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1. 发明申请

US20090050940A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20090050940A1
公开(公告)日：2009-02-26
申请号：US12253850
申请日：2008-10-17
申请人： Takahiro Hayashi , Shunsuke Toyoshima , Kazuo Sakamoto , Naozumi Morino , Kazuo Tanaka
发明人： Takahiro Hayashi , Shunsuke Toyoshima , Kazuo Sakamoto , Naozumi Morino , Kazuo Tanaka
IPC分类号： H01L27/10
CPC分类号： H01L23/49844 , H01L23/49811 , H01L23/50 , H01L23/5226 , H01L23/5286 , H01L23/53228 , H01L23/585 , H01L24/05 , H01L24/06 , H01L24/49 , H01L27/0255 , H01L27/092 , H01L2224/02166 , H01L2224/05025 , H01L2224/05093 , H01L2224/05095 , H01L2224/05124 , H01L2224/05624 , H01L2224/06102 , H01L2224/06133 , H01L2224/06143 , H01L2224/06153 , H01L2224/06163 , H01L2224/49105 , H01L2224/85399 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/12036 , H01L2924/1306 , H01L2924/14 , H01L2924/00 , H01L2224/05599 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： The present invention has for its purpose to provide a technique capable of reducing planar dimension of the semiconductor device. An input/output circuit is formed over the semiconductor substrate, a grounding wiring and a power supply wiring pass over the input/output circuit, and a conductive layer for a bonding pad is formed thereover. The input/output circuit is formed of MISFET elements in the nMISFET forming region and the pMISFET forming region, resistance elements in the resistance element forming regions and diode elements in the diode element forming regions functioning as protective elements. A wiring connected to the protective elements and positioned under the grounding wiring and the power supply wiring is pulled out in a pulling-out region between the nMISFET forming region and the pMISFET forming region and between the grounding wiring and the power supply wiring to be connected to the conductive layer.
摘要翻译：本发明的目的是提供一种能够减小半导体器件的平面尺寸的技术。在半导体衬底上形成输入/输出电路，接地布线和电源布线通过输入/输出电路，并且在其上形成用于焊盘的导电层。输入/输出电路由nMISFET形成区域和pMISFET形成区域中的MISFET元件形成，电阻元件形成区域中的电阻元件和用作保护元件的二极管元件形成区域中的二极管元件。连接到保护元件并位于接地布线和电源布线下方的布线在nMISFET形成区域和pMISFET形成区域之间以及接地布线和要连接的电源布线之间的拉出区域中拉出到导电层。

2. 发明授权

US07714357B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US07714357B2
公开(公告)日：2010-05-11
申请号：US12253850
申请日：2008-10-17
申请人： Takahiro Hayashi , Shunsuke Toyoshima , Kazuo Sakamoto , Naozumi Morino , Kazuo Tanaka
发明人： Takahiro Hayashi , Shunsuke Toyoshima , Kazuo Sakamoto , Naozumi Morino , Kazuo Tanaka
IPC分类号： H01L29/74 , H01L23/52
CPC分类号： H01L23/49844 , H01L23/49811 , H01L23/50 , H01L23/5226 , H01L23/5286 , H01L23/53228 , H01L23/585 , H01L24/05 , H01L24/06 , H01L24/49 , H01L27/0255 , H01L27/092 , H01L2224/02166 , H01L2224/05025 , H01L2224/05093 , H01L2224/05095 , H01L2224/05124 , H01L2224/05624 , H01L2224/06102 , H01L2224/06133 , H01L2224/06143 , H01L2224/06153 , H01L2224/06163 , H01L2224/49105 , H01L2224/85399 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/12036 , H01L2924/1306 , H01L2924/14 , H01L2924/00 , H01L2224/05599 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： The present invention has for its purpose to provide a technique capable of reducing planar dimension of the semiconductor device. An input/output circuit is formed over the semiconductor substrate, a grounding wiring and a power supply wiring pass over the input/output circuit, and a conductive layer for a bonding pad is formed thereover. The input/output circuit is formed of MISFET elements in the nMISFET forming region and the pMISFET forming region, resistance elements in the resistance element forming regions and diode elements in the diode element forming regions functioning as protective elements. A wiring connected to the protective elements and positioned under the grounding wiring and the power supply wiring is pulled out in a pulling-out region between the nMISFET forming region and the pMISFET forming region and between the grounding wiring and the power supply wiring to be connected to the conductive layer.
摘要翻译：本发明的目的是提供一种能够减小半导体器件的平面尺寸的技术。在半导体衬底上形成输入/输出电路，接地布线和电源布线通过输入/输出电路，并且在其上形成用于焊盘的导电层。输入/输出电路由nMISFET形成区域和pMISFET形成区域中的MISFET元件形成，电阻元件形成区域中的电阻元件和用作保护元件的二极管元件形成区域中的二极管元件。连接到保护元件并位于接地布线和电源布线下方的布线在nMISFET形成区域和pMISFET形成区域之间以及接地布线和要连接的电源布线之间的拉出区域中拉出到导电层。

3. 发明申请

US20100171177A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20100171177A1
公开(公告)日：2010-07-08
申请号：US12727811
申请日：2010-03-19
申请人： Takahiro HAYASHI , Shunsuke Toyoshima , Kazuo Sakamoto , Naozumi Morino , Kazuo Tanaka
发明人： Takahiro HAYASHI , Shunsuke Toyoshima , Kazuo Sakamoto , Naozumi Morino , Kazuo Tanaka
IPC分类号： H01L27/06 , H01L23/58
CPC分类号： H01L23/49844 , H01L23/49811 , H01L23/50 , H01L23/5226 , H01L23/5286 , H01L23/53228 , H01L23/585 , H01L24/05 , H01L24/06 , H01L24/49 , H01L27/0255 , H01L27/092 , H01L2224/02166 , H01L2224/05025 , H01L2224/05093 , H01L2224/05095 , H01L2224/05124 , H01L2224/05624 , H01L2224/06102 , H01L2224/06133 , H01L2224/06143 , H01L2224/06153 , H01L2224/06163 , H01L2224/49105 , H01L2224/85399 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/12036 , H01L2924/1306 , H01L2924/14 , H01L2924/00 , H01L2224/05599 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： The present invention has for its purpose to provide a technique capable of reducing planar dimension of the semiconductor device. An input/output circuit is formed over the semiconductor substrate, a grounding wiring and a power supply wiring pass over the input/output circuit, and a conductive layer for a bonding pad is formed thereover. The input/output circuit is formed of MISFET elements in the nMISFET forming region and the pMISFET forming region, resistance elements in the resistance element forming regions and diode elements in the diode element forming regions functioning as protective elements. A wiring connected to the protective elements and positioned under the grounding wiring and the power supply wiring is pulled out in a pulling-out region between the nMISFET forming region and the pMISFET forming region and between the grounding wiring and the power supply wiring to be connected to the conductive layer.
摘要翻译：本发明的目的是提供一种能够减小半导体器件的平面尺寸的技术。在半导体衬底上形成输入/输出电路，接地布线和电源布线通过输入/输出电路，并且在其上形成用于焊盘的导电层。输入/输出电路由nMISFET形成区域和pMISFET形成区域中的MISFET元件形成，电阻元件形成区域中的电阻元件和用作保护元件的二极管元件形成区域中的二极管元件。连接到保护元件并位于接地布线和电源布线下方的布线在nMISFET形成区域和pMISFET形成区域之间以及接地布线和要连接的电源布线之间的拉出区域中拉出到导电层。

4. 发明授权

US08552561B2 Semiconductor device with output circuit arrangement 有权
标题翻译：具有输出电路布置的半导体器件
公开(公告)号：US08552561B2
公开(公告)日：2013-10-08
申请号：US12727811
申请日：2010-03-19
申请人： Takahiro Hayashi , Shunsuke Toyoshima , Kazuo Sakamoto , Naozumi Morino , Kazuo Tanaka
发明人： Takahiro Hayashi , Shunsuke Toyoshima , Kazuo Sakamoto , Naozumi Morino , Kazuo Tanaka
IPC分类号： H01L23/52 , H01L23/62
CPC分类号： H01L23/49844 , H01L23/49811 , H01L23/50 , H01L23/5226 , H01L23/5286 , H01L23/53228 , H01L23/585 , H01L24/05 , H01L24/06 , H01L24/49 , H01L27/0255 , H01L27/092 , H01L2224/02166 , H01L2224/05025 , H01L2224/05093 , H01L2224/05095 , H01L2224/05124 , H01L2224/05624 , H01L2224/06102 , H01L2224/06133 , H01L2224/06143 , H01L2224/06153 , H01L2224/06163 , H01L2224/49105 , H01L2224/85399 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/12036 , H01L2924/1306 , H01L2924/14 , H01L2924/00 , H01L2224/05599 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： The present invention has for its purpose to provide a technique capable of reducing planar dimension of the semiconductor device. An input/output circuit is formed over the semiconductor substrate, a grounding wiring and a power supply wiring pass over the input/output circuit, and a conductive layer for a bonding pad is formed thereover. The input/output circuit is formed of MISFET elements in the nMISFET forming region and the pMISFET forming region, resistance elements in the resistance element forming regions and diode elements in the diode element forming regions functioning as protective elements. A wiring connected to the protective elements and positioned under the grounding wiring and the power supply wiring is pulled out in a pulling-out region between the nMISFET forming region and the pMISFET forming region and between the grounding wiring and the power supply wiring to be connected to the conductive layer.
摘要翻译：本发明的目的是提供一种能够减小半导体器件的平面尺寸的技术。在半导体衬底上形成输入/输出电路，接地布线和电源布线通过输入/输出电路，并且在其上形成用于焊盘的导电层。输入/输出电路由nMISFET形成区域和pMISFET形成区域中的MISFET元件形成，电阻元件形成区域中的电阻元件和用作保护元件的二极管元件形成区域中的二极管元件。连接到保护元件并位于接地布线和电源布线下方的布线在nMISFET形成区域和pMISFET形成区域之间以及接地布线和要连接的电源布线之间的拉出区域中拉出到导电层。

5. 发明申请

US20070120258A1 Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：US20070120258A1
公开(公告)日：2007-05-31
申请号：US11604855
申请日：2006-11-28
申请人： Takahiro Hayashi , Shunsuke Toyoshima , Kazuo Sakamoto , Naozumi Morino , Kazuo Tanaka
发明人： Takahiro Hayashi , Shunsuke Toyoshima , Kazuo Sakamoto , Naozumi Morino , Kazuo Tanaka
IPC分类号： H01L23/52
CPC分类号： H01L23/49844 , H01L23/49811 , H01L23/50 , H01L23/5226 , H01L23/5286 , H01L23/53228 , H01L23/585 , H01L24/05 , H01L24/06 , H01L24/49 , H01L27/0255 , H01L27/092 , H01L2224/02166 , H01L2224/05025 , H01L2224/05093 , H01L2224/05095 , H01L2224/05124 , H01L2224/05624 , H01L2224/06102 , H01L2224/06133 , H01L2224/06143 , H01L2224/06153 , H01L2224/06163 , H01L2224/49105 , H01L2224/85399 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/12036 , H01L2924/1306 , H01L2924/14 , H01L2924/00 , H01L2224/05599 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： The present invention has for its purpose to provide a technique capable of reducing planar dimension of the semiconductor device. An input/output circuit is formed over the semiconductor substrate, a grounding wiring and a power supply wiring pass over the input/output circuit, and a conductive layer for a bonding pad is formed thereover. The input/output circuit is formed of MISFET elements in the nMISFET forming region and the pMISFET forming region, resistance elements in the resistance element forming regions and diode elements in the diode element forming regions functioning as protective elements. A wiring connected to the protective elements and positioned under the grounding wiring and the power supply wiring is pulled out in a pulling-out region between the nMISFET forming region and the pMISFET forming region and between the grounding wiring and the power supply wiring to be connected to the conductive layer.
摘要翻译：本发明的目的是提供一种能够减小半导体器件的平面尺寸的技术。在半导体衬底上形成输入/输出电路，接地布线和电源布线通过输入/输出电路，并且在其上形成用于焊盘的导电层。输入/输出电路由nMISFET形成区域和pMISFET形成区域中的MISFET元件形成，电阻元件形成区域中的电阻元件和用作保护元件的二极管元件形成区域中的二极管元件。连接到保护元件并位于接地布线和电源布线下方的布线在nMISFET形成区域和pMISFET形成区域之间以及接地布线和要连接的电源布线之间的拉出区域中拉出到导电层。

6. 发明授权

US07855590B2 Semiconductor integrated circuit device 有权
标题翻译：半导体集成电路器件
公开(公告)号：US07855590B2
公开(公告)日：2010-12-21
申请号：US12422712
申请日：2009-04-13
申请人： Yusuke Kanno , Kazuo Tanaka , Shunsuke Toyoshima , Takeo Toba
发明人： Yusuke Kanno , Kazuo Tanaka , Shunsuke Toyoshima , Takeo Toba
IPC分类号： H03L5/00
CPC分类号： H03K19/018521 , H01L27/0928 , H01L27/105 , H03K3/356113
摘要： A semiconductor integrated circuit device including an I/O circuitry capable of low-voltage high-speed operation at low cost is provided. In the I/O circuitry, when an I/O voltage (for example, 3.3 V) is lowered to a predetermined voltage (for example, 1.8 V), portions causing a speed deterioration are a level conversion unit and a pre-buffer unit for driving a main large-sized buffer. In view of this, a high voltage is applied to a level up converter and a pre-buffer circuit. By doing so, it is possible to achieve an I/O circuitry capable of low-voltage high-speed operation at low cost.
摘要翻译：提供了包括能够以低成本进行低电压高速运行的I / O电路的半导体集成电路装置。在I / O电路中，当I / O电压（例如3.3V）降低到预定电压（例如1.8V）时，导致速度劣化的部分是电平转换单元和预缓冲单元用于驱动主要大型缓冲区。鉴于此，高电压被施加到电平转换器和预缓冲器电路。通过这样做，可以以低成本实现能够进行低电压高速操作的I / O电路。

7. 发明授权

US08013656B2 Semicondutor integrated circuit device 有权
标题翻译：半导体集成电路器件
公开(公告)号：US08013656B2
公开(公告)日：2011-09-06
申请号：US12944898
申请日：2010-11-12
申请人： Yusuko Kanno , Kazuo Tanaka , Shunsuke Toyoshima , Takeo Toba
发明人： Yusuko Kanno , Kazuo Tanaka , Shunsuke Toyoshima , Takeo Toba
IPC分类号： H03L5/00
CPC分类号： H03K19/018521 , H01L27/0928 , H01L27/105 , H03K3/356113
摘要： A semiconductor integrated circuit device including an I/O circuitry capable of low-voltage high-speed operation at low cost is provided. In the I/O circuitry, when an I/O voltage (for example, 3.3 V) is lowered to a predetermined voltage (for example, 1.8 V), portions causing a speed deterioration are a level conversion unit and a pre-buffer unit for driving a main large-sized buffer. In view of this, a high voltage is applied to a level up converter and a pre-buffer circuit. By doing so, it is possible to achieve an I/O circuitry capable of low-voltage high-speed operation at low cost.
摘要翻译：提供了包括能够以低成本进行低电压高速运行的I / O电路的半导体集成电路装置。在I / O电路中，当I / O电压（例如3.3V）降低到预定电压（例如1.8V）时，导致速度劣化的部分是电平转换单元和预缓冲单元用于驱动主要大型缓冲区。鉴于此，高电压被施加到电平转换器和预缓冲器电路。通过这样做，可以以低成本实现能够进行低电压高速操作的I / O电路。

8. 发明申请

US20060232307A1 Semiconductor integrated circuit device 有权
标题翻译：半导体集成电路器件
公开(公告)号：US20060232307A1
公开(公告)日：2006-10-19
申请号：US11405541
申请日：2006-04-18
申请人： Yusuke Kanno , Kazuo Tanaka , Shunsuke Toyoshima , Takeo Toba
发明人： Yusuke Kanno , Kazuo Tanaka , Shunsuke Toyoshima , Takeo Toba
IPC分类号： H03B1/00
CPC分类号： H03K19/018521 , H01L27/0928 , H01L27/105 , H03K3/356113
摘要： A semiconductor integrated circuit device including an I/O circuitry capable of low-voltage high-speed operation at low cost is provided. In the I/O circuitry, when an I/O voltage (for example, 3.3 V) is lowered to a predetermined voltage (for example, 1.8 V), portions causing a speed deterioration are a level conversion unit and a pre-buffer unit for driving a main large-sized buffer. In view of this, a high voltage is applied to a level up converter and a pre-buffer circuit. By doing so, it is possible to achieve an I/O circuitry capable of low-voltage high-speed operation at low cost.
摘要翻译：提供了包括能够以低成本进行低电压高速运行的I / O电路的半导体集成电路装置。在I / O电路中，当I / O电压（例如3.3V）降低到预定电压（例如1.8V）时，导致速度劣化的部分是电平转换单元和预缓冲单元用于驱动主要大型缓冲区。鉴于此，高电压被施加到电平转换器和预缓冲器电路。通过这样做，可以以低成本实现能够进行低电压高速操作的I / O电路。

9. 发明授权

US08067789B2 Semiconductor integrated circuit device 有权
标题翻译：半导体集成电路器件
公开(公告)号：US08067789B2
公开(公告)日：2011-11-29
申请号：US12959635
申请日：2010-12-03
申请人： Shunsuke Toyoshima , Kazuo Tanaka , Masaru Iwabuchi
发明人： Shunsuke Toyoshima , Kazuo Tanaka , Masaru Iwabuchi
IPC分类号： H01L23/52
CPC分类号： H01L27/0251 , H01L24/06 , H01L2224/05553 , H01L2924/12036 , H01L2924/13091 , H01L2924/14 , H01L2924/00
摘要： To provide a semiconductor integrated circuit device advantageous against EM and ESD. A plurality of I/O cells; a power wire formed of a plurality of interconnect layers over the above-described I/O cells; a bonding pad formed in an upper layer of the power wire and in a position corresponding to the I/O cell; and lead-out areas capable of electrically coupling the I/O cell to the bonding pad are provided. The above-described power wire includes a first power wire and a second power wire, and the above-described I/O cell includes first elements coupled to the first power wire and second elements coupled to the second power wire. The first element is placed on the first power wire side, and the second element is placed on the second power wire side. The first power wire and the second power wire can allow for a high current due to the interconnect layers over the I/O cells, thus having robustness against EM and ESD.
摘要翻译：提供有利于抗EM和ESD的半导体集成电路器件。多个I / O单元; 由上述I / O单元上的多个互连层形成的电力线; 焊盘，形成在所述电力线的上层并且与所述I / O单元相对应的位置; 并且提供能够将I / O单元电耦合到接合焊盘的导出区域。上述电源线包括第一电源线和第二电源线，并且上述I / O单元包括耦合到第一电力线的第一元件和耦合到第二电力线的第二元件。第一元件放置在第一电源线侧，第二元件放置在第二电源线侧。第一电源线和第二电源线可以由于I / O单元上的互连层而允许高电流，因此具有抵抗EM和ESD的鲁棒性。

10. 发明申请

US20080169486A1 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE 审中-公开
标题翻译：半导体集成电路设备
公开(公告)号：US20080169486A1
公开(公告)日：2008-07-17
申请号：US11963808
申请日：2007-12-22
申请人： Shunsuke Toyoshima , Kazuo Tanaka , Masaru Iwabuchi
发明人： Shunsuke Toyoshima , Kazuo Tanaka , Masaru Iwabuchi
IPC分类号： H01L27/06
CPC分类号： H01L27/0251 , H01L24/06 , H01L2224/05553 , H01L2924/12036 , H01L2924/13091 , H01L2924/14 , H01L2924/00
摘要： To provide a semiconductor integrated circuit device advantageous against EM and ESD. A plurality of I/O cells; a power wire formed of a plurality of interconnect layers over the above-described I/O cells; a bonding pad formed in an upper layer of the power wire and in a position corresponding to the I/O cell; and lead-out areas capable of electrically coupling the I/O cell to the bonding pad are provided. The above-described power wire includes a first power wire and a second power wire, and the above-described I/O cell includes first elements coupled to the first power wire and second elements coupled to the second power wire. The first element is placed on the first power wire side, and the second element is placed on the second power wire side. The first power wire and the second power wire can allow for a high current due to the interconnect layers over the I/O cells, thus having robustness against EM and ESD.
摘要翻译：提供有利于抗EM和ESD的半导体集成电路器件。多个I / O单元; 由上述I / O单元上的多个互连层形成的电力线; 焊盘，形成在所述电力线的上层并且与所述I / O单元相对应的位置; 并且提供能够将I / O单元电耦合到接合焊盘的导出区域。上述电源线包括第一电源线和第二电源线，并且上述I / O单元包括耦合到第一电力线的第一元件和耦合到第二电力线的第二元件。第一元件放置在第一电源线侧，第二元件放置在第二电源线侧。第一电源线和第二电源线可以由于I / O单元上的互连层而允许高电流，因此具有抵抗EM和ESD的鲁棒性。

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