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1. 发明授权

US08278567B2 Electronic device and method of manufacturing the same 有权
标题翻译：电子设备及其制造方法
公开(公告)号：US08278567B2
公开(公告)日：2012-10-02
申请号：US12819858
申请日：2010-06-21
申请人： Takahiko Nakamura , Keiji Sato , Hitoshi Takeuchi , Daisuke Terada , Kiyoshi Aratake , Masashi Numata
发明人： Takahiko Nakamura , Keiji Sato , Hitoshi Takeuchi , Daisuke Terada , Kiyoshi Aratake , Masashi Numata
IPC分类号： H05K7/02
CPC分类号： H03H9/1021 , Y10T29/49169
摘要： In a structure where an electronic component is mounted on a glass base material, an external electrode is provided on an opposite side to the component mounted on the base, and a through electrode and the base are welded to each other at a temperature equal to or higher than a glass softening point, electrical conduction is ensured between the electronic component and the external electrode. An electronic device includes a base, a through electrode which pass through the base and has a metal film formed on both end surfaces after an insulating material on the surface is removed by polishing, an electronic component which is provided on one surface of the through electrode through a connection portion, an external electrode which is provided on an opposite side to a side of the base on which the electronic component is provided, and a cap which protects the electronic component on the base.
摘要翻译：在将电子部件安装在玻璃基材上的结构中，外部电极设置在与安装在基座上的部件相反的一侧，并且贯通电极和基座以等于或等于或等于高于玻璃软化点，确保电子部件和外部电极之间的导电性。一种电子器件，其特征在于，在通过研磨除去表面的绝缘材料之后，通过所述基底并穿过形成在所述两端面上的金属膜的电极，形成在所述贯通电极的一个表面上的电子部件通过连接部分，设置在设置有电子部件的基部的相对侧的外部电极以及保护电子部件在基部上的盖。

2. 发明申请

US20100326721A1 ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：电子设备及其制造方法
公开(公告)号：US20100326721A1
公开(公告)日：2010-12-30
申请号：US12819858
申请日：2010-06-21
申请人： Takahiko NAKAMURA , Keiji Sato , Hitoshi Takeuchi , Daisuke Terada , Kiyoshi Aratake , Masashi Numata
发明人： Takahiko NAKAMURA , Keiji Sato , Hitoshi Takeuchi , Daisuke Terada , Kiyoshi Aratake , Masashi Numata
IPC分类号： H01L23/48 , H01L41/053 , H05K13/04
CPC分类号： H03H9/1021 , Y10T29/49169
摘要： In a structure where an electronic component is mounted on a glass base material, an external electrode is provided on an opposite side to the component mounted on the base, and a through electrode and the base are welded to each other at a temperature equal to or higher than a glass softening point, electrical conduction is ensured between the electronic component and the external electrode. An electronic device includes a base, a through electrode which pass through the base and has a metal film formed on both end surfaces after an insulating material on the surface is removed by polishing, an electronic component which is provided on one surface of the through electrode through a connection portion, an external electrode which is provided on an opposite side to a side of the base on which the electronic component is provided, and a cap which protects the electronic component on the base.
摘要翻译：在将电子部件安装在玻璃基材上的结构中，外部电极设置在与安装在基座上的部件相反的一侧，并且贯通电极和基座以等于或等于或等于高于玻璃软化点，确保电子部件和外部电极之间的导电性。一种电子器件，其特征在于，在通过研磨除去表面的绝缘材料之后，通过所述基底并穿过形成在所述两端面上的金属膜的电极，形成在所述贯通电极的一个表面上的电子部件通过连接部分，设置在设置有电子部件的基部的相对侧的外部电极以及保护电子部件在基部上的盖。

3. 发明申请

US20100290201A1 ELECTRONIC COMPONENT, MANUFACTURING METHOD FOR ELECTRONIC COMPONENT, AND ELECTRONIC DEVICE 有权
标题翻译：电子元件，电子元件的制造方法和电子器件
公开(公告)号：US20100290201A1
公开(公告)日：2010-11-18
申请号：US12759417
申请日：2010-04-13
申请人： Hitoshi Takeuchi , Keiji Sato , Kiyoshi Aratake , Masashi Numata , Takahiko Nakamura , Daisuke Terada , Takeshi Sugiyama
发明人： Hitoshi Takeuchi , Keiji Sato , Kiyoshi Aratake , Masashi Numata , Takahiko Nakamura , Daisuke Terada , Takeshi Sugiyama
IPC分类号： H05K5/00 , H01L23/48 , H05K13/00
CPC分类号： H01L23/055 , H01L2924/0002 , H01L2924/19041 , Y10T29/49002 , Y10T29/49124 , H01L2924/00
摘要： To provide an improved solderability for mounting an electronic component onto a circuit board, a package of an electronic component (1) is formed by bonding together a base (3) made of glass and a lid (2). Outer electrodes (8) and (18) are formed on a bottom surface of the base (3), and the outer electrodes (8) and (18) are respectively connected to through electrodes (7) and (17). The outer electrodes (8) and (18) each have a laminated structure of three CrAu layers, that is, from a Cr layer (first layer) to an Au layer (sixth layer). When the outer electrodes (8) and (18) are soldered onto a circuit board, the Au layers as the second, fourth, and sixth layers are dissolved into solder, whereas the Cr layers as the third and fifth layers, which hardly form an intermetallic compound with solder, are separated to remain in solder.
摘要翻译：为了提供用于将电子部件安装到电路板上的改进的可焊性，通过将由玻璃制成的基部（3）和盖（2）接合在一起而形成电子部件（1）的封装。外电极（8）和（18）形成在基座（3）的底表面上，外电极（8）和（18）分别连接到电极（7）和（17）。外部电极（8）和（18）各自具有三个CrAu层的层压结构，即从Cr层（第一层）到Au层（第六层）。当将外电极（8）和（18）焊接到电路板上时，作为第二层，第四层和第六层的Au层溶解在焊料中，而作为第三层和第五层的Cr层几乎不形成金属间化合物与焊料分离，保留在焊料中。

4. 发明授权

US08441799B2 Electronic component and electronic device 有权
标题翻译：电子元器件及电子元器件
公开(公告)号：US08441799B2
公开(公告)日：2013-05-14
申请号：US12759417
申请日：2010-04-13
申请人： Hitoshi Takeuchi , Keiji Sato , Kiyoshi Aratake , Masashi Numata , Takahiko Nakamura , Daisuke Terada , Takeshi Sugiyama
发明人： Hitoshi Takeuchi , Keiji Sato , Kiyoshi Aratake , Masashi Numata , Takahiko Nakamura , Daisuke Terada , Takeshi Sugiyama
IPC分类号： H05K1/00 , H05K1/18 , H05K7/00
CPC分类号： H01L23/055 , H01L2924/0002 , H01L2924/19041 , Y10T29/49002 , Y10T29/49124 , H01L2924/00
摘要： To provide an improved solderability for mounting an electronic component onto a circuit board, a package of an electronic component (1) is formed by bonding together a base (3) made of glass and a lid (2). Outer electrodes (8) and (18) are formed on a bottom surface of the base (3), and the outer electrodes (8) and (18) are respectively connected to through electrodes (7) and (17). The outer electrodes (8) and (18) each have a laminated structure of three CrAu layers, that is, from a Cr layer (first layer) to an Au layer (sixth layer). When the outer electrodes (8) and (18) are soldered onto a circuit board, the Au layers as the second, fourth, and sixth layers are dissolved into solder, whereas the Cr layers as the third and fifth layers, which hardly form an intermetallic compound with solder, are separated to remain in solder.
摘要翻译：为了提供用于将电子部件安装到电路板上的改进的可焊性，通过将由玻璃制成的基部（3）和盖（2）接合在一起而形成电子部件（1）的封装。外电极（8）和（18）形成在基座（3）的底表面上，外电极（8）和（18）分别连接到电极（7）和（17）。外部电极（8）和（18）各自具有三个CrAu层的层压结构，即从Cr层（第一层）到Au层（第六层）。当将外电极（8）和（18）焊接到电路板上时，作为第二层，第四层和第六层的Au层溶解在焊料中，而作为第三层和第五层的Cr层几乎不形成金属间化合物与焊料分离，保留在焊料中。

5. 发明申请

US20120153779A1 ELECTRONIC COMPONENT 审中-公开
标题翻译：电子元件
公开(公告)号：US20120153779A1
公开(公告)日：2012-06-21
申请号：US13308896
申请日：2011-12-01
申请人： Keiji Sato , Hitoshi Takeuchi , Takahiko Nakamura , Kiyoshi Aratake , Masashi Numata
发明人： Keiji Sato , Hitoshi Takeuchi , Takahiko Nakamura , Kiyoshi Aratake , Masashi Numata
IPC分类号： H01L41/053 , H05K5/06
CPC分类号： H03H9/1021 , H01L2924/0002 , H03H9/02133 , H01L2924/00
摘要： An electronic component includes a glass substrate, a lid that is bonded to the glass substrate, an internal electrode, an external electrode, and a through electrode that is disposed in a through hole passing through the glass substrate and electrically connects the internal electrode to the external electrode. A sputtered metal layer is formed on the end face of a core member of the through electrode, which is made of a metal, by sputtering.
摘要翻译：电子部件包括玻璃基板，与玻璃基板接合的盖，内部电极，外部电极和贯通电极，所述内部电极，外部电极和贯通电极配置在穿过玻璃基板的通孔中，并将内部电极电连接到外部电极。通过溅射在金属制的贯通电极芯体的端面上形成溅射金属层。

6. 发明申请

US20100053918A1 ELECTRONIC-PARTS PACKAGE AND MANUFACTURING METHOD THEREFOR 有权
标题翻译：电子部件包装及其制造方法
公开(公告)号：US20100053918A1
公开(公告)日：2010-03-04
申请号：US12547917
申请日：2009-08-26
申请人： Takahiko Nakamura , Keiji Sato , Hitoshi Takeuchi , Kiyoshi Aratake , Masashi Numata
发明人： Takahiko Nakamura , Keiji Sato , Hitoshi Takeuchi , Kiyoshi Aratake , Masashi Numata
IPC分类号： H05K7/00 , H05K3/34
CPC分类号： H03H9/1021 , Y10T29/4913 , Y10T29/49139 , Y10T29/49144 , Y10T29/49147 , Y10T29/49165
摘要： An electronic-parts package includes a base member, a conductive member extending through the base member, the conductive member having the insulating substance on the surface removed by polishing, electronic parts disposed on one surface of the conductive member through a connection portion, an exterior electrode disposed through a metal film on the opposite surface of the surface of the base member on which the electronic parts is disposed, and a cap member that protects the electronic parts on the base member.
摘要翻译：一种电子零件包装，包括：基底构件，延伸穿过基底构件的导电构件，通过抛光去除表面上的绝缘物质的导电构件;通过连接部分设置在导电构件的一个表面上的电子部件，外部通过金属膜设置的电极，所述金属膜位于其上设置有电子部件的基底构件的表面的相对表面上，以及盖构件，其保护基底构件上的电子部件。

7. 发明授权

US08256107B2 Method of manufacturing electronic-parts package 有权
标题翻译：制造电子零件包装的方法
公开(公告)号：US08256107B2
公开(公告)日：2012-09-04
申请号：US12547917
申请日：2009-08-26
申请人： Takahiko Nakamura , Keiji Sato , Hitoshi Takeuchi , Kiyoshi Aratake , Masashi Numata
发明人： Takahiko Nakamura , Keiji Sato , Hitoshi Takeuchi , Kiyoshi Aratake , Masashi Numata
IPC分类号： H05K3/30
CPC分类号： H03H9/1021 , Y10T29/4913 , Y10T29/49139 , Y10T29/49144 , Y10T29/49147 , Y10T29/49165
摘要： An electronic-parts package includes a base member, a conductive member extending through the base member, the conductive member having the insulating substance on the surface removed by polishing, electronic parts disposed on one surface of the conductive member through a connection portion, an exterior electrode disposed through a metal film on the opposite surface of the surface of the base member on which the electronic parts is disposed, and a cap member that protects the electronic parts on the base member.
摘要翻译：一种电子零件包装，包括：基底构件，延伸穿过基底构件的导电构件，通过抛光去除表面上的绝缘物质的导电构件;通过连接部分设置在导电构件的一个表面上的电子部件，外部通过金属膜设置的电极，所述金属膜位于其上设置有电子部件的基底构件的表面的相对表面上，以及帽构件，其保护基底构件上的电子部件。

8. 发明申请

US20120044025A1 ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND ELECTRONIC DEVICE MANUFACTURING METHOD 有权
标题翻译：电子设备，电子设备和电子设备制造方法
公开(公告)号：US20120044025A1
公开(公告)日：2012-02-23
申请号：US13115698
申请日：2011-05-25
申请人： Takahiko Nakamura , Keiji Sato , Hitoshi Takeuchi , Kiyoshi Aratake , Masashi Numata
发明人： Takahiko Nakamura , Keiji Sato , Hitoshi Takeuchi , Kiyoshi Aratake , Masashi Numata
IPC分类号： H03B5/30 , H05K3/00
CPC分类号： H03H9/1021 , B81B7/007 , B81B2207/096 , H01L21/486 , H01L21/50 , H01L23/10 , H01L23/49827 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L2224/13144 , H01L2224/16225 , H01L2224/16227 , H01L2224/29294 , H01L2224/29339 , H01L2224/32227 , H01L2224/81191 , H01L2224/81203 , H01L2224/81444 , H01L2224/81895 , H01L2224/832 , H01L2224/83801 , H01L2924/1461 , H01L2924/161 , H05K1/114 , H05K3/4046 , H05K2201/10075 , H05K2201/10371 , Y10T29/49124 , H01L2924/00014 , H01L2924/00
摘要： An electronic device is provided which includes a base, a through-electrode that passes through the base and from which an insulating material on an end face thereof is removed by polishing, a circuit pattern that is formed on an end face of the through-electrode, an electronic component that is disposed via an internal wiring formed on the circuit pattern, an electrode pattern that is formed on the surface of the base opposite to the surface on which the electronic component is disposed and that is connected to the other end face of the through-electrode, an external electrode that is formed on the electrode pattern, and a cap that is bonded to the base so as to protect the electronic component on the base.
摘要翻译：提供了一种电子器件，其包括基底，穿过基底的通孔，通过抛光除去其端面上的绝缘材料，形成在通孔的端面上的电路图案，电子部件，其经由形成在所述电路图案上的内部配线设置，电极图案，形成在所述基板的与所述电子部件配置的表面相反的表面上，并且连接到所述电子部件的另一端面所述贯通电极，形成在所述电极图案上的外部电极和与所述基底接合以保护所述电子部件在所述基部上的盖。

9. 发明授权

US08405463B2 Electronic device, electronic apparatus, and electronic device manufacturing method 有权
标题翻译：电子设备，电子设备和电子设备制造方法
公开(公告)号：US08405463B2
公开(公告)日：2013-03-26
申请号：US13115698
申请日：2011-05-25
申请人： Takahiko Nakamura , Keiji Sato , Hitoshi Takeuchi , Kiyoshi Aratake , Masashi Numata
发明人： Takahiko Nakamura , Keiji Sato , Hitoshi Takeuchi , Kiyoshi Aratake , Masashi Numata
IPC分类号： H05K7/02 , H03B5/32
CPC分类号： H03H9/1021 , B81B7/007 , B81B2207/096 , H01L21/486 , H01L21/50 , H01L23/10 , H01L23/49827 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L2224/13144 , H01L2224/16225 , H01L2224/16227 , H01L2224/29294 , H01L2224/29339 , H01L2224/32227 , H01L2224/81191 , H01L2224/81203 , H01L2224/81444 , H01L2224/81895 , H01L2224/832 , H01L2224/83801 , H01L2924/1461 , H01L2924/161 , H05K1/114 , H05K3/4046 , H05K2201/10075 , H05K2201/10371 , Y10T29/49124 , H01L2924/00014 , H01L2924/00
摘要： An electronic device is provided which includes a base, a through-electrode that passes through the base and from which an insulating material on an end face thereof is removed by polishing, a circuit pattern that is formed on an end face of the through-electrode, an electronic component that is disposed via an internal wiring formed on the circuit pattern, an electrode pattern that is formed on the surface of the base opposite to the surface on which the electronic component is disposed and that is connected to the other end face of the through-electrode, an external electrode that is formed on the electrode pattern, and a cap that is bonded to the base so as to protect the electronic component on the base.
摘要翻译：提供了一种电子器件，其包括基底，穿过基底的通孔，通过抛光除去其端面上的绝缘材料，形成在通孔的端面上的电路图案，电子部件，其经由形成在所述电路图案上的内部配线设置，电极图案，形成在所述基板的与所述电子部件配置的表面相反的表面上，并且连接到所述电子部件的另一端面所述贯通电极，形成在所述电极图案上的外部电极和与所述基底接合以保护所述电子部件在所述基部上的盖。

10. 发明授权

US07923904B2 Electronic package having stress buffer layer on mounting surface thereof, and method for manufacturing same 有权
标题翻译：在其安装表面上具有应力缓冲层的电子封装及其制造方法
公开(公告)号：US07923904B2
公开(公告)日：2011-04-12
申请号：US12851686
申请日：2010-08-06
申请人： Hitoshi Takeuchi , Keiji Sato , Kiyoshi Aratake , Masashi Numata
发明人： Hitoshi Takeuchi , Keiji Sato , Kiyoshi Aratake , Masashi Numata
IPC分类号： H01L41/08
CPC分类号： H03H9/1021 , H01L23/562 , H01L41/053 , H01L2924/0002 , H01L2924/09701 , H03H9/02133 , H03H9/0552 , H01L2924/00
摘要： An electronic component capable of withstanding stress from a printed circuit board or the like is provided. In an electronic component, a cavity hermetically sealed by a base and a lid is formed. In the cavity, a crystal resonator is supported by a supporting member over the top surface of the base. The base is made of glass. A stress buffer layer made of a conductive resin or the like is formed over the whole bottom surface of the base. An external electrode and an external electrode that are in continuity with the electrodes of the crystal resonator individually extend to the bottom surface of the stress buffer layer via the side surfaces of the base and stress buffer layer. The thus configured electronic component is surface-mounted by, for example, soldering the external electrode and external electrode formed on the bottom surface of the stress buffer layer to a printed circuit board.
摘要翻译：提供能够承受来自印刷电路板等的应力的电子部件。在电子部件中，形成由基座和盖子密封的空腔。在空腔中，晶体谐振器由支撑构件支撑在基座的顶表面上。基座由玻璃制成。在基底的整个底面上形成由导电性树脂等构成的应力缓冲层。与晶体谐振器的电极连续的外部电极和外部电极，经由基极和应力缓冲层的侧面分别延伸到应力缓冲层的底面。这样配置的电子部件通过例如将形成在应力缓冲层的底面上的外部电极和外部电极焊接到印刷电路板来进行表面安装。

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