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    • 3. 发明授权
    • Semiconductor device
    • 半导体器件
    • US06696755B2
    • 2004-02-24
    • US10389121
    • 2003-03-14
    • Nobuharu KamiKazuhiko KurataSatoshi DoumaeTakara Sugimoto
    • Nobuharu KamiKazuhiko KurataSatoshi DoumaeTakara Sugimoto
    • H01L2334
    • G02B6/4201G02B6/4214H01L2224/16225H01L2224/48091H01L2224/48472H01L2924/10253H01L2924/30107H01L2924/3011H01L2924/00014H01L2924/00
    • A semiconductor device comprises: an insulating flexible film capable of changing its profile; first and second conductive layers provided on both surfaces of the flexible film and constituting wiring patterns; an LSI mounted on the first conductive layer; a conductor provided in a hole formed in the flexible film and making connection between the wiring pattern formed in the first conductive layer and the wiring pattern formed in the second wiring pattern; a stiffener; and a heat spreader. A part of the wiring pattern constituted by each of the first conductive layer and the second wiring pattern is a conductive wiring, whose characteristic impedance is previously calculated, for a high-speed signal and a connection portion for making connection to a mother board is provided on an end of the conductive wiring for a high-speed signal. Thus the semiconductor device is able to have a high heat removal ability without sacrificing its electrical performance and enables time efficiency in package design associated with package assembly and reduced assembly cost.
    • 半导体器件包括:能够改变其形状的绝缘柔性膜; 设置在柔性膜的两个表面上并构成布线图案的第一和第二导电层; 安装在第一导电层上的LSI; 设置在形成在所述柔性膜中的孔中并且形成在所述第一导电层中形成的布线图案与形成在所述第二布线图案中的布线图案之间的连接的导体; 加强筋 和散热器。 由第一导电层和第二布线图案中的每一个构成的布线图形的一部分是针对高速信号预先计算其特性阻抗的导电布线和用于连接到母板的连接部分 在用于高速信号的导电布线的一端。 因此,半导体器件能够具有高的除热能力,而不牺牲其电性能,并且能够实现与封装组装相关的封装设计中的时间效率并降低组装成本。
    • 4. 发明授权
    • Semiconductor device having optical signal input-output mechanism
    • 具有光信号输入输出机构的半导体装置
    • US07561762B2
    • 2009-07-14
    • US11575482
    • 2005-09-20
    • Kazunori MiyoshiKazuhiko KurataTakanori ShimizuIchiro HatakeyamaJunichi Sasaki
    • Kazunori MiyoshiKazuhiko KurataTakanori ShimizuIchiro HatakeyamaJunichi Sasaki
    • G02B6/12G02B6/26G02B6/42
    • G02B6/42G02B6/4214G02B6/4232H05K1/141H05K1/147H05K1/189
    • A semiconductor device has printed wiring board (11) where electric wiring (18) connected to LSI chip (17) and to planar optical element (21) is formed, and where optical waveguide (25) which transfers light inputted into planar optical element (21) and/or light outputted from planar optical element (21) is fixed. Planar optical element (21) is mounted in one end of small substrate (13), and another end of small substrate (13) is connected to printed wiring board (11) by solder bump (26). One end of small substrate (13) where planar optical element (21) is mounted is fixed to printed wiring board (11) by a fixing mechanism. Small substrate (13) has flexible section (15), which is easily deformable compared with other portions of printed wiring board (11) and small substrate (13), in at least a partial region between one end where planar optical element (21) is mounted and another end electrically connected to printed wiring board (11).
    • 半导体装置具有印刷电路板(11),其中形成连接到LSI芯片(17)和平面光学元件(21)的电线(18),并且其中传输输入到平面光学元件的光的光波导(25) 21)和/或从平面光学元件(21)输出的光是固定的。 平面光学元件(21)安装在小基板(13)的一端,小基板(13)的另一端通过焊料凸块(26)与印刷电路板(11)连接。 安装平面光学元件(21)的小基板(13)的一端通过固定机构固定到印刷电路板(11)。 小基板(13)具有柔性部分(15),其与印刷电路板(11)和小基板(13)的其它部分相比容易变形,在平面光学元件(21)的一端之间的至少一部分区域中, 并且另一端电连接到印刷线路板(11)。
    • 7. 发明授权
    • Optical transceiver and optical connector
    • 光收发器和光连接器
    • US07918610B2
    • 2011-04-05
    • US12420302
    • 2009-04-08
    • Kunihiko FujiwaraAkito NishimuraYukio HayashiTetsuo NozawaTakanori ShimizuIchiro HatakeyamaKazuhiko Kurata
    • Kunihiko FujiwaraAkito NishimuraYukio HayashiTetsuo NozawaTakanori ShimizuIchiro HatakeyamaKazuhiko Kurata
    • G02B6/36G02B6/30
    • G02B6/4292G02B6/4214G02B6/4249
    • An optical connector fitted upon a tip end portion of an optical fiber ribbon and disposed to face an optical input and output terminators which are installed upon a substrate, and which optically connects between optical fibers of the optical fiber ribbon and each of the optical input and output terminators. The optical connector includes a block shaped connector main body which is disposed to face the optical input and output terminators. The connector main body includes a hollow optical fiber holding portion for holding mainly a coating portion of an optical fiber which is led generally in parallel with the surface of the substrate, a plurality of optical fiber apertures into which the tip end vicinity of the optical fibers are inserted and fixed and a concave spot for changing the optical axis comprising a reflective surface for changing the optical axis and formed in front of an exit of the optical fiber apertures, which causes the optical axis direction of the optical fiber to face the optical input and output terminators.
    • 一种光学连接器,其安装在光纤带的末端部分上并且被设置为面对安装在基板上的光输入和输出终端器,并且将光纤带的光纤与光输入和 输出终结器。 光连接器包括一个块形连接器主体,它被设置为面对光输入和输出终端。 连接器主体包括:中空光纤保持部,主要保持与基板的表面大致平行的光纤的涂布部,多个光纤孔,光纤的前端附近 插入和固定凹部,用于改变光轴的凹点包括用于改变光轴并形成在光纤孔的出口前面的反射表面的光轴,使得光纤的光轴方向面对光输入 和输出终端。
    • 8. 发明授权
    • Semiconductor device having optical signal input-output mechanism
    • 具有光信号输入输出机构的半导体装置
    • US07783143B2
    • 2010-08-24
    • US12418214
    • 2009-04-03
    • Kazunori MiyoshiKazuhiko KurataTakanori ShimizuIchiro HatakeyamaJunichi Sasaki
    • Kazunori MiyoshiKazuhiko KurataTakanori ShimizuIchiro HatakeyamaJunichi Sasaki
    • G02B6/12G02B6/26G02B6/42
    • G02B6/42G02B6/4214G02B6/4232H05K1/141H05K1/147H05K1/189
    • A semiconductor device has printed wiring board (11) where electric wiring (18) connected to LSI chip (17) and to planar optical element (21) is formed, and where optical waveguide (25) which transfers light inputted into planar optical element (21) and/or light outputted from planar optical element (21) is fixed. Planar optical element (21) is mounted in one end of small substrate (13), and another end of small substrate (13) is connected to printed wiring board (11) by solder bump (26). One end of small substrate (13) where planar optical element (21) is mounted is fixed to printed wiring board (11) by a fixing mechanism. Small substrate (13) has flexible section (15), which is easily deformable compared with other portions of printed wiring board (11) and small substrate (13), in at least a partial region between one end where planar optical element (21) is mounted and another end electrically connected to printed wiring board (11).
    • 半导体装置具有印刷电路板(11),其中形成连接到LSI芯片(17)和平面光学元件(21)的电线(18),并且其中传输输入到平面光学元件的光的光波导(25) 21)和/或从平面光学元件(21)输出的光是固定的。 平面光学元件(21)安装在小基板(13)的一端,小基板(13)的另一端通过焊料凸块(26)与印刷电路板(11)连接。 安装平面光学元件(21)的小基板(13)的一端通过固定机构固定到印刷电路板(11)。 小基板(13)具有柔性部分(15),其与印刷电路板(11)和小基板(13)的其它部分相比容易变形,在平面光学元件(21)的一端之间的至少一部分区域中, 并且另一端电连接到印刷线路板(11)。