排名而改变。

3. 发明授权

US6120716A Epoxy resin sealing material for molding semiconductor chip and method for manufacturing the same 有权
标题翻译：用于模制半导体芯片的环氧树脂密封材料及其制造方法
公开(公告)号：US6120716A
公开(公告)日：2000-09-19
申请号：US147799
申请日：1999-03-10
申请人： Takanori Kushida , Akio Kobayashi , Yosuke Obata , Hironori Ikeda , Taro Fukui , Masashi Nakamura
发明人： Takanori Kushida , Akio Kobayashi , Yosuke Obata , Hironori Ikeda , Taro Fukui , Masashi Nakamura
IPC分类号： C08L63/00 , H01L23/29 , B29B9/08
CPC分类号： C08L63/00 , H01L23/293 , H01L2924/0002
摘要： An epoxy resin encapsulating material for molding in a semiconductor chip by the use of a transfer molding device. The material has constituents of an epoxy resin, a curing agent, an inorganic filler, and a release agent. The material consists of 99 wt % or more of granules having a diameter of 0.1 to 5.0 mm and 1 wt % or less of minute particles having a diameter of less than 0.1 mm. The mass of the material exhibit an angle of slide of 20 to 40.degree., which demonstrates good flowability free from clogging a passage leading to a mold cavity in the transfer molding device, thereby assuring enhanced encapsulation quality. The material is prepared firstly by kneading the encapsulating composition having the above constituents and by solidifying the composition into a semi-cured solid body of B-stage condition. The sem-cured solid body is then pulverized into pieces having a diameter of 5.0 mm or less. The pieces are composed of granules having a diameter of 0.1 mm to 5.0 mm and minute particles having a diameter of less than 0.1 mm. Subsequently, heat is applied to melt a resin component of the encapsulating composition in the surfaces of the granules while continuously moving the granules so as to entrap the minute particles in a molten phase of the resin component. Thereafter, the molten phase is cooled to obtain epoxy resin encapsulating grains coated with a resin layer incorporating the minute particles having the diameter of less than 0.1 mm.
摘要翻译： PCT No.PCT / JP97 / 02774 Sec。 371 1999年3月10日 102（e）1999年3月10日PCT PCT 1997年8月7日PCT公布。公开号WO99 / 08321 1999年2月18日，日本专利公开了一种用于通过传递模塑装置在半导体芯片中成型的环氧树脂封装材料。该材料具有环氧树脂，固化剂，无机填料和脱模剂的成分。该材料由直径为0.1〜5.0mm，直径小于0.1mm的微粒的1wt％以下的99wt％以上的颗粒构成。材料的质量表现出20〜40°的滑动角度，这表现出良好的流动性，没有堵塞通向传送模制装置中的模腔的通道，从而确保了增强的封装质量。首先通过捏合具有上述组分的包封组合物并将组合物固化成B阶状态的半固化固体物质。然后将半固化的固体粉碎成直径为5.0mm以下的片。这些片由直径为0.1mm至5.0mm的颗粒和直径小于0.1mm的微小颗粒组成。随后，在颗粒表面连续移动颗粒以使微小颗粒在树脂组分的熔融相中截留，施加热量以熔化颗粒表面中的包封组合物的树脂组分。然后，将熔融相冷却，得到涂布有直径小于0.1mm的微小粒子的树脂层的环氧树脂封装晶粒。

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