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    • 1. 发明申请
    • Adhesive Composition for Sealing Electronic Component, and Process for Manufacturing Organic Electroluminescent Apparatus with Use Thereof
    • 用于密封电子部件的粘合剂组合物,以及用于制造其使用的有机电致发光器件的方法
    • US20070298672A1
    • 2007-12-27
    • US11587729
    • 2005-05-06
    • Takafumi Iida
    • Takafumi Iida
    • C09J201/00C09J11/04H01J9/00C09J11/08
    • C09J163/00C09J11/08
    • An adhesive composition for sealing containing spacer particles of diameter as large as 110 to 400 μm, which adhesive composition realizes manufacturing of an organic EL apparatus having a desiccant sheet disposed thereinside through a simple process with the use of a tabular sealing material; and a process for manufacturing an organic EL apparatus with the use of the adhesive composition. There is provided an adhesive composition for electronic component sealing comprising a resin of 1.1 to 1.3 specific gravity and, incorporated therein, spherical plastic spacers of 0.9 to 1.4 specific gravity and 110 to 400 μm particle diameter and having a viscosity of 200 to 1000 Pa s at 25° C. Further, there is provided a process for manufacturing an organic EL apparatus, comprising adhering a substrate with a tabular sealing material while ensuring a clearance of 110 to 400 μm therebetween with the use of the above adhesive composition.
    • 一种用于密封的粘合剂组合物,其包含直径大至110至400μm的间隔物颗粒,该粘合剂组合物通过使用片状密封材料的简单方法实现了具有设置在其中的干燥剂片材的有机EL装置的制造; 以及使用粘合剂组合物制造有机EL装置的方法。 提供了一种用于电子部件密封的粘合剂组合物,其包含比重为1.1至1.3的树脂,并且其中包含0.9至1.4比重和110至400μm的粒径的球形塑料垫片,其粘度为200至1000Pa s 此外,提供了一种制造有机EL器件的方法,其包括使用上述粘合剂组合物,同时确保其间具有110至400μm的间隙,使基板与片状密封材料粘合。
    • 2. 发明授权
    • Sealing composition and production method of optical fiber having air holes in the inside using the composition
    • 密封组合物和使用该组合物在内部具有气孔的光纤的制造方法
    • US07477821B2
    • 2009-01-13
    • US11666070
    • 2005-10-06
    • Takafumi IidaMasayoshi Hachiwaka
    • Takafumi IidaMasayoshi Hachiwaka
    • G02B6/02
    • G02B6/02342C08F299/026C09J163/00C09J163/10G02B6/02376
    • A sealing composition for a photonic crystal fiber which comprises a compound represented by the following general formula (I), a compound represented by the following general formula (II) and a photo-polymerization initiator: Tf1-(O)a—(CH2)b—(CF2)m—(CH2)b—(O)a-Tf1 (I) Tf2-(O)a—(CH2)b—(CF2)m—(CH2)b—(O)a-Tf2 (II) wherein a represents 0 or 1, b represents 0 or 1, m represents an integer of 4 to 12, Tf1 represents a glycidyl group, and Tf2 represents CH2═CH—C(O)—; and a method for producing an optical fiber comprising filling air holes with above sealing composition and polishing and end surface; and an optical fiber having air holes in the inside which is produced by the method. The above sealing composition can achieve a low refractive index, and also is excellent in the low viscosity and heat resistance, and exhibits good filling characteristics and good polishing processability.
    • 一种光子晶体纤维用密封组合物,其包含下述通式(I)表示的化合物,下述通式(II)表示的化合物和光聚合引发剂Tf1-(O)a-(CH2) b-(CF 2)m - (CH 2)b - (O)a -Tf1(I)Tf2-(O)a-(CH 2)b - (CF 2)m - (CH 2)b - (O)a-Tf2 II)其中a表示0或1,b表示0或1,m表示4至12的整数,Tf1表示缩水甘油基,Tf2表示CH2-CH-C(O) - ; 以及一种用于制造光纤的方法,包括用上述密封组合物和抛光和端面填充空气孔; 以及通过该方法制造的在内部具有气孔的光纤。 上述密封组合物可以实现低折射率,并且还具有优异的低粘度和耐热性,并且表现出良好的填充特性和良好的抛光加工性能。
    • 6. 发明申请
    • Sealing Composition and Production Method of Optical Fiber Having Air Holes in the Inside Using the Composition
    • 密封组合物和使用组合物在内部具有气孔的光纤的生产方法
    • US20080056655A1
    • 2008-03-06
    • US11666070
    • 2005-10-06
    • Takafumi IidaMasayoshi Hachiwaka
    • Takafumi IidaMasayoshi Hachiwaka
    • G02B6/032B05D3/06C08F2/46
    • G02B6/02342C08F299/026C09J163/00C09J163/10G02B6/02376
    • A sealing composition for a photonic crystal fiber which comprises a compound represented by the following general formula (I), a compound represented by the following general formula (II) and a photo-polymerization initiator: Tf1-(O)a—(CH2)b—(CF2)m—(CH2)b—(O)a-Tf1 (I) Tf2-(O)a—(CH2)b—(CF2)m—(CH2)b—(O)a-Tf2 (II) wherein a represents 0 or 1, b represents 0 or 1, m represents an integer of 4 to 12, Tf1 represents a glycidyl group, and Tf2 represents CH2═CH—C(O)—; and a method for producing an optical fiber comprising filling air holes with above sealing composition and polishing and end surface; and an optical fiber having air holes in the inside which is produced by the method. The above sealing composition can achieve a low refractive index, and also is excellent in the low viscosity and heat resistance, and exhibits good filling characteristics and good polishing processability.
    • 一种光子晶体光纤密封组合物,其包含由以下通式(I)表示的化合物,由以下通式(II)表示的化合物和光聚合引发剂:Tf1-(O) - (CH 2) - (CH 2) - (CH 2) - (CH 2) - (CH 2) - (O)a - (O)a-1(I)Tf2-(O)a - (CH 2) (CF 2)2 - (CH 2)2 - (CH 2)2 - (CH 2) 其中a表示0或1,b表示0或1,m表示4至12的整数,Tf1表示缩水甘油基,Tf2(II)表示缩水甘油基, 表示CH 2 -CH-C(O) - ; 以及一种用于制造光纤的方法,包括用上述密封组合物和抛光和端面填充空气孔; 以及通过该方法制造的在内部具有气孔的光纤。 上述密封组合物可以实现低折射率,并且还具有优异的低粘度和耐热性,并且表现出良好的填充特性和良好的抛光加工性能。
    • 8. 发明授权
    • Ultraviolet-curable adhesive for bonding optical disks
    • 用于粘合光盘的紫外光固化粘合剂
    • US06335382B1
    • 2002-01-01
    • US09462276
    • 2000-01-06
    • Takafumi Iida
    • Takafumi Iida
    • C08F250
    • C09J175/16C08F290/14C09J4/00C09J4/06C08F226/10
    • An ultraviolet-curable adhesive having an excellent moisture resistance and suitable for bonding optical disks having an information recording layer (vapor deposition layer), particularly optical disks having a thick vapor deposition layer, which contains, as essential components, (A) N-vinylpyrrolidone, (B) a urethane (meth)acrylate oligomer derived from a caprolactone-based polyol, an alicyclic diisocyanate and (meth)acrylic acid, and (C) a photopolymerization initiator containing (C-1) a photopolymerization initiator composed of only a carbon atom, a hydrogen atom and an oxygen atom without containing a nitrogen atom, a sulfur atom and a phosphorus atom and (C-2) a photopolymerization initiator containing a nitrogen atom and/or a sulfur atom in a (C-1)/(C-2) ratio of 70/30 to 100/0 by weight.
    • 具有优异的耐湿性并且适于粘合具有信息记录层(蒸镀层)的光盘的紫外线固化型粘合剂,特别是具有厚气相沉积层的光盘,其含有(A)N-乙烯基吡咯烷酮 ,(B)由己内酯系多元醇衍生的氨基甲酸酯(甲基)丙烯酸酯低聚物,脂环族二异氰酸酯和(甲基)丙烯酸),(C)含有(C-1)仅由碳组成的光聚合引发剂的光聚合引发剂 原子,氢原子和不含氮原子,硫原子和磷原子的氧原子,(C-1)/(C-1)/(C-2)含有氮原子和/或硫原子的光聚合引发剂 C-2)比例为70/30至100/0。