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    • 1. 发明授权
    • Deposition methods and stacked film formed thereby
    • 沉积方法和层叠膜由此形成
    • US07544273B2
    • 2009-06-09
    • US10467337
    • 2001-12-10
    • Takahiro TanedaKoso FujinoKazuya Ohmatsu
    • Takahiro TanedaKoso FujinoKazuya Ohmatsu
    • C23C14/00
    • C23C14/225C23C14/28C30B23/02C30B29/16C30B29/22C30B29/225H01L39/2461Y10T428/12493
    • A method of making a film having a uniform thickness and having a crystal axis parallel to a main surface of a substrate is described. In a deposition method, a film is formed by scattering a deposition material from a target (12) surface and growing the scattered deposition material on a main surface (100a) of a substrate (100). The method includes the steps of positioning the substrate (100) into a first state where the distance between one end (100f) and the target (12) is small and the distance between the other end (100e) and the target material (12) is relatively large, forming a first film (110) on the substrate (100) in the first state, positioning the substrate (100) into a second state where the distance between one end (100f) and the target (12) is large and the distance between the other end (100e) and the target (12) is small, and. forming a second film (120) on the first film (110) in the second state.
    • 描述了制造具有均匀厚度并且具有平行于基板的主表面的晶轴的膜的方法。 在沉积方法中,通过从靶(12)表面散射沉积材料并将散射的沉积材料生长在基底(100)的主表面(100a)上而形成膜。 该方法包括以下步骤:将基板(100)定位成第一状态,其中一端(100f)和目标(12)之间的距离小,另一端(100e)和目标材料(12)之间的距离 相对较大,在第一状态下在基板(100)上形成第一膜(110),将基板(100)定位成一端(100f)和目标(12)之间的距离较大的第二状态,以及 另一端(100e)与靶(12)之间的距离小, 在第二状态下在第一膜(110)上形成第二膜(120)。
    • 5. 发明申请
    • THIN FILM SUPERCONDUCTING WIRE AND SUPERCONDUCTING CABLE CONDUCTOR
    • 薄膜超导电线和超导电缆导体
    • US20110244234A1
    • 2011-10-06
    • US13133274
    • 2009-12-03
    • Takahiro TanedaTatsuoki Nagaishi
    • Takahiro TanedaTatsuoki Nagaishi
    • B32B15/02
    • C23C14/087C23C14/024C23C14/584C23C28/023C23C28/322C23C28/3455C25D5/34C25D7/0607H01B12/06H01L39/143Y02E40/642Y10T428/2933
    • A thin film superconducting wire with a copper plating thin film produced on a surface of a laminated structure is inferior in bending properties to a thin film superconducting wire having no copper plating thin film. Therefore, a thin film superconducting wire according to the present invention is a thin film superconducting wire including a laminated structure having a substrate, a buffer layer located on one of main surfaces of the substrate, and a superconducting layer located on a main surface of the buffer layer opposite to a main surface facing the substrate. The thin film superconducting wire further includes a copper plating thin film covering an outer periphery of the laminated structure, a residual stress within the copper plating thin film serving as a compression stress. The laminated structure may have a sputtered silver layer. A silver covering layer covering the outer periphery of the laminated structure may be further provided between the copper plating thin film and the laminated structure.
    • 在层叠结构体的表面上形成有镀铜薄膜的薄膜超导线,对于不具有镀铜薄膜的薄膜超导线,弯曲性差。 因此,根据本发明的薄膜超导线是一种薄膜超导线,其包括层叠结构,其具有基板,位于基板的主表面中的一个上的缓冲层和位于基板的主表面上的超导层 缓冲层与面向衬底的主表面相对。 薄膜超导线还包括覆盖层叠结构的外周的镀铜薄膜,作为压电应力的镀铜薄膜内的残留应力。 层压结构可以具有溅射的银层。 覆盖层叠结构的外周的银覆盖层可以进一步设置在镀铜薄膜和层叠结构之间。