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1. 发明授权

US08110325B2 Substrate treatment method 有权
标题翻译：底物处理方法
公开(公告)号：US08110325B2
公开(公告)日：2012-02-07
申请号：US13022811
申请日：2011-02-08
申请人： Takafumi Niwa , Hiroshi Nakamura , Hideharu Kyouda
发明人： Takafumi Niwa , Hiroshi Nakamura , Hideharu Kyouda
IPC分类号： G03F9/00 , G03C5/00
CPC分类号： H01L21/0273 , G03F7/0035 , H01L21/67178 , H01L22/12 , H01L22/20 , H01L2924/0002 , H01L2924/00
摘要： A substrate treatment method including a first treatment process (S13 to S16) for exposing, heating, and developing a substrate on which a first resist is formed, thereby forming a first resist pattern, and a second treatment process (S17 to S20) for forming a second resist film on the substrate on which the first resist pattern is formed, exposing, heating, and developing the substrate on which the second resist film is formed, thereby forming a second resist pattern. Also, the substrate treatment method compensates a first treatment condition in a first treatment process (S22 to S25) based on a measured value of a line width of the second resist pattern and a second treatment condition in a second treatment process (S26 to S29) based on a measured value of a line width of the first resist pattern.
摘要翻译：一种基板处理方法，包括：第一处理工艺（S13至S16），用于对形成第一抗蚀剂的基板进行曝光，加热和显影，从而形成第一抗蚀剂图案;以及第二处理工艺（S17至S20），用于形成在其上形成第一抗蚀剂图案的基板上的第二抗蚀剂膜，暴露，加热和显影其上形成有第二抗蚀剂膜的基板，从而形成第二抗蚀剂图案。此外，基板处理方法在第二处理工序中基于第二抗蚀剂图案的线宽度的测量值和第二处理条件在第一处理工艺（S22至S25）中补偿第一处理条件（S26至S29）基于第一抗蚀剂图案的线宽的测量值。

2. 发明授权

US08367308B2 Substrate processing method 有权
标题翻译：基板加工方法
公开(公告)号：US08367308B2
公开(公告)日：2013-02-05
申请号：US13023670
申请日：2011-02-09
申请人： Hiroshi Nakamura , Takafumi Niwa , Yuhei Kuwahara , Tadatoshi Tomita
发明人： Hiroshi Nakamura , Takafumi Niwa , Yuhei Kuwahara , Tadatoshi Tomita
IPC分类号： G03F7/26
CPC分类号： G03F7/0035 , G03F7/2041 , G03F7/40 , H01L21/0206 , H01L21/0273 , H01L21/6715
摘要： A substrate processing method includes a first process (step S12 to step S16) of forming a first resist pattern by exposing a substrate having thereon a first resist film to lights, developing the exposed substrate and cleaning the developed substrate; and a second process (step S17 to step S20) of forming a second resist pattern by forming a second resist film on the substrate having thereon the first resist pattern, exposing the substrate having thereon the second resist film to lights, and developing the exposed substrate. A first processing condition is determined based on first data showing a relationship between a first processing condition under which a cleaning process is performed on the substrate in the first process (step S16) and a line width of the second resist pattern, and the first process (step S16) is performed on the substrate under the determined first processing condition.
摘要翻译：基板处理方法包括通过使其上具有第一抗蚀剂膜的基板曝光来形成第一抗蚀剂图案的第一处理（步骤S12至步骤S16），使曝光的基板显影并清洁显影的基板; 以及通过在其上具有第一抗蚀剂图案的基板上形成第二抗蚀剂膜而形成第二抗蚀剂图案的第二工艺（步骤S17至步骤S20），将其上具有第二抗蚀剂膜的基板曝光，并使曝光的基板。第一处理条件基于表示在第一处理（步骤S16）中对基板进行清洗处理的第一处理条件与第二抗蚀剂图案的线宽之间的关系的第一数据和第一处理（步骤S16）在确定的第一处理条件下在基板上进行。

3. 发明申请

US20110200949A1 SUBSTRATE PROCESSING METHOD 有权
标题翻译：基板处理方法
公开(公告)号：US20110200949A1
公开(公告)日：2011-08-18
申请号：US13023670
申请日：2011-02-09
申请人： Hiroshi Nakamura , Takafumi Niwa , Yuhei Kuwahara , Tadatoshi Tomita
发明人： Hiroshi Nakamura , Takafumi Niwa , Yuhei Kuwahara , Tadatoshi Tomita
IPC分类号： G03F7/20
CPC分类号： G03F7/0035 , G03F7/2041 , G03F7/40 , H01L21/0206 , H01L21/0273 , H01L21/6715
摘要： A substrate processing method includes a first process (step S12 to step S16) of forming a first resist pattern by exposing a substrate having thereon a first resist film to lights, developing the exposed substrate and cleaning the developed substrate; and a second process (step S17 to step S20) of forming a second resist pattern by forming a second resist film on the substrate having thereon the first resist pattern, exposing the substrate having thereon the second resist film to lights, and developing the exposed substrate. A first processing condition is determined based on first data showing a relationship between a first processing condition under which a cleaning process is performed on the substrate in the first process (step S16) and a line width of the second resist pattern, and the first process (step S16) is performed on the substrate under the determined first processing condition.
摘要翻译：基板处理方法包括通过使其上具有第一抗蚀剂膜的基板曝光来形成第一抗蚀剂图案的第一处理（步骤S12至步骤S16），使曝光的基板显影并清洁显影的基板; 以及通过在其上具有第一抗蚀剂图案的基板上形成第二抗蚀剂膜而形成第二抗蚀剂图案的第二工艺（步骤S17至步骤S20），将其上具有第二抗蚀剂膜的基板曝光，并使曝光的基板。第一处理条件基于表示在第一处理（步骤S16）中对基板进行清洗处理的第一处理条件与第二抗蚀剂图案的线宽之间的关系的第一数据和第一处理（步骤S16）在确定的第一处理条件下在基板上进行。

4. 发明授权

US09168865B2 Organic electro-luminescence lighting device for vehicle 有权
标题翻译：车用有机电致发光照明装置
公开(公告)号：US09168865B2
公开(公告)日：2015-10-27
申请号：US13561405
申请日：2012-07-30
申请人： Hiroshi Nakamura
发明人： Hiroshi Nakamura
IPC分类号： B60Q1/14 , B60Q3/02
CPC分类号： B60Q3/82 , B60Q3/745 , B60Q3/80
摘要： An organic EL lighting device for a vehicle is provided, which includes an organic EL lighting portion provided in a matrix form on a ceiling of the vehicle, an organic EL touch portion provided on the organic EL lighting portion, an organic EL detection portion for detecting a position in which the organic EL touch portion is touched, an organic EL determination portion for determining a lighting area of the organic EL lighting portion based on the position detected by the organic EL detection portion, and an organic EL driving portion for lighting the lighting area of the organic EL lighting portion determined by the organic EL determination portion.
摘要翻译：本发明提供一种车辆用有机EL照明装置，其特征在于，包括在车辆的天花板上以矩阵状设置的有机EL照明部，设置在有机EL照明部上的有机EL接触部，有机EL触摸部分被触摸的位置，用于基于由有机EL检测部分检测到的位置来确定有机EL照明部分的照明区域的有机EL确定部分和用于点亮照明的有机EL驱动部分由有机EL确定部分确定的有机EL照明部分的面积。

5. 发明授权

US09136823B2 Duplexer 有权
标题翻译：双工器
公开(公告)号：US09136823B2
公开(公告)日：2015-09-15
申请号：US13344265
申请日：2012-01-05
申请人： Shogo Inoue , Hiroshi Nakamura
发明人： Shogo Inoue , Hiroshi Nakamura
IPC分类号： H03H9/72 , H03H9/70 , H03H9/00 , H03H9/02 , H03H9/54 , H03H9/58 , H03H9/64
CPC分类号： H03H9/725 , H03H9/0023 , H03H9/0071 , H03H9/0085 , H03H9/02669 , H03H9/542 , H03H9/585 , H03H9/6436 , H03H9/644 , H03H9/6483 , H03H9/6489 , H03H9/706
摘要： A duplexer includes a reception filter that is connected between a reception terminal and an antenna terminal and includes one or a plurality of series resonators that are acoustic wave resonators, and a transmission filter that is connected between a transmission terminal and the antenna terminal and includes one or a plurality of acoustic wave resonators, a resonance frequency of a first series resonator that is one of the one or the plurality of series resonators and is closest to the antenna terminal in the reception filter being higher than an upper limit frequency of a reception band of the reception filter.
摘要翻译：双工器包括连接在接收端子和天线端子之间的接收滤波器，并且包括作为声波谐振器的一个或多个串联谐振器，以及连接在发送端子和天线端子之间的发送滤波器，并且包括一个或多个声波谐振器，作为一个或多个串联谐振器之一并且最接近接收滤波器中的天线端子的第一串联谐振器的谐振频率高于接收频带的上限频率的接收过滤器。

6. 发明授权

US08907740B2 Duplexer 有权
标题翻译：双工器
公开(公告)号：US08907740B2
公开(公告)日：2014-12-09
申请号：US13291269
申请日：2011-11-08
申请人： Jun Tsutsumi , Masafumi Iwaki , Hiroshi Nakamura
发明人： Jun Tsutsumi , Masafumi Iwaki , Hiroshi Nakamura
IPC分类号： H03H9/00 , H03H9/05 , H03H9/70 , H03H9/72 , H03H9/10
CPC分类号： H03H9/0566 , H01L2224/16225 , H01L2924/16195 , H03H9/0523 , H03H9/0557 , H03H9/059 , H03H9/1014 , H03H9/1071 , H03H9/706 , H03H9/725
摘要： A duplexer includes: an insulation substrate having an upper surface on which a transmission filter and a reception filter are mounted, and a lower surface on which a foot pad layer electrically connected to the transmission filter and the reception filter is formed; a transmission pad provided on the upper surface and electrically connected to the transmission filter; a reception pad provided on the upper surface and electrically connected to the reception filter, a ring-shaped electrode provided on the upper surface and configured to surround the transmission pad and the reception pad; a ground foot pad included in the foot pad layer, and a via interconnection configured to electrically interconnect the ring-shaped electrode and the ground foot pad and to be provided in the ring-shaped electrode in a section along a shorter one of routes that connect the transmission pad and the reception pad to each other along the ring-shaped electrode.
摘要翻译：双工器包括：具有安装有透射滤光器和接收滤光器的上表面的绝缘基板和形成有与传输滤波器和接收滤波器电连接的脚垫层的下表面; 传输焊盘，其设置在所述上表面上并电连接到所述传输滤波器; 设置在所述上表面上并与所述接收滤波器电连接的接收焊盘，设置在所述上表面上并被配置为围绕所述传输焊盘和所述接收焊盘的环形电极; 包括在所述脚垫层中的接地脚垫以及通孔互连，所述通孔互连配置成电连接所述环形电极和所述接地脚垫，并且沿着连接的所述短路径的部分中设置在所述环形电极中传输垫和接收垫彼此沿着环形电极。

7. 发明授权

US08859046B2 Substrate processing apparatus, control method adopted in substrate processing apparatus and program 有权
标题翻译：基板处理装置，基板处理装置和程序中采用的控制方法
公开(公告)号：US08859046B2
公开(公告)日：2014-10-14
申请号：US13271050
申请日：2011-10-11
申请人： Hiroshi Nakamura , Toshiyuki Kobayashi , Shinichiro Hayasaka , Seiichi Kaise
发明人： Hiroshi Nakamura , Toshiyuki Kobayashi , Shinichiro Hayasaka , Seiichi Kaise
IPC分类号： G06F19/00 , G05D7/06 , H01L21/67
CPC分类号： H01L21/6719 , H01L21/67017
摘要： A substrate processing apparatus according to the present invention comprises a plurality of processing chambers, discharge systems each provided in conjunction with one of the processing chambers and a common discharge system connected with the discharge systems of at least two processing chambers among the discharge systems provided in conjunction with the individual processing chambers. The common discharge allows a switch-over between a scrubbing common discharge system that discharges discharge gas from each processing chamber after scrubbing the discharge gas at a scrubbing means and a non-scrubbing common discharge system that directly discharges the discharge gas from the discharge system of the processing chamber without scrubbing at the scrubbing means. In this substrate processing apparatus, switch-over control is executed to select either the scrubbing common discharge system of the non-scrubbing common discharge system in correspondence to the type of processing executed in the processing chamber.
摘要翻译：根据本发明的基板处理装置包括多个处理室，每个排放系统分别与处理室中的一个相连接，以及与排放系统中的至少两个处理室的排放系统连接的公共排放系统与各个处理室结合。公共放电允许在洗涤在洗涤装置处的排出气体之后排出来自每个处理室的排出气体的洗涤普通排放系统和从排放系统直接排出排放气体的非洗涤公共排放系统之间的切换该处理室不在洗涤装置处洗涤。在该基板处理装置中，执行切换控制，以对应于在处理室中执行的处理的类型来选择非擦洗普通放电系统的擦洗普通放电系统。

8. 发明授权

US08678446B2 Tubular-member mounting device 有权
标题翻译：管件安装装置
公开(公告)号：US08678446B2
公开(公告)日：2014-03-25
申请号：US13368554
申请日：2012-02-08
申请人： Hiroshi Nakamura
发明人： Hiroshi Nakamura
IPC分类号： F16L37/00
CPC分类号： F16L37/008 , F02D19/084 , F02D19/087 , F02D2200/0611 , F16L41/008 , Y02T10/36
摘要： A tubular member has one end inserted in a fluid passage of a passage member through an insertion hole. The tubular member includes a large diameter portion and a small diameter portion therebetween having a step defining an inclined portion. The inclined portion is inclined from the radially outside toward the radially inside. A lock member is held by a holding portion located outside the insertion hole relative to the radial direction of the insertion hole. The lock member urges the inclined portion radially inward and applies force to the inclined portion in the axial direction to cause the outer surface of the tubular member to urge a regulating portion to cause the regulating portion to restrict movement of the tubular member in the axial direction.
摘要翻译：管状构件的一端通过插入孔插入通道构件的流体通道中。管状构件包括大直径部分和其间具有限定倾斜部分的台阶的小直径部分。倾斜部从径向外侧向径向内侧倾斜。锁定构件由相对于插入孔的径向位于插入孔外侧的保持部保持。锁定部件径向向内推动倾斜部分，并且在轴向方向上对倾斜部分施加力，以使管状部件的外表面促使限制部分使限制部分限制管状部件在轴向上的运动。

9. 发明申请

US20140049928A1 SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT 审中-公开
标题翻译：带有内置电子元件的基板
公开(公告)号：US20140049928A1
公开(公告)日：2014-02-20
申请号：US13593131
申请日：2012-08-23
申请人： Tatsuro Sawatari , Eiji Mugiya , Hiroshi Nakamura
发明人： Tatsuro Sawatari , Eiji Mugiya , Hiroshi Nakamura
IPC分类号： H05K1/18
CPC分类号： H05K1/185 , H01L24/19 , H01L2224/04105 , H01L2924/12042 , H05K3/4679 , H01L2924/00
摘要： Provided is a substrate with a built-in electronic component that can avoid as much as possible the occurrence of malfunctions in the electronic component due to moisture entering, even when an electronic component, provided with a structure in which a terminal pad is present where a hole in the sealing part provided on the main body of a component is located, is built into the substrate. A SAW filter 12 built into a substrate 11 is provided with a structure that has terminal pads 12c to 12e on the bottom of respective holes 12f1 in a sealing part 12f. The lower surfaces of respective conductive vias 11d2 are connected to the upper surfaces of the terminal pads 12c to 12e through the respective holes 12f1 such that a ring-shaped gap CC is formed between outer surfaces of the conductive vias 11d2 and inner surfaces of the holes 12f1. Each ring-shaped gap CC is filled with a part that is integral with a first insulating layer 11c.
摘要翻译：提供一种具有内置电子部件的基板，即使当设置有存在终端焊盘的结构的电子部件时，尽可能避免由于水分进入而导致的电子部件故障的发生，其中，位于组件主体上的密封部分的孔位于衬底内。内置于基板11中的SAW滤波器12具有在密封部12f中的各个孔12f1的底部具有端子焊盘12c〜12e的结构。各个导电通路11d2的下表面通过相应的孔12f1连接到端子焊盘12c至12e的上表面，使得在导电通孔11d2的外表面和孔的内表面之间形成环形间隙CC 12f1。每个环形间隙CC都填充有与第一绝缘层11c成一体的部分。

10. 外观设计

USD694602S1 Optical fiber cutter 有权
标题翻译：光纤切割机
公开(公告)号：USD694602S1
公开(公告)日：2013-12-03
申请号：US29402294
申请日：2011-09-22
申请人： Masahiro Hasegawa , Hiroyasu Toyooka , Hiroshi Nakamura
设计人： Masahiro Hasegawa , Hiroyasu Toyooka , Hiroshi Nakamura

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