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1. 发明授权

US6144753A Damper for a speaker apparatus 失效
标题翻译：扬声器设备的阻尼器
公开(公告)号：US6144753A
公开(公告)日：2000-11-07
申请号：US848716
申请日：1997-05-19
申请人： Takashi Ohyaba , Shunichi Takahashi , Showichiro Terauchi , Takanobu Saito , Tatsuya Ando , Yoshiya Usami , Hiroyuki Kataoka
发明人： Takashi Ohyaba , Shunichi Takahashi , Showichiro Terauchi , Takanobu Saito , Tatsuya Ando , Yoshiya Usami , Hiroyuki Kataoka
IPC分类号： B29C45/00 , B29K59/00 , B29K67/00 , B29L31/38 , H04R9/02 , H04R9/06 , H04R25/00
CPC分类号： H04R9/06 , Y10T29/49005 , Y10T29/4908 , Y10T29/53883
摘要： A speaker apparatus has a damper for supporting vibrating elements including a vibrating diaphragm. The damper is formed by injecting a predetermined amount of a resin material into a metal mold of an injection molding equipment.
摘要翻译：扬声器装置具有用于支撑包括振动膜的振动元件的阻尼器。阻尼器通过将预定量的树脂材料注入到注塑设备的金属模具中而形成。

2. 发明授权

US5848173A Surroundless loudspeaker 失效
标题翻译：无声扬声器
公开(公告)号：US5848173A
公开(公告)日：1998-12-08
申请号：US623381
申请日：1996-03-28
申请人： Yoko Sato , Satoshi Kumada , Ziging Zhang , Junko Oba , Shinji Koyano , Takashi Morishige , Kohshiro Kogure , Yuichi Mohri , Tomohiro Suenaga , Shouichiro Terauchi , Tatsuya Ando , Takanobu Saito , Takashi Ohyaba , Shunichi Takahashi , Teruo Baba
发明人： Yoko Sato , Satoshi Kumada , Ziging Zhang , Junko Oba , Shinji Koyano , Takashi Morishige , Kohshiro Kogure , Yuichi Mohri , Tomohiro Suenaga , Shouichiro Terauchi , Tatsuya Ando , Takanobu Saito , Takashi Ohyaba , Shunichi Takahashi , Teruo Baba
IPC分类号： H04R7/18 , H04R9/04 , H04R9/06 , H04R25/00
CPC分类号： H04R9/046 , H04R7/18 , H04R9/06
摘要： A cylindrical frame is mounted in a cabinet and a magnetic circuit is provided at an end of the frame. A diaphragm having a peripheral free edge is connected to a coil bobbin and a cylindrical ring is secured to the free end edge and disposed in a cylindrical supporting portion of the frame. An annular sealing member is secured to the cylindrical ring so that an outside peripheral wall thereof is slidably contacted with an inside wall of the cylindrical supporting portion of the frame.
摘要翻译：圆柱形框架安装在机柜中，并且磁路设置在框架的一端。具有周边自由边缘的隔膜连接到线圈架，并且圆柱形环固定到自由端边缘并且设置在框架的圆柱形支撑部分中。环形密封构件固定到圆柱形环上，使得其外围壁与框架的圆柱形支撑部分的内壁可滑动地接触。

3. 发明授权

US07271466B2 Semiconductor device with sidewall wiring 有权
标题翻译：具有侧壁接线的半导体器件
公开(公告)号：US07271466B2
公开(公告)日：2007-09-18
申请号：US11206146
申请日：2005-08-18
申请人： Takashi Noma , Hiroyuki Shinogi , Nobuyuki Takai , Katsuhiko Kitagawa , Ryoji Tokushige , Takayasu Otagaki , Tatsuya Ando , Mitsuru Okigawa
发明人： Takashi Noma , Hiroyuki Shinogi , Nobuyuki Takai , Katsuhiko Kitagawa , Ryoji Tokushige , Takayasu Otagaki , Tatsuya Ando , Mitsuru Okigawa
IPC分类号： H01L29/40
CPC分类号： H01L24/10 , H01L23/3114 , H01L24/13 , H01L2224/05548 , H01L2224/05556 , H01L2224/05573 , H01L2224/13 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01021 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/00
摘要： Cost is reduced and reliability is improved with a BGA (Ball Grid Array) type semiconductor device which has ball-shaped conductive terminals. A first wiring is formed on an insulation film which is formed on a surface of a semiconductor die. A glass substrate is bonded over the surface of the semiconductor die, and a side surface and a back surface of the semiconductor die are covered with an insulation film. A second wiring is connected to a side surface or a back surface of the first wiring and extending over the back surface of the semiconductor die. A conductive terminal such as a bump is formed on the second wiring.
摘要翻译：具有球形导电端子的BGA（球栅阵列）型半导体器件降低了成本并提高了可靠性。第一布线形成在形成在半导体管芯的表面上的绝缘膜上。在半导体管芯的表面上接合玻璃基板，半导体管芯的侧表面和背面被绝缘膜覆盖。第二布线连接到第一布线的侧表面或后表面并在半导体管芯的后表面上延伸。导电端子如凸块形成在第二布线上。

4. 发明授权

US07312521B2 Semiconductor device with holding member 有权
标题翻译：具有保持构件的半导体器件
公开(公告)号：US07312521B2
公开(公告)日：2007-12-25
申请号：US10420943
申请日：2003-04-23
申请人： Takashi Noma , Hiroyuki Shinogi , Nobuyuki Takai , Katsuhiko Kitagawa , Ryoji Tokushige , Takayasu Otagaki , Tatsuya Ando , Mitsuru Okigawa
发明人： Takashi Noma , Hiroyuki Shinogi , Nobuyuki Takai , Katsuhiko Kitagawa , Ryoji Tokushige , Takayasu Otagaki , Tatsuya Ando , Mitsuru Okigawa
IPC分类号： H01L23/48 , H01L23/12 , H01L29/70 , H01L31/02 , H01L23/04
CPC分类号： H01L24/10 , H01L23/3114 , H01L24/13 , H01L2224/05548 , H01L2224/05556 , H01L2224/05573 , H01L2224/13 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01021 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/00
摘要： Cost is reduced and reliability is improved with a BGA (Ball Grid Array) type semiconductor device which has ball-shaped conductive terminals. A first wiring is formed on an insulation film which is formed on a surface of a semiconductor die. A glass substrate is bonded over the surface of the semiconductor die, and a side surface and a back surface of the semiconductor die are covered with an insulation film. A second wiring is connected to a side surface or a back surface of the first wiring and extending over the back surface of the semiconductor die. A conductive terminal such as a bump is formed on the second wiring.
摘要翻译：具有球形导电端子的BGA（球栅阵列）型半导体器件降低了成本并提高了可靠性。第一布线形成在形成在半导体管芯的表面上的绝缘膜上。在半导体管芯的表面上接合玻璃基板，半导体管芯的侧表面和背面被绝缘膜覆盖。第二布线连接到第一布线的侧表面或后表面并在半导体管芯的后表面上延伸。导电端子如凸块形成在第二布线上。

5. 发明授权

US06234034B1 Linear actuator with drop prevention mechanism 有权
标题翻译：带防滴落机构的线性执行机构
公开(公告)号：US06234034B1
公开(公告)日：2001-05-22
申请号：US09396043
申请日：1999-09-15
申请人： Tatsuya Ando
发明人： Tatsuya Ando
IPC分类号： F16H2520
CPC分类号： F16H25/2472 , F16H25/20 , F16H2025/2081 , Y10T74/18792
摘要： A linear actuator including a mechanism for preventing accidental drop of an inner cylinder caused when a driven nut engaged with a drive screw shaft is broken. The drop prevention mechanism includes a drop prevention nut threaded with the drive screw shaft in close proximity to the driven nut, a shear pin secured at one end to one of the drop prevention nut and the inner cylinder or the driven nut, and a shear pin guide groove formed in the other of the drop prevention nut and the inner cylinder or the driven nut for slidably receiving a projecting free end portion of the shear. When the inner cylinder and the driven nut is displaced in a direction of a load acting on the inner cylinder, the shear pin is broken or sheared by engagement with an end wall of the shear pin guide groove. Upon shearing of the shear pin, the drop prevention nut supports thereon the inner cylinder or the driven nut to thereby keep the inner cylinder in position against drop.
摘要翻译：一种线性致动器，其包括用于防止当与驱动螺杆轴接合的从动螺母被破坏时引起的内筒意外下降的机构。防落落机构包括一个与驱动螺杆轴螺纹连接的从动螺母的防落螺母，一端固定在防滴螺母和内筒或从动螺母之一的剪切销，以及剪切销导向槽形成在防滴螺母和内筒或从动螺母中的另一个中，用于可滑动地接收剪切的突出的自由端部。当内筒和从动螺母在作用在内筒上的负载方向上移位时，剪切销通过与剪切销引导槽的端壁接合而断裂或剪切。在剪切销剪切时，防滴螺母在其上支撑内筒或从动螺母，从而将内筒保持在适当的位置。

6. 发明授权

US08105856B2 Method of manufacturing semiconductor device with wiring on side surface thereof 有权
标题翻译：在其侧表面上制造具有布线的半导体器件的方法
公开(公告)号：US08105856B2
公开(公告)日：2012-01-31
申请号：US10876532
申请日：2004-06-28
申请人： Takashi Noma , Hiroyuki Shinogi , Nobuyuki Takai , Katsuhiko Kitagawa , Ryoji Tokushige , Takayasu Otagaki , Tatsuya Ando , Mitsuru Okigawa
发明人： Takashi Noma , Hiroyuki Shinogi , Nobuyuki Takai , Katsuhiko Kitagawa , Ryoji Tokushige , Takayasu Otagaki , Tatsuya Ando , Mitsuru Okigawa
IPC分类号： H01L21/00
CPC分类号： H01L24/10 , H01L23/3114 , H01L24/13 , H01L2224/05548 , H01L2224/05556 , H01L2224/05573 , H01L2224/13 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01021 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/00
摘要： Cost is reduced and reliability is improved with a BGA (Ball Grid Array) type semiconductor device which has ball-shaped conductive terminals. A first wiring is formed on an insulation film which is formed on a surface of a semiconductor die. A glass substrate is bonded over the surface of the semiconductor die, and a side surface and a back surface of the semiconductor die are covered with an insulation film. A second wiring is connected to a side surface or a back surface of the first wiring and extending over the back surface of the semiconductor die. A conductive terminal such as a bump is formed on the second wiring.
摘要翻译：具有球形导电端子的BGA（球栅阵列）型半导体器件降低了成本并提高了可靠性。第一布线形成在形成在半导体管芯的表面上的绝缘膜上。在半导体管芯的表面上接合玻璃基板，半导体管芯的侧表面和背面被绝缘膜覆盖。第二布线连接到第一布线的侧表面或后表面并在半导体管芯的后表面上延伸。导电端子如凸块形成在第二布线上。

7. 发明申请

US20060033198A1 Semiconductor device with sidewall wiring 有权
标题翻译：具有侧壁接线的半导体器件
公开(公告)号：US20060033198A1
公开(公告)日：2006-02-16
申请号：US11206146
申请日：2005-08-18
申请人： Takashi Noma , Hiroyuki Shinogi , Nobuyuki Takai , Katsuhiko Kitagawa , Ryoji Tokushige , Takayasu Otagaki , Tatsuya Ando , Mitsuru Okigawa
发明人： Takashi Noma , Hiroyuki Shinogi , Nobuyuki Takai , Katsuhiko Kitagawa , Ryoji Tokushige , Takayasu Otagaki , Tatsuya Ando , Mitsuru Okigawa
IPC分类号： H01L23/04
CPC分类号： H01L24/10 , H01L23/3114 , H01L24/13 , H01L2224/05548 , H01L2224/05556 , H01L2224/05573 , H01L2224/13 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01021 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/00
摘要： Cost is reduced and reliability is improved with a BGA (Ball Grid Array) type semiconductor device which has ball-shaped conductive terminals. A first wiring is formed on an insulation film which is formed on a surface of a semiconductor die. A glass substrate is bonded over the surface of the semiconductor die, and a side surface and a back surface of the semiconductor die are covered with an insulation film. A second wiring is connected to a side surface or a back surface of the first wiring and extending over the back surface of the semiconductor die. A conductive terminal such as a bump is formed on the second wiring.
摘要翻译：具有球形导电端子的BGA（球栅阵列）型半导体器件降低了成本并提高了可靠性。第一布线形成在形成在半导体管芯的表面上的绝缘膜上。在半导体管芯的表面上接合玻璃基板，半导体管芯的侧表面和背面被绝缘膜覆盖。第二布线连接到第一布线的侧表面或后表面并在半导体管芯的后表面上延伸。导电端子如凸块形成在第二布线上。

8. 发明授权

US06980974B2 Method for processing expression data of genes 失效
标题翻译：处理基因表达数据的方法
公开(公告)号：US06980974B2
公开(公告)日：2005-12-27
申请号：US10321633
申请日：2002-12-18
申请人： Takeshi Kobayashi , Hiroyuki Honda , Taizo Hanai , Tatsuya Ando
发明人： Takeshi Kobayashi , Hiroyuki Honda , Taizo Hanai , Tatsuya Ando
IPC分类号： G06F17/30 , G01N33/48 , G06E1/00 , G06E3/00 , G06F15/18 , G06F19/20 , G06G7/48
CPC分类号： G06F19/24 , G06F19/20 , Y10S706/924
摘要： The expression data of specimen genes are processed using the SWEEP operator method and the parameter increasing method, and genes are selected. A FNN model is constructed by making the expression data of the selected genes as input variables.
摘要翻译：使用SWEEP算子法和参数增加法对样本基因的表达数据进行处理，选择基因。通过将所选基因的表达数据作为输入变量构建FNN模型。

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