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1. 发明申请

US20130062980A1 DRIVING FORCE TRANSMISSION DEVICE 有权
标题翻译：驱动力传动装置
公开(公告)号：US20130062980A1
公开(公告)日：2013-03-14
申请号：US13698797
申请日：2011-05-17
申请人： Takashi Kuwahara , Tomoharu Fujii , Shigeru Ishii , Tatsuya Osone , Kunihiko Nishimura
发明人： Takashi Kuwahara , Tomoharu Fujii , Shigeru Ishii , Tatsuya Osone , Kunihiko Nishimura
IPC分类号： H02K5/10
CPC分类号： F16D25/083 , B60K6/387 , B60K6/40 , B60K6/405 , B60K6/48 , B60K6/543 , B60K2006/4825 , B60L3/0061 , B60L11/14 , B60L15/20 , B60L2210/40 , B60L2220/14 , B60L2220/50 , B60L2240/36 , B60L2240/423 , B60L2240/507 , B60Y2400/4242 , F16D25/12 , F16D25/123 , F16D2048/0287 , F16D2300/08 , H02K5/10 , H02K7/006 , Y02T10/6221 , Y02T10/6252 , Y02T10/641 , Y02T10/645 , Y02T10/70 , Y02T10/7077 , Y02T10/7241 , Y02T10/7275
摘要： A hybrid driving force transmission device includes a motor generator (9), a multi-plate dry clutch (7), a housing cover (60), a dust seal member (62), and a dust collection structure (63). The multi-plate dry clutch (7) is disposed at a position inner than the motor generator (9). The housing cover (60) is provided to cover the motor generator (9) and the multi-plate dry clutch (7), and divides the internal space into a clutch chamber (64) and a motor chamber (65). The dust seal member (62) is disposed at a position radially outside of a clutch chamber open surface (66) and seals between a rotor (92) and an inner wall (60a) of the housing cover (60). The dust collection structure (63) forms a dust collection space (69) in a region radially between the seal surface (68) formed by the dust seal member (62) and the clutch chamber open surface (66).
摘要翻译：混合驱动力传递装置包括电动发电机（9），多板干式离合器（7），壳体盖（60），防尘密封件（62）和集尘结构（63）。多板式干式离合器（7）配置在比电动发电机（9）内的位置。壳体盖60被设置成覆盖电动发电机9和多板干式离合器7，并将内部空间分成离合器室64和电动机室65。防尘密封构件62设置在离合器室开放面（66）的径向外侧的位置，密封在转子（92）与壳体盖（60）的内壁（60a）之间。集尘结构（63）在由防尘密封部件（62）形成的密封面（68）和离合器室开放面（66）之间的径向的区域内形成集尘空间（69）。

2. 发明申请

US20130313063A1 DRIVING FORCE TRANSMISSION DEVICE 有权
标题翻译：驱动力传递装置
公开(公告)号：US20130313063A1
公开(公告)日：2013-11-28
申请号：US13819402
申请日：2011-07-25
申请人： Tomoharu Fujii , Tsuyoshi Yamanaka , Shigeru Ishii
发明人： Tomoharu Fujii , Tsuyoshi Yamanaka , Shigeru Ishii
IPC分类号： F16D13/40
CPC分类号： F16D13/40 , F16D13/648 , F16D13/72 , F16D25/044 , F16D25/082 , F16D2048/0212 , F16D2069/004 , F16D2300/0212
摘要： Provided are devices and methods to minimize drag caused by abrasion powder between clutch plates and to prevent a faulty engagement or release of a dry clutch. A hybrid driving force transmission device is provided, wherein a multi-plate dry clutch is arranged in a sealed space and used for connecting/disconnecting transmission of a driving force is provided with drive plates, driven plates, friction facings, and a housing cover The drive plates are splined to a clutch hub, and have, in the sections thereof that are splined to the clutch hub, vent holes for channeling the air flowing in the axial direction. The driven plates are splined to a clutch drum. The housing cover has an external air intake hole for drawing external air into the sealed space, and an external air discharge hole for discharging the airflow from the sealed space to the outside.
摘要翻译：提供了用于最小化由离合器板之间的磨耗粉引起的阻力并且防止干式离合器的错误接合或释放的装置和方法。提供一种混合驱动力传递装置，其中多板干式离合器布置在密封空间中，用于驱动力的连接/断开传动，设有驱动板，驱动板，摩擦面和壳体盖。驱动板花键连接到离合器毂，并且在其与花键连接到离合器毂的部分中具有用于引导沿轴向流动的空气的通风孔。从动盘用花键连接的离合器鼓。壳体盖具有用于将外部空气吸入密封空间的外部空气吸入孔和用于将气流从密封空间排出到外部的外部空气排出孔。

3. 发明授权

US09080612B2 Driving force transmission device 有权
标题翻译：驱动力传动装置
公开(公告)号：US09080612B2
公开(公告)日：2015-07-14
申请号：US13819402
申请日：2011-07-25
申请人： Tomoharu Fujii , Tsuyoshi Yamanaka , Shigeru Ishii
发明人： Tomoharu Fujii , Tsuyoshi Yamanaka , Shigeru Ishii
IPC分类号： F16D25/08 , F16D13/40 , F16D13/72 , F16D25/04 , F16D48/02
CPC分类号： F16D13/40 , F16D13/648 , F16D13/72 , F16D25/044 , F16D25/082 , F16D2048/0212 , F16D2069/004 , F16D2300/0212
摘要： Provided are devices and methods to minimize drag caused by abrasion powder between clutch plates and to prevent a faulty engagement or release of a dry clutch. A hybrid driving force transmission device is provided, wherein a multi-plate dry clutch is arranged in a sealed space and used for connecting/disconnecting transmission of a driving force is provided with drive plates, driven plates, friction facings, and a housing cover. The drive plates are splined to a clutch hub, and have, in the sections thereof that are splined to the clutch hub, vent holes for channeling the air flowing in the axial direction. The driven plates are splined to a clutch drum. The housing cover has an external air intake hole for drawing external air into the sealed space, and an external air discharge hole for discharging the airflow from the sealed space to the outside.
摘要翻译：提供了用于最小化由离合器板之间的磨耗粉引起的阻力并且防止干式离合器的错误接合或释放的装置和方法。提供一种混合驱动力传递装置，其中多板干式离合器布置在密封空间中并用于驱动力的连接/断开传动，设置有驱动板，从动板，摩擦面和壳体盖。驱动板花键连接到离合器毂，并且在其与花键连接到离合器毂的部分中具有用于引导沿轴向流动的空气的通风孔。从动板花键到离合器鼓。壳体盖具有用于将外部空气吸入密封空间的外部空气吸入孔和用于将气流从密封空间排出到外部的外部空气排出孔。

4. 发明授权

US08405953B2 Capacitor-embedded substrate and method of manufacturing the same 有权
标题翻译：电容器嵌入式基板及其制造方法
公开(公告)号：US08405953B2
公开(公告)日：2013-03-26
申请号：US12191454
申请日：2008-08-14
申请人： Tomoharu Fujii , Masahiro Sunohara
发明人： Tomoharu Fujii , Masahiro Sunohara
IPC分类号： H01G4/002 , H01G4/005
CPC分类号： H01G4/33 , H01G4/228 , H01G4/236 , Y10T29/435
摘要： A capacitor-embedded substrate includes a base material having a desired thickness, and a pair of conductors (feedthrough electrodes) each formed in a desired pattern to penetrate through the base material in the thickness direction thereof, and oppositely disposed with an insulating layer interposed therebetween. The pair of electrodes are formed in comb-shaped patterns, and are oppositely disposed in such a manner that respective comb-tooth portions are meshed with each other.
摘要翻译：电容器嵌入式基板包括具有期望厚度的基体材料和一对导体（馈通电极），每个导体（馈通电极）以期望的图案形成，以在其厚度方向上穿透基底材料，并且相对设置有绝缘层。一对电极形成为梳形图案，并且以相应的梳齿部彼此啮合的方式相对地设置。

5. 发明授权

US07841076B2 Manufacturing method of wiring substrate and manufacturing method of semiconductor device 有权
标题翻译：布线基板的制造方法及半导体装置的制造方法
公开(公告)号：US07841076B2
公开(公告)日：2010-11-30
申请号：US11727547
申请日：2007-03-27
申请人： Tomoharu Fujii
发明人： Tomoharu Fujii
IPC分类号： H05K3/30
CPC分类号： H01Q9/0407 , H01L23/142 , H01L23/49822 , H01L2223/6677 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2924/00014 , H01L2924/15321 , H01Q1/2283 , H01Q13/106 , H05K1/056 , H05K1/16 , H05K3/007 , H05K3/4644 , H05K2203/0152 , Y10T29/49002 , Y10T29/49016 , Y10T29/4913 , H01L2224/05599
摘要： A multilayer wiring structural body 13 is formed on a surface 57A of a metal plate 57 used as a support plate in the case of forming the multilayer wiring structural body 13, and the metal plate 57 is patterned and a slot antenna 60 is formed.
摘要翻译：在形成多层布线结构体13的情况下，在用作支撑板的金属板57的表面57A上形成多层布线结构体13，并且金属板57被图案化并形成缝隙天线60。

6. 发明授权

US07791446B2 Inductor device and method of manufacturing the same 有权
标题翻译：电感器件及其制造方法
公开(公告)号：US07791446B2
公开(公告)日：2010-09-07
申请号：US12186317
申请日：2008-08-05
申请人： Tomoharu Fujii , Masahiro Sunohara , Manabu Nakamura
发明人： Tomoharu Fujii , Masahiro Sunohara , Manabu Nakamura
IPC分类号： H01F5/00
CPC分类号： H01F17/0006 , H01F27/323 , H01F41/041 , H01F41/122 , H01F2017/0046 , H01L23/49822 , H01L23/49838 , H01L23/645 , H01L28/10 , H01L2224/16225 , H01L2924/19105 , H01L2924/3011 , Y10T29/4902
摘要： An inductor device formed on a semiconductor substrate includes an inductor body penetrating the semiconductor substrate, taking a spiral shape and having a conductivity, and an insulating film provided between a side surface of the inductor body and the semiconductor substrate.
摘要翻译：形成在半导体衬底上的电感器件包括穿过半导体衬底的电感体，呈螺旋形并具有导电性，以及设置在电感体侧面和半导体衬底之间的绝缘膜。

7. 发明授权

US07542006B2 Wiring board and semiconductor apparatus 有权
标题翻译：接线板和半导体设备
公开(公告)号：US07542006B2
公开(公告)日：2009-06-02
申请号：US11754767
申请日：2007-05-29
申请人： Tomoharu Fujii
发明人： Tomoharu Fujii
IPC分类号： H01Q23/00
CPC分类号： H01Q9/42 , H01L23/49805 , H01L23/5386 , H01L23/5388 , H01L2924/0002 , H01Q23/00 , H05K1/16 , H05K3/403 , H01L2924/00
摘要： An inverse F type antenna is provided and includes first wiring portions provided on an upper face of a board, second wiring portions provided on a lower face of the board, connecting portions electrically connecting the first wiring portions and the second wiring portions, in which the connecting portions are provided at a side face of the board.
摘要翻译：设置逆F型天线，并且包括设置在基板的上表面上的第一布线部分，设置在基板的下表面上的第二布线部分，电连接第一布线部分和第二布线部分的连接部分，其中连接部设置在板的侧面。

8. 发明申请

US20080259585A1 ELECTRONIC APPARATUS 有权
标题翻译：电子设备
公开(公告)号：US20080259585A1
公开(公告)日：2008-10-23
申请号：US11847796
申请日：2007-08-30
申请人： Tomoharu Fujii
发明人： Tomoharu Fujii
IPC分类号： H05K7/06
CPC分类号： H05K9/0056 , H01L2223/6677 , H01L2224/16227 , H01L2924/19105 , H05K9/0083
摘要： An electronic apparatus includes a substrate, electronic components mounted on the substrate, an antenna mounted on the substrate, and a resin material containing a dielectric constant adjusting material added therein, and sealing the electronic components and the antenna.
摘要翻译：一种电子设备，包括基板，安装在基板上的电子部件，安装在基板上的天线，以及添加有介电常数调整材料的树脂材料，并密封电子部件和天线。

9. 发明申请

US20070279879A1 WIRING BOARD AND SEMICONDUCTOR APPARATUS 有权
标题翻译：接线板和半导体设备
公开(公告)号：US20070279879A1
公开(公告)日：2007-12-06
申请号：US11754767
申请日：2007-05-29
申请人： Tomoharu Fujii
发明人： Tomoharu Fujii
IPC分类号： H05K7/00 , H01L23/02 , H01L23/48 , H01R9/00
CPC分类号： H01Q9/42 , H01L23/49805 , H01L23/5386 , H01L23/5388 , H01L2924/0002 , H01Q23/00 , H05K1/16 , H05K3/403 , H01L2924/00
摘要： An inverse F type antenna 29 including first wiring portions 41 to 45 provided at an upper face 15A of a board 15, second wiring portions 51 to 56 provided at a lower face 15B of the board 15, connecting portions 61 to 70 electrically connecting the first wiring portions 41 to 45 and the second wiring portions 51 to 56, in which the connecting portions 61 to 70 are provided at a side face 15-4 of the board 15.
摘要翻译：设置在基板15的上表面15A的第一配线部分41至45的逆F型天线29，设置在电路板15的下表面15B处的第二配线部分51至56，电连接的连接部分61至70 第一配线部分41至45和第二配线部分51至56，其中连接部分61至70设置在板15的侧面15-4处。

10. 发明申请

US20070029667A1 SEMICONDUCTOR DEVICE 审中-公开
标题翻译：半导体器件
公开(公告)号：US20070029667A1
公开(公告)日：2007-02-08
申请号：US11462188
申请日：2006-08-03
申请人： Tomoharu Fujii , Tomoki Kobayashi
发明人： Tomoharu Fujii , Tomoki Kobayashi
IPC分类号： H01L23/34
CPC分类号： H01L23/50 , H01L23/04 , H01L23/66 , H01L24/48 , H01L24/97 , H01L25/165 , H01L2223/6677 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/09701 , H01L2924/1433 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/3011 , H01Q9/0421 , H01Q23/00 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A wiring substrate 11 having a power feeding layer 24 and a ground conductive layer 27 is provided, and also an inverted F-type antenna 20 is provided on a sealing resin 17, which covers a semiconductor chip 12 and a chip parts 13 connected to the wiring substrate 11, and an inverted F-type antenna 20 is connected electrically to the power feeding layer 24 and the ground conductive layer 27.
摘要翻译：设置有具有供电层24和接地导电层27的布线基板11，并且在密封树脂17上设置倒置的F型天线20，该密封树脂17覆盖半导体芯片12和连接到布线基板11和倒F型天线20电连接到馈电层24和接地导电层27。

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