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1. 发明授权

US4902867A Method of joining an insulated wire to a conductive terminal 失效
标题翻译：将绝缘电线连接到导电端子的方法
公开(公告)号：US4902867A
公开(公告)日：1990-02-20
申请号：US254306
申请日：1988-10-06
申请人： Takashi Haramaki , Mitsuo Nakamura , Satoshi Kokura , Takao Funamoto , Katsuyoshi Terakado
发明人： Takashi Haramaki , Mitsuo Nakamura , Satoshi Kokura , Takao Funamoto , Katsuyoshi Terakado
IPC分类号： B23K3/04 , B23K1/00 , B23K35/30 , H01R4/02 , H01R43/02
CPC分类号： H01R4/026 , B23K35/30
摘要： A high heat resisting wire (5) is made of amide-imide-coated wire, and a conductive terminal (4) is made of Cu or Cu alloy such as brass P-containing solder, BAg-1, BAg-2 are used as joining assistant (4). A high heat resisting wire (5) is made of an amide-imide-coated wire and a conductive terminal (3) is made of soft steel or SUS steel, a silver-solder is used as joining assistant (4). A metallic joining conductive layer (8) is formed between a Cu core wire (7) of the insulated wire (5) and the conductive terminal (3 ) with the joining assistant (4). The insulated wire (5) is joined to the conductive terminal (3) and a joined body having high joining strength can be obtained.

2. 发明授权

US4691856A Diffusion bonding method using a high energy beam 失效
标题翻译：使用高能束的扩散接合方法
公开(公告)号：US4691856A
公开(公告)日：1987-09-08
申请号：US749764
申请日：1985-06-28
申请人： Takashi Haramaki , Takao Funamoto , Satoshi Kokura , Masahisa Inagaki , Ryutaro Jimbou , Toshimi Sasaki , Kousei Nagayama
发明人： Takashi Haramaki , Takao Funamoto , Satoshi Kokura , Masahisa Inagaki , Ryutaro Jimbou , Toshimi Sasaki , Kousei Nagayama
IPC分类号： B23K20/00 , B23K20/16 , B23K35/00 , B23K19/00
CPC分类号： B23K35/005 , B23K20/00 , B23K20/16 , B23K35/004
摘要： Disclosed is a diffusion bonding method which can be applied to superalloys and comprises forming in advance an alloy layer containing an additional element or elements having a higher diffusion speed than that of the principal constituent element of a base metal and a lower melting point than that of the base metal on the joint surface of the base metal consisting of a heat-resistant superalloy based on Co, Ni, Fe, Ti or the like, and bringing the joint surfaces into contact so as to diffuse B.
摘要翻译：公开了可应用于超级合金的扩散接合方法，包括预先形成含有与基体金属的主要构成元素相比具有更高扩散速度的附加元素的合金层，并且熔点低于由基体Co，Ni，Fe，Ti等的耐热超合金构成的基体金属的接合面上的母材，使接合面接触扩散B.

3. 发明授权

US4645119A Method of brazing an aluminum heat exchanger 失效
标题翻译：钎焊铝热交换器的方法
公开(公告)号：US4645119A
公开(公告)日：1987-02-24
申请号：US627892
申请日：1984-07-05
申请人： Takashi Haramaki , Katsuhiko Shiota , Satoshi Kokura , Takao Funamoto , Akira Tomita
发明人： Takashi Haramaki , Katsuhiko Shiota , Satoshi Kokura , Takao Funamoto , Akira Tomita
IPC分类号： F28F19/06 , B23K1/00 , B23K35/28 , B23K35/34 , B23K35/36 , B23K35/363 , F28D1/047 , F28F1/32 , F28F19/02 , F28F21/08
CPC分类号： F28F21/089 , B23K1/0012 , B23K35/34 , B23K35/3605 , F28D1/0478 , F28F1/32 , F28F21/084
摘要： A heat exchanger and a method of manufacturing a heat exchanger by brazing metal members mainly made of Al or Al alloy is disclosed. The heat exchanger has a plurality of brazed metal members, at least one of the brazed metal members being made of brazing sheet clad with a brazing material. The brazed portions of the metal members or the whole surface of the heat exchanger are coated with a corrosion-resistant fluoride flux consisting essentially of 25-40% KF, 38-54% AlF3 and 3-30% ZnF2 by weight which forms a corrosion-inhibiting metallic film.
摘要翻译：公开了一种热交换器和通过钎焊主要由Al或Al合金制成的金属构件的热交换器的方法。热交换器具有多个钎焊金属构件，钎焊金属构件中的至少一个由钎焊材料包覆的钎焊板制成。金属部件的钎焊部分或热交换器的整个表面涂覆有基本上由25-40％KF，38-54％AlF 3和3-30％ZnF 2重量组成的耐腐蚀氟化物焊剂，其形成腐蚀抑制金属膜。

4. 发明授权

US5231366A Superconducting magnetic field generating apparatus and method of producing the same 失效
标题翻译：超导磁场发生装置及其制造方法
公开(公告)号：US5231366A
公开(公告)日：1993-07-27
申请号：US663471
申请日：1991-03-04
申请人： Takashi Haramaki , Mituo Nakamura , Takao Funamoto , Masahiko Sakamoto , Teruhiro Takizawa , Takeshi Yamagiwa
发明人： Takashi Haramaki , Mituo Nakamura , Takao Funamoto , Masahiko Sakamoto , Teruhiro Takizawa , Takeshi Yamagiwa
IPC分类号： G01R33/381 , A61B5/055 , G01R33/20 , G21B1/11 , H01B12/02 , H01F6/06 , H01L39/02 , H01R4/18 , H01R4/20 , H01R4/68 , H01R43/048
CPC分类号： H01F6/065 , H01L39/02 , H01R4/18 , H01R4/68 , H01R4/20 , H01R43/048 , Y10S505/924 , Y10T29/49014
摘要： A superconducting magnetic field generating apparatus, and coil, a superconducting wire, a method of producing a coil and a method of connecting a superconducting wire which are suitable for such a superconducting magnetic field generating apparatus are disclosed. The superconducting magnetic field generating apparatus has a coil of a wound superconducting wire which is composed of superconducting wires with the end portions thereof connected with each other. Each of the superconducting wires is composed of a plurality of superconducting material wires embedded in a stabilizing member. The group of superconducting material wires is embedded at the connecting portion in a state in which the superconducting material wires are densely gathered to the central portion of the stabilizing member and the superconducting material wires are directly in contact with each other. The stabilizing member exists in the central portion of the assembly of the superconducting material wires and the stabilizing members are closely bonded to the superconducting material wires.
摘要翻译：公开了一种适用于这种超导磁场产生装置的超导磁场产生装置，线圈，超导线，制造线圈的方法和连接超导线的方法。超导磁场产生装置具有由超导线构成的缠绕超导线圈，其端部彼此连接。每个超导线由嵌入在稳定构件中的多根超导材料线构成。超导材料线组在超导材料线密集地聚集到稳定构件的中心部分并且超导材料线彼此直接接触的状态下嵌入连接部分。稳定构件存在于超导材料线的组件的中心部分中，并且稳定构件紧密地结合到超导材料线。

5. 发明授权

US5938954A Submerged laser beam irradiation equipment 失效
标题翻译：浸没式激光束照射设备
公开(公告)号：US5938954A
公开(公告)日：1999-08-17
申请号：US747677
申请日：1996-11-12
申请人： Tsutomu Onuma , Toshimi Matsumoto , Akira Onuma , Mitsuo Nakamura , Choichi Asano , Yasumasa Tamai , Hiroo Koide , Masayuki Kurihara , Takao Funamoto , Fuminori Ishikawa
发明人： Tsutomu Onuma , Toshimi Matsumoto , Akira Onuma , Mitsuo Nakamura , Choichi Asano , Yasumasa Tamai , Hiroo Koide , Masayuki Kurihara , Takao Funamoto , Fuminori Ishikawa
IPC分类号： B23K26/12 , B23K26/00
CPC分类号： B23K26/122
摘要： A submerged laser beam irradiation equipment provides a high quality submerged laser beam processing of a submerged workpiece using only a small amount of a gas. The submerged laser beam irradiation equipment has: a focus lens for focusing a laser beam; a mirror tube which houses the lens; a first nozzle operating to cover the front end of the mirror tube in an irradiating direction of the laser beam; a skirt portion provided at the front end of the first nozzle for preventing water intrusion thereinto; and a shutter mechanism operable to open and close and provided between said skirt portion and said mirror tube for preventing water intrusion into said mirror tube.
摘要翻译：浸没式激光束照射设备仅使用少量气体提供浸没式工件的高质量浸没式激光束处理。浸没式激光束照射设备具有：聚焦激光束的聚焦透镜; 容纳镜头的镜管; 第一喷嘴，其操作以沿着激光束的照射方向覆盖镜管的前端; 裙部，设置在第一喷嘴的前端，用于防止水侵入其中; 以及可操作以打开和关闭并设置在所述裙部和所述镜管之间的挡板机构，用于防止水侵入所述镜管。

6. 发明授权

US5035579A Water-turbine runner and process for manufacturing the same 失效
标题翻译：水轮机转轮及其制造工艺相同
公开(公告)号：US5035579A
公开(公告)日：1991-07-30
申请号：US436701
申请日：1989-11-15
申请人： Masami Yada , Takao Funamoto , Michio Kitamura , Junzo Komatsu , Masakazu Midorikawa , Tsugio Yoshikawa
发明人： Masami Yada , Takao Funamoto , Michio Kitamura , Junzo Komatsu , Masakazu Midorikawa , Tsugio Yoshikawa
IPC分类号： B23K9/00 , C22C38/00 , C22C38/44 , F03B3/12
CPC分类号： F03B3/125 , Y02E10/223 , Y02P70/525 , Y10T29/49336
摘要： A water turbine runner has a plurality of vanes, each made of a rolled steel plates which contains, by weight, 0.01 to 0.10% of C, 0.10 to 1.0% of Si, 0.10 to 2% of Mn, 2 to 7% of Ni, 10 to 15% of Cr and 0.10 to 4% of Mo, 71.9 to 87.7% of Fe, and which has a metallic structure mixture containing, by volume, martensite and 10 to 35% of residual austenite. Each of the vanes is made of a plurality of plate pieces, cut out from the rolled steel plate, press-formed in a shape of a part of the vane and joined by welding into the complete vane.
摘要翻译：水轮机流道具有多个叶片，每个叶片由轧制钢板制成，所述轧制钢板重量含有C：0.01〜0.10％，Si：0.10〜1.0％，Mn：0.10〜2％，Ni：2〜7％，10〜15％的Cr和0.10〜4％的Mo，71.9〜87.7％的Fe，并且具有体积含有马氏体和10〜35％的残余奥氏体的金属结构混合物。每个叶片由从轧制钢板切出的多个板件制成，压制成叶片的一部分的形状并通过焊接连接到完整的叶片中。

7. 发明授权

US06955287B2 Method of bonding metal plates, apparatus therefor and hot strip mill 有权
标题翻译：接合金属板的方法，其设备和热轧机
公开(公告)号：US06955287B2
公开(公告)日：2005-10-18
申请号：US09735548
申请日：2000-12-14
申请人： Kenji Horii , Yasutsugu Yoshimura , Tadashi Nishino , Takashi Kamoshita , Takayoshi Tomino , Fuminori Ishikawa , Takao Funamoto , Takashi Mashiko , Kenjiro Narita , Jong-Keun Kim , Ki-Chol Kim , Jong-Sub Lee , Hwang-Kyu Hwang , Jung-Sik Lee , Jin-Hee Kim
发明人： Kenji Horii , Yasutsugu Yoshimura , Tadashi Nishino , Takashi Kamoshita , Takayoshi Tomino , Fuminori Ishikawa , Takao Funamoto , Takashi Mashiko , Kenjiro Narita , Jong-Keun Kim , Ki-Chol Kim , Jong-Sub Lee , Hwang-Kyu Hwang , Jung-Sik Lee , Jin-Hee Kim
IPC分类号： B23D15/02 , B21B1/26 , B21B15/00 , B23D35/00 , B23K20/02 , B23K20/04 , B21D21/00
CPC分类号： B23D35/001 , B21B15/0085 , B21B2015/0014 , B23K20/023 , B23K2101/18
摘要： An upper shearing blade equipped with a protrusion of a triangle-columnar shape and a lower shearing blade equipped with a protrusion of the same shape are applied onto the overlapped portion of metal plates to be bonded, and then pressed into the metal plates in an oblique direction inclined with respect to the thickness direction by a stroke in such a range that the metal plates are not completely cut off. The operating loci of the upper, shearing blade and the lower shearing blade are overlapped each other so that one falls inside the other, and the sheared surfaces of the metal plates are formed into a bonded portion by plastic flow deformation. Therein, since a compressive force is applied onto the portions to be bonded, the portion being defined by the amount of overlap, and the portions are compressed to form a compressed portion after completion of bonding, the bonding strength enhances. Besides, since the protrusions on the shearing blades generate a pressing force pressing the sheared surfaces onto each other, by an effect of their inclined surfaces, a compression force applied onto the bonded portion further increases.
摘要翻译：将配备有三角柱状突起的上剪切刀片和配备有相同形状的突起的下剪切刀片施加到要接合的金属板的重叠部分上，然后以倾斜的方式压入金属板相对于厚度方向倾斜的方向为金属板未完全切断的范围内的行程。上剪切刀片和下剪切刀片的操作轨迹彼此重叠，使得其彼此落下，并且金属板的剪切表面通过塑性流动变形形成接合部分。其中，由于在要接合的部分上施加压缩力，该部分由重叠量限定，并且在结合完成之后压缩该部分以形成压缩部分，因此提高了接合强度。此外，由于剪切刀片上的突起产生按压剪切面彼此的挤压力，所以通过它们的倾斜表面的作用，施加在接合部分上的压缩力进一步增加。

8. 发明授权

US06225598B1 Method of high frequency pulse arc welding and apparatus therefor 失效
标题翻译：高频脉冲电弧焊接方法及其设备
公开(公告)号：US06225598B1
公开(公告)日：2001-05-01
申请号：US09112210
申请日：1998-07-09
申请人： Masayasu Nihei , Jin Onuki , Takao Funamoto , Izumi Sakurai , Akira Onuma
发明人： Masayasu Nihei , Jin Onuki , Takao Funamoto , Izumi Sakurai , Akira Onuma
IPC分类号： B23K909
CPC分类号： B23K9/092
摘要： In a method for high frequency pulse welding and an apparatus therefor, a highly directive arc can be obtained by eliminating the effect of the inductance of the welding cable, which tends to make the high frequency electromagnetic pinch force large. In a method and an apparatus for high frequency pulse arc welding which is performed by generating an arc between an inconsumable electrode or a consumable electrode arranged near a portion of a base metal to be welded and the base metal with main pulse current, when the main pulse current is shifted from ON to OFF, a reverse pulse current having a polarity opposite to the polarity of the main pulse is supplied between the electrode and the base metal to improve the stiffness (directivity) of the arc by making the rising and falling edges of the pulses steeper. A rail-car and a nuclear power plant obtained by the method are also provided.
摘要翻译：在高频脉冲焊接的方法及其装置中，通过消除焊接电缆的电感的影响，可以获得高度指示的电弧，这倾向于使高频电磁夹紧力变大。在高频脉冲电弧焊接方法和装置中，通过在被焊接的贱金属部分附近设置的不可蚀电极或可消耗电极与主脉冲电流的母材之间产生电弧来进行，脉冲电流从ON变为OFF，在电极和母材之间提供具有与主脉冲极性相反极性的反向脉冲电流，通过使上升沿和下降沿提高电弧的刚度（方向性）的脉冲更陡。还提供了通过该方法获得的轨道车和核电站。

9. 发明授权

US5884832A Method of bonding metal plates, apparatus therefor and hot strip mill 失效
标题翻译：接合金属板的方法，其设备和热轧机
公开(公告)号：US5884832A
公开(公告)日：1999-03-23
申请号：US736208
申请日：1996-10-25
申请人： Takao Funamoto , Gen Nagakubo , Takashi Mashiko , Fuminori Ishikawa , Tadashi Nishino , Yusutsugu Yoshimura , Toshiyuki Kajiwara , Kenichi Yasuda , Mitsuo Nihei , Yoshio Takakura , Hironori Shimogama
发明人： Takao Funamoto , Gen Nagakubo , Takashi Mashiko , Fuminori Ishikawa , Tadashi Nishino , Yusutsugu Yoshimura , Toshiyuki Kajiwara , Kenichi Yasuda , Mitsuo Nihei , Yoshio Takakura , Hironori Shimogama
IPC分类号： B21B15/00 , B23K20/02
CPC分类号： B21B15/0085 , B23K20/023 , B23K2201/16
摘要： A bonding apparatus for bonding metal plates, includes an overlapping mechanism for overlapping end portions of the metal plates, at least two supports for supporting the overlapped portion of the metal plates at one side of the metal plates, and a shearing blade disposed opposite the supports so as to sandwich the overlapped portion of the metal plates therebetween, wherein a mechanism is provided for moving relatively moving at least one of the shearing blade and the supports so as to press the shearing blade into the overlapped portion of the metal plates disposed between the supports and the shearing blade. A method for bonding is characterized by bonding metal plates by using the above apparatus.
摘要翻译：用于接合金属板的接合装置包括用于重叠金属板的端部的重叠机构，用于在金属板的一侧支撑金属板的重叠部分的至少两个支撑件和与支撑件相对设置的剪切刀片以夹在其间的金属板的重叠部分，其中设置有用于移动相对移动的剪切刀片和支撑件中的至少一个的机构，以将剪切刀片压入设置在该金属板之间的金属板的重叠部分中支撑和剪切刀片。接合方法的特征在于通过使用上述装置将金属板接合。

10. 发明授权

US4996589A Semiconductor module and cooling device of the same 失效
标题翻译：半导体模块和冷却装置相同
公开(公告)号：US4996589A
公开(公告)日：1991-02-26
申请号：US258609
申请日：1988-10-17
申请人： Ryoichi Kajiwara , Takao Funamoto , Mituo Kato , Hiroshi Wachi , Tomohiko Shida
发明人： Ryoichi Kajiwara , Takao Funamoto , Mituo Kato , Hiroshi Wachi , Tomohiko Shida
IPC分类号： H01L23/433
CPC分类号： H01L23/433 , H01L23/4332 , H01L2224/16 , H01L2224/48247 , H01L2224/73253 , H01L24/48 , H01L2924/00014 , H01L2924/01068 , H01L2924/01079 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/1532 , H01L2924/16152 , H01L2924/16195 , H01L2924/181
摘要： A number of LSI chips (9) are mounted on a wiring substrate (12). A cooling element (68) comprises a housing (1), a bellows (2) and a cooling plate (6) for introducing a cooling medium. The cooling element is connected to the LSI chip by low melting solder, at the same time, the cooling plate is connected to the wiring substrate through a skirt (5) which is connected to the cooling plate and also connected to the wiring substrate by a low melting solder.
摘要翻译：多个LSI芯片（9）安装在布线基板（12）上。冷却元件（68）包括壳体（1），波纹管（2）和用于引入冷却介质的冷却板（6）。冷却元件通过低熔点焊料与LSI芯片连接，同时冷却板通过与冷却板连接的裙部（5）连接到布线基板，并且还通过一个低熔点焊料。

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