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    • 2. 发明授权
    • Method and apparatus distribution power suply pad of semiconductor integrated circuit
    • 半导体集成电路的方法和装置配电电源板
    • US07454724B2
    • 2008-11-18
    • US10823649
    • 2004-04-14
    • Takashi KuriharaKazutaka Takeuchi
    • Takashi KuriharaKazutaka Takeuchi
    • G06F17/50
    • G06F17/5036G06F17/5068
    • A method for accurately determining the provisional quantity and provisional locations of power supply pads prior to detailed layout of a semiconductor integrated circuit. The method decreases redesigning, shortens the design time, and lowers design costs. The method includes performing a power supply network analysis of the core section to obtain voltage values of the nodes, calculating current values between the nodes from the voltage values of the nodes and the resistances between the nodes, and calculating current values of the power supply pads from the current values between the nodes. The method further includes determining whether to eliminate or add a power supply pad depending on whether the current value of each power supply pad exceeds the current capacity of an associated IO buffer.
    • 一种用于在半导体集成电路的详细布局之前准确地确定电源焊盘的临时位置和临时位置的方法。 该方法减少了重新设计,缩短了设计时间,降低了设计成本。 该方法包括执行核心部分的电源网络分析以获得节点的电压值,从节点的电压值和节点之间的电阻计算节点之间的电流值,并计算电源焊盘的电流值 从节点之间的当前值。 该方法还包括根据每个电源焊盘的当前值是否超过相关联的IO缓冲器的当前容量来确定是否消除或添加电源焊盘。
    • 3. 发明申请
    • Method and apparatus for designing semiconductor integrated circuit
    • 半导体集成电路设计方法及设备
    • US20050050502A1
    • 2005-03-03
    • US10823649
    • 2004-04-14
    • Takashi KuriharaKazutaka Takeuchi
    • Takashi KuriharaKazutaka Takeuchi
    • G06F17/50G06F9/45H01L21/82H01L21/822H01L27/04
    • G06F17/5036G06F17/5068
    • A method for accurately determining the provisional quantity and provisional locations of power supply pads prior to detailed layout of a semiconductor integrated circuit. The method decreases redesigning, shortens the design time, and lowers design costs. The method includes performing a power supply network analysis of the core section to obtain voltage values of the nodes, calculating current values between the nodes from the voltage values of the nodes and the resistances between the nodes, and calculating current values of the power supply pads from the current values between the nodes. The method further includes determining whether to eliminate or add a power supply pad depending on whether the current value of each power supply pad exceeds the current capacity of an associated IO buffer.
    • 一种用于在半导体集成电路的详细布局之前准确地确定电源焊盘的临时位置和临时位置的方法。 该方法减少了重新设计,缩短了设计时间,降低了设计成本。 该方法包括执行核心部分的电源网络分析以获得节点的电压值,从节点的电压值和节点之间的电阻计算节点之间的电流值,并计算电源焊盘的电流值 从节点之间的当前值。 该方法还包括根据每个电源焊盘的当前值是否超过相关联的IO缓冲器的当前容量来确定是否消除或添加电源焊盘。