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1. 发明授权

US06959125B2 Printed board unit for optical transmission and mounting method 失效
标题翻译：用于光学传输和安装方法的印刷电路板单元
公开(公告)号：US06959125B2
公开(公告)日：2005-10-25
申请号：US10341437
申请日：2003-01-14
申请人： Takashi Kanda , Kiyotaka Seyama , Kaoru Sugimoto , Souichi Obata , Yasutomo Maehara
发明人： Takashi Kanda , Kiyotaka Seyama , Kaoru Sugimoto , Souichi Obata , Yasutomo Maehara
IPC分类号： G02B6/42 , G02B6/43 , G02B6/12
CPC分类号： G02B6/43 , G02B6/42 , H01L2224/48091 , H01L2224/73257 , H01L2924/00014
摘要： It is an object of the present invention to enhance laser beam transmitting efficiency by accurately controlling an interval between a light emitting (light receiving) element (20) and an optical wave-guide substrate (1) without causing any fluctuation in the interval in a mounting structure of the light transmitting element in which the light emitting (light receiving) element (20) is mounted on the optical wave-guide substrate (1). When the light emitting (light receiving) element is joined to the sub-mount chip (4) and when the sub-mount chip (4) is joined to the optical wave-guide while the element is being directed to the substrate side, the sub-mount chip and the optical wave-guide substrate are joined to each other by the solder bump (6). A post (5) is arranged for regulating an interval between the light emitting (light receiving) element and the optical wave-guide substrate.
摘要翻译：本发明的目的是通过精确地控制发光（光接收）元件（20）和光波导基板（1）之间的间隔而不会引起在其中发光（光接收）元件（20）安装在光波导基板（1）上的透光元件的安装结构。当发光（光接收）元件接合到子安装芯片（4）时，并且当元件被引导到基板侧时，子安装芯片（4）接合到光波导上时，副安装芯片和光波导基板通过焊料凸块（6）相互连接。布置用于调节发光（光接收）元件和光波导基板之间的间隔的柱（5）。

2. 发明申请

US20070289706A1 Process for producing multilayer board 有权
标题翻译：多层板生产工艺
公开(公告)号：US20070289706A1
公开(公告)日：2007-12-20
申请号：US11649203
申请日：2007-01-04
申请人： Takashi Nakagawa , Seiichi Sugano , Kenji Iida , Yasutomo Maehara , Hitoshi Suzuki , Kaoru Sugimoto , Kenji Fukuzono , Takashi Kanda , Hiroaki Date , Tomohisa Yagi
发明人： Takashi Nakagawa , Seiichi Sugano , Kenji Iida , Yasutomo Maehara , Hitoshi Suzuki , Kaoru Sugimoto , Kenji Fukuzono , Takashi Kanda , Hiroaki Date , Tomohisa Yagi
IPC分类号： C09J5/06
CPC分类号： H05K3/4614 , H05K3/321 , H05K3/361 , H05K3/4069 , H05K2201/0218 , H05K2203/0425 , H05K2203/0568 , H05K2203/063 , Y10T29/49117
摘要： A process for producing a multilayer board includes the steps of applying a bonding ink to the terminal of the first substrate, the bonding ink including a thermosetting resin containing a filler and a curing agent, the filler being formed of metal particles plated with solder, the metal particles each having a first melting point, and the solder having a second melting point lower than the first melting point; bonding the second substrate to a bonding sheet composed of a thermosetting resin and having a through hole disposed in a portion corresponding to the terminal of the second substrate; and heating and pressurizing the first and second substrates with the bonding sheet in such a manner that the terminals are opposite each other to effect curing of the bonding sheet and the bonding ink and to form an integral structure.
摘要翻译：一种制造多层板的方法包括以下步骤：将粘合油墨施加到第一基板的端子上，粘合油墨包括含有填料和固化剂的热固性树脂，填料由镀有焊料的金属颗粒形成，金属颗粒各自具有第一熔点，并且焊料具有低于第一熔点的第二熔点; 将第二基板接合到由热固性树脂构成的接合片，并且具有设置在与第二基板的端子对应的部分中的通孔; 并且利用接合片以这样的方式对第一和第二基板进行加热和加压，使得端子彼此相对以实现粘合片和粘合油墨的固化并形成一体结构。

3. 发明授权

US07943001B2 Process for producing multilayer board 有权
标题翻译：多层板生产工艺
公开(公告)号：US07943001B2
公开(公告)日：2011-05-17
申请号：US11649203
申请日：2007-01-04
申请人： Takashi Nakagawa , Seiichi Sugano , Kenji Iida , Yasutomo Maehara , Hitoshi Suzuki , Kaoru Sugimoto , Kenji Fukuzono , Takashi Kanda , Hiroaki Date , Tomohisa Yagi
发明人： Takashi Nakagawa , Seiichi Sugano , Kenji Iida , Yasutomo Maehara , Hitoshi Suzuki , Kaoru Sugimoto , Kenji Fukuzono , Takashi Kanda , Hiroaki Date , Tomohisa Yagi
IPC分类号： H04K3/34
CPC分类号： H05K3/4614 , H05K3/321 , H05K3/361 , H05K3/4069 , H05K2201/0218 , H05K2203/0425 , H05K2203/0568 , H05K2203/063 , Y10T29/49117
摘要： A process for producing a multilayer board includes the steps of applying a bonding ink to the terminal of the first substrate, the bonding ink including a thermosetting resin containing a filler and a curing agent, the filler being formed of metal particles plated with solder, the metal particles each having a first melting point, and the solder having a second melting point lower than the first melting point; bonding the second substrate to a bonding sheet composed of a thermosetting resin and having a through hole disposed in a portion corresponding to the terminal of the second substrate; and heating and pressurizing the first and second substrates with the bonding sheet in such a manner that the terminals are opposite each other to effect curing of the bonding sheet and the bonding ink and to form an integral structure.
摘要翻译：一种制造多层板的方法包括以下步骤：将粘合油墨施加到第一基板的端子上，粘合油墨包括含有填料和固化剂的热固性树脂，填料由镀有焊料的金属颗粒形成，金属颗粒各自具有第一熔点，并且焊料具有低于第一熔点的第二熔点; 将第二基板接合到由热固性树脂构成的接合片，并且具有设置在与第二基板的端子对应的部分中的通孔; 并且利用接合片以这样的方式对第一和第二基板进行加热和加压，使得端子彼此相对以实现粘合片和粘合油墨的固化并形成一体结构。

4. 发明申请

US20090084590A1 CIRCUIT BOARD 失效
标题翻译：电路板
公开(公告)号：US20090084590A1
公开(公告)日：2009-04-02
申请号：US12188257
申请日：2008-08-08
申请人： Hideaki YOSHIMURA , Kenji Fukuzono , Kenji Iida , Tomoyuki Abe , Yasutomo Maehara , Takashi Nakagawa , Shin Hirano , Takashi Kanda
发明人： Hideaki YOSHIMURA , Kenji Fukuzono , Kenji Iida , Tomoyuki Abe , Yasutomo Maehara , Takashi Nakagawa , Shin Hirano , Takashi Kanda
IPC分类号： H05K1/00
CPC分类号： H05K1/0366 , H05K1/0271 , H05K1/056 , H05K3/4608 , H05K2201/0323 , H05K2201/068 , H05K2201/09145 , Y10T428/24917 , Y10T428/24926
摘要： A circuit board has a low thermal expansion coefficient that suits the thermal expansion coefficient of an element to be mounted thereupon and can prevent the occurrence of delamination and cracking of a core layer when the circuit board is used in a low temperature environment. The circuit board is constructed by laminating a core layer and at least one wiring layer, where the at least one wiring layer has slightly smaller external dimensions in a planar direction than the core layer.
摘要翻译：电路板具有适合要安装的元件的热膨胀系数的低热膨胀系数，并且可以防止当在低温环境中使用电路板时芯层的分层和破裂的发生。电路板通过层叠芯层和至少一个布线层而构成，其中至少一个布线层在平面方向上具有比芯层稍小的外部尺寸。

5. 发明授权

US5894882A Heat sink structure for cooling a substrate and an electronic apparatus having such a heat sink structure 失效
标题翻译：用于冷却衬底的散热器结构和具有这种散热器结构的电子设备
公开(公告)号：US5894882A
公开(公告)日：1999-04-20
申请号：US650029
申请日：1996-05-17
申请人： Shunichi Kikuchi , Minoru Hirano , Kiyotaka Seyama , Hideaki Yoshimura , Takashi Kanda , Hitoshi Nori
发明人： Shunichi Kikuchi , Minoru Hirano , Kiyotaka Seyama , Hideaki Yoshimura , Takashi Kanda , Hitoshi Nori
IPC分类号： H01L23/36 , F28F3/02 , H01L23/367 , H01L23/467 , F28F7/00 , H01L23/46
CPC分类号： H01L23/3672 , F28F3/027 , H01L23/467 , H01L2924/0002
摘要： A heat sink structure of a module substrate includes a plurality of stripe-like bottom regions extending in a longitudinal direction and repeated in a lateral direction with a predetermined pitch, a plurality of stripe-like top regions extending in said longitudinal direction and repeated in the lateral direction with said predetermined pitch, such that the stripe-like bottom regions and the stripe-like top regions are repeated alternately in the lateral direction, wherein the stripe-like top regions and the stripe-like bottom regions have respective lateral edges that are connected with each other by cooling fins.
摘要翻译：模块基板的散热结构包括沿着纵向方向延伸并且以预定间距在横向上重复的多个条状底部区域，沿着所述纵向方向延伸并在所述纵向方向上重复的多个条状顶部区域横向具有所述预定间距，使得条状底部区域和条状顶部区域在横向方向上交替重复，其中条状顶部区域和条形底部区域具有相应的横向边缘，通过散热片相互连接。

6. 发明授权

US08119923B2 Circuit board 失效
标题翻译：电路板
公开(公告)号：US08119923B2
公开(公告)日：2012-02-21
申请号：US12188257
申请日：2008-08-08
申请人： Hideaki Yoshimura , Kenji Fukuzono , Kenji Iida , Tomoyuki Abe , Yasutomo Maehara , Takashi Nakagawa , Shin Hirano , Takashi Kanda
发明人： Hideaki Yoshimura , Kenji Fukuzono , Kenji Iida , Tomoyuki Abe , Yasutomo Maehara , Takashi Nakagawa , Shin Hirano , Takashi Kanda
IPC分类号： H05K1/00 , B32B9/00
CPC分类号： H05K1/0366 , H05K1/0271 , H05K1/056 , H05K3/4608 , H05K2201/0323 , H05K2201/068 , H05K2201/09145 , Y10T428/24917 , Y10T428/24926
摘要： A circuit board has a low thermal expansion coefficient that suits the thermal expansion coefficient of an element to be mounted thereupon and can prevent the occurrence of delamination and cracking of a core layer when the circuit board is used in a low temperature environment. The circuit board is constructed by laminating a core layer and at least one wiring layer, where the at least one wiring layer has slightly smaller external dimensions in a planar direction than the core layer.
摘要翻译：电路板具有适合要安装的元件的热膨胀系数的低热膨胀系数，并且可以防止当在低温环境中使用电路板时芯层的分层和破裂的发生。电路板通过层叠芯层和至少一个布线层而构成，其中至少一个布线层在平面方向上具有比芯层稍小的外部尺寸。

7. 发明申请

US20140009513A1 VIDEO DISPLAY DEVICE AND A TELEVISION RECEIVER 审中-公开
标题翻译：视频显示设备和电视接收器
公开(公告)号：US20140009513A1
公开(公告)日：2014-01-09
申请号：US14006531
申请日：2011-11-30
申请人： Tomoharu Noutoshi , Takashi Kanda , Toshiyuki Fujine
发明人： Tomoharu Noutoshi , Takashi Kanda , Toshiyuki Fujine
IPC分类号： G09G5/10
CPC分类号： G09G5/10 , G09G3/3426 , G09G3/36 , G09G2320/0626 , G09G2320/0646 , G09G2320/066 , G09G2320/0673 , G09G2360/16 , H04N5/57 , H04N21/4318 , H04N21/44008
摘要： A portion of a video signal for emitting light is detected, and the display brightness of the light emission portion is enhanced and displayed in a more conspicuous manner, whereby the sense of radiance is increased and the image quality is improved. A light emission detector (2) of the video display device generates a histogram in which the number of pixels is integrated into a predetermined feature quantity of an input video signal; and detects an upper region of a predetermined range of the histogram as a light emission section. An area-active control/brightness stretch portion (4) stretches and boosts the brightness of a backlight portion (6). A mapping portion (3) reduces the brightness of the video signal in a non-light-emission section, which excludes the detected light emission section. An increase in the screen brightness of the non-light-emission section is thereby suppressed, and the display brightness of the light emission section is enhanced.
摘要翻译：检测用于发光的视频信号的一部分，并且以更明显的方式增强和显示发光部分的显示亮度，从而增加了感光度并提高了图像质量。视频显示装置的发光检测器（2）生成其中像素数被集成到输入视频信号的预定特征量中的直方图; 并且将直方图的预定范围的上部区域检测为发光部。区域主动控制/亮度伸展部分（4）延伸和提升背光部分（6）的亮度。映射部分（3）降低非发光部分中的视频信号的亮度，其不包括检测到的发光部分。由此抑制了非发光部分的屏幕亮度的增加，并且增强了发光部分的显示亮度。

8. 发明申请

US20070222039A1 Semiconductor device and manufacturing method of a semiconductor device 审中-公开
标题翻译：半导体装置及半导体装置的制造方法
公开(公告)号：US20070222039A1
公开(公告)日：2007-09-27
申请号：US11526100
申请日：2006-09-25
申请人： Takashi Kanda , Kenji Fukuzono
发明人： Takashi Kanda , Kenji Fukuzono
IPC分类号： H01L23/58
CPC分类号： H01L24/83 , H01L21/6835 , H01L23/36 , H01L24/29 , H01L24/81 , H01L25/0655 , H01L25/16 , H01L2221/68345 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16237 , H01L2224/29111 , H01L2224/2919 , H01L2224/293 , H01L2224/32225 , H01L2224/73253 , H01L2224/81101 , H01L2224/81203 , H01L2224/81801 , H01L2224/83101 , H01L2224/83102 , H01L2224/838 , H01L2224/92125 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/1517 , H01L2924/19041 , H01L2924/19043 , H01L2924/19106 , H05K3/323 , H05K3/4614 , H05K3/462 , H05K3/467 , H05K2201/10378 , H05K2201/10674 , H01L2924/00 , H01L2924/01083 , H01L2224/05599
摘要： A semiconductor device includes a multi-layer substrate and a semiconductor element mounted on the multi-layer substrate. The multi-layer substrate contains a plurality of circuit-formation layers joined by a first resin material. The semiconductor element is mounted on the multi-layer substrate by being joined to the multi-layer substrate by a second resin material. The first resin material and the second resin material are curable in the same heating condition.
摘要翻译：半导体器件包括多层基板和安装在多层基板上的半导体元件。多层基板包含由第一树脂材料连接的多个电路形成层。半导体元件通过第二树脂材料与多层基板接合而安装在多层基板上。第一树脂材料和第二树脂材料在相同的加热条件下可固化。

9. 发明授权

US07053493B2 Semiconductor device having stiffener 有权
标题翻译：具有加强件的半导体器件
公开(公告)号：US07053493B2
公开(公告)日：2006-05-30
申请号：US10992651
申请日：2004-11-22
申请人： Takashi Kanda , Kenji Fukuzono
发明人： Takashi Kanda , Kenji Fukuzono
IPC分类号： H01L23/48 , H01L23/52
CPC分类号： H01L23/562 , H01L23/3128 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H05K3/303 , H05K3/305 , H05K2201/10568 , H05K2201/10734 , H05K2201/2036 , Y02P70/613 , H01L2924/00 , H01L2224/0401
摘要： A semiconductor device including a substrate, a semiconductor element mounted on the substrate and a stiffener attached via an adhesive to a surface of the substrate opposite a surface thereof on which the semiconductor element is mounted. The adhesive has a coefficient of thermal expansion smaller than that of the substrate and that of the stiffener, and the modulus of longitudinal elasticity of the adhesive is equal to or larger than 10 GPa. Otherwise, the adhesive has a coefficient of thermal expansion larger than that of the substrate and that of the stiffener, and the modulus of longitudinal elasticity of the adhesive is equal to or smaller than 10 GPa. The height of the stiffener is less than that of the external terminals.
摘要翻译：一种半导体器件，包括衬底，安装在衬底上的半导体元件和经由粘合剂附着到衬底的与安装半导体元件的表面相对的表面的加强件。粘合剂的热膨胀系数小于基材和加强件的热膨胀系数，并且粘合剂的纵向弹性模量等于或大于10GPa。否则，粘合剂的热膨胀系数大于基材和加强件的热膨胀系数，并且粘合剂的纵向弹性模量等于或小于10GPa。加强件的高度小于外部端子的高度。

10. 发明申请

US20050096363A1 Activator of peroxisome proliferator-activated receptor delta 有权
标题翻译：过氧化物酶体增殖物激活受体δ的活化剂
公开(公告)号：US20050096363A1
公开(公告)日：2005-05-05
申请号：US10491935
申请日：2002-10-09
申请人： Shogo Sakuma , Tomio Yamakawa , Takashi Kanda , Seiichiro Masui
发明人： Shogo Sakuma , Tomio Yamakawa , Takashi Kanda , Seiichiro Masui
IPC分类号： A61K31/00 , A61K31/423 , A61K31/427 , A61K31/454 , A61P3/04 , A61P3/06 , A61P3/10 , A61P9/00 , A61P9/10 , A61P19/10 , A61P25/28 , A61P29/00 , A61P35/00 , C07D403/06 , C07D405/06 , C07D409/06 , C07D413/06 , C07D413/12 , C07D413/14 , C07D417/06 , C07D417/12 , C07D417/14 , A61K31/4178 , A61K31/422 , A61K31/4439 , C07D43/14
CPC分类号： C07D403/06 , A61K31/00 , A61K31/423 , A61K31/427 , A61K31/454 , C07D405/06 , C07D409/06 , C07D413/06 , C07D413/12 , C07D413/14 , C07D417/06 , C07D417/12 , C07D417/14
摘要： A compound represented by the formula (I) or a salt of the compound, and a PPAR-δ activator which contains the compound or salt as the active ingredient: (wherein A represents O or S; B1 represents N, etc.; B2 represents O, etc.; each of X1 and X2 represents O, S, a bond, etc.; Y represents C1-8 alkylene chain; Z represents O or S; R1 represents aryl, etc. which can have substituents; R2 represents C1-8 alkyl, etc.; R3 represents C1-8 alkyl, C2-8 alkenyl, etc.; each of R4 and R5 represents hydrogen, C1-8 alkyl, etc.; and R6 represents hydrogen, etc.; provided that each of Z and R3 is attached to the benzene ring, and X2 is not attached to the benzene ring).
摘要翻译：由式（I）表示的化合物或化合物的盐和含有该化合物或盐作为活性成分的PPAR-δ活化剂：（其中A表示O或S; B < 表示N等; B 2表示O等; X 1和X 2各自表示O，S，键， Y表示C 1-8亚烷基链; Z表示O或S; R 1表示可具有取代基的芳基等; R 2， / SUP表示C 1-8烷基等; R 3表示C 1-8烷基，C 2-8 链烯基等; R 4和R 5各自代表氢，C 1-8烷基等;和 R 6表示氢等;条件是Z和R 3各自连接到苯环上，并且X 2不连接到苯环）。

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