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1. 发明授权

US6133594A Compound semiconductor device 有权
标题翻译：复合半导体器件
公开(公告)号：US6133594A
公开(公告)日：2000-10-17
申请号：US128532
申请日：1998-08-04
申请人： Taisuke Iwai , Shuichi Tanaka
发明人： Taisuke Iwai , Shuichi Tanaka
IPC分类号： H01L29/73 , H01L21/331 , H01L29/08 , H01L29/205 , H01L29/737
CPC分类号： H01L29/7371 , H01L29/0821
摘要： A compound semiconductor device having a mesa type heterojunction bipolar transistor comprises a collector layer of first conductivity type having a collector breakdown voltage of a predetermined magnitude, a base layer of second conductivity type formed on the collector layer, an emitter layer of first conductivity type formed on the base layer, and a subcollector layer of first conductivity formed in a region remote laterally from an edge of the base layer to be connected to the collector layer.
摘要翻译：具有台面型异质结双极晶体管的化合物半导体器件包括具有预定大小的集电极击穿电压的第一导电类型的集电极层，形成在集电极层上的第二导电类型的基极层，形成第一导电类型的发射极层在基底层上形成第一导电体的子集电极层，其形成在与基底层的边缘相邻的区域中，以连接到集电体层。

2. 发明授权

US08508042B2 Electronic device and electronic apparatus 有权
公开(公告)号：US08508042B2
公开(公告)日：2013-08-13
申请号：US13015011
申请日：2011-01-27
申请人： Shuichi Tanaka
发明人： Shuichi Tanaka
IPC分类号： H01L23/485
CPC分类号： H01L24/13 , G02F1/1345 , H01L24/11 , H01L24/14 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/05001 , H01L2224/05024 , H01L2224/05026 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05548 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05655 , H01L2224/05664 , H01L2224/05671 , H01L2224/05684 , H01L2224/114 , H01L2224/116 , H01L2224/13008 , H01L2224/13099 , H01L2224/1319 , H01L2224/136 , H01L2224/16225 , H01L2224/16227 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29298 , H01L2224/73204 , H01L2224/75252 , H01L2224/812 , H01L2224/81801 , H01L2224/83192 , H01L2224/838 , H01L2224/83851 , H01L2924/0001 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15787 , H01L2924/15788 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/00 , H01L2924/01023 , H01L2924/01028 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： An electronic device includes a semiconductor device and a wiring substrate having a wiring pattern. The semiconductor device includes: a semiconductor chip having an electrode; a convex-shaped resin protrusion provided on a surface of the semiconductor chip, the surface having the electrode; and wiring having a plurality of electrical coupling sections which are aligned on the resin protrusion and electrically coupled to the electrode. The semiconductor device is mounted to the wiring substrate so that the electrical coupling sections and the wiring pattern are brought into contact and electrically coupled with each other. The plurality of electrical coupling sections brought into contact with the wiring pattern include curved or bent shapes projecting in a longitudinal direction of the resin protrusion.

3. 发明授权

US08183693B2 Electronic device, method of producing the same, and semiconductor device 有权
标题翻译：电子装置及其制造方法以及半导体装置
公开(公告)号：US08183693B2
公开(公告)日：2012-05-22
申请号：US12897173
申请日：2010-10-04
申请人： Shuichi Tanaka , Haruki Ito
发明人： Shuichi Tanaka , Haruki Ito
IPC分类号： H01L23/52 , H01L23/48 , H01L29/40
CPC分类号： H01L24/10 , H01L24/13 , H01L24/29 , H01L24/83 , H01L24/90 , H01L2224/05001 , H01L2224/05022 , H01L2224/05548 , H01L2224/13 , H01L2224/13008 , H01L2224/13099 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/838 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01051 , H01L2924/01074 , H01L2924/01082 , H01L2924/0665 , H01L2924/0781 , H01L2924/14 , H01L2924/19043 , H01L2924/00 , H01L2224/29099 , H01L2224/29199 , H01L2224/05599 , H01L2224/05099
摘要： A semiconductor device includes n1 first interconnects (n is an integer larger than one) respectively formed on first electrodes and extending over a first resin protrusion, and n2 second interconnects (n2
摘要翻译：半导体器件包括分别形成在第一电极上并在第一树脂突起上延伸的n1个第一互连（n是大于一的整数），以及分别形成在第二电极上并在第二树脂突起上延伸的n2个第二互连（n2 < 。第一和第二树脂突起由相同的材料形成，具有相同的宽度并且纵向延伸。第一互连延伸以与第一树脂突起的纵向轴线相交，并且每个第一互连件在第一树脂突起上具有第一宽度W1。第二互连延伸以与第二树脂突起的纵向轴线相交，并且每个第二互连件在第二树脂突起上具有第二宽度W2（W1

4. 发明授权

US07341335B2 Liquid ejection apparatus 有权
标题翻译：液体喷射装置
公开(公告)号：US07341335B2
公开(公告)日：2008-03-11
申请号：US11233117
申请日：2005-09-23
申请人： Fujio Akahane , Hisashi Miyazawa , Shuichi Tanaka
发明人： Fujio Akahane , Hisashi Miyazawa , Shuichi Tanaka
IPC分类号： B41J2/175
CPC分类号： B41J2/17509 , B41J2/17523 , B41J2/17596
摘要： A liquid ejection apparatus ejects liquid retained in a liquid container from a liquid ejection head. The apparatus includes a liquid supply needle having an outlet line that can be connected to the interior of the liquid container, a liquid supply line connecting the outlet line of the liquid supply needle to the recording head, and a control valve provided in the liquid supply line. The control valve closes the liquid supply line when negative pressure is applied to the liquid ejection head. A seal valve is arranged between the control valve and the liquid supply needle in the liquid supply line. The seal valve seals the liquid supply line using liquid pressure applied from the control valve to the outlet line. Accordingly, the liquid is prevented from leaking from the liquid supply needle when the liquid container is separated from the liquid supply needle.
摘要翻译：液体喷射装置从液体喷射头喷射保留在液体容器中的液体。该装置包括：液体供给针，具有能够连接到液体容器的内部的出口管，将液体供给针的出口管连接到记录头的液体供给管;以及设置在液体供给部中的控制阀线。当向液体喷射头施加负压时，控制阀关闭液体供应管线。密封阀配置在液体供给管路中的控制阀与液体供给针之间。密封阀使用从控制阀施加到出口管线的液体压力来密封液体供应管线。因此，当液体容器与液体供给针分离时，防止液体从液体供给针泄漏。

5. 发明申请

US20070029672A1 Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US20070029672A1
公开(公告)日：2007-02-08
申请号：US11497578
申请日：2006-08-02
申请人： Shuichi Tanaka
发明人： Shuichi Tanaka
IPC分类号： H01L23/48
CPC分类号： H01L24/10 , H01L24/13 , H01L2224/05001 , H01L2224/05022 , H01L2224/05124 , H01L2224/05147 , H01L2224/05166 , H01L2224/05184 , H01L2224/05548 , H01L2224/05644 , H01L2224/13 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/01074 , H01L2924/01079 , H01L2924/07802 , H01L2924/09701 , H01L2924/14 , H01L2924/15787 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H01L2924/00 , H01L2924/00014
摘要： A semiconductor device including: a semiconductor substrate on which a plurality of electrodes are formed; a plurality of resin protrusions formed on the semiconductor substrate, arranged along a straight line, and extending in a direction which intersects the straight line; and a plurality of electrical connection sections formed on the resin protrusions and electrically connected to the electrodes.
摘要翻译：一种半导体器件，包括：形成有多个电极的半导体衬底; 形成在所述半导体基板上的多个树脂突起，沿着直线配置并沿与所述直线相交的方向延伸; 以及形成在所述树脂突起上并电连接到所述电极的多个电连接部。

6. 发明申请

US20070007671A1 Semiconductor device and method of manufacturing the same 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US20070007671A1
公开(公告)日：2007-01-11
申请号：US11481332
申请日：2006-07-05
申请人： Shuichi Tanaka
发明人： Shuichi Tanaka
IPC分类号： H01L23/28
CPC分类号： H01L23/49816 , H01L21/4853 , H01L2224/05001 , H01L2224/05022 , H01L2224/05124 , H01L2224/05147 , H01L2224/05644 , H01L2224/16 , H01L2224/32225 , H01L2224/73204 , H01L2924/00014
摘要： A semiconductor device including a semiconductor substrate having a plurality of electrodes, a resin protrusion formed on the semiconductor substrate, and an interconnect electrically connected to the electrodes and formed to extend over the resin protrusion. A depression is formed in a top surface of the resin protrusion. The interconnect has a cut portion disposed over at least part of the depression.
摘要翻译：一种半导体器件，包括具有多个电极的半导体衬底，形成在所述半导体衬底上的树脂突起，以及与所述电极电连接并形成为在所述树脂突起上延伸的互连。在树脂突起的上表面形成有凹陷部。互连具有设置在凹部的至少一部分上的切割部分。

7. 发明授权

US06779624B2 Control unit for power steering apparatus and steering-wheel-angle correcting system 有权
公开(公告)号：US06779624B2
公开(公告)日：2004-08-24
申请号：US10434638
申请日：2003-05-12
申请人： Atsutoshi Goto , Hiroshi Sakamoto , Yasuhiro Yuasa , Shuichi Tanaka , Shigeru Muraoka , Masakuni Tanaka
发明人： Atsutoshi Goto , Hiroshi Sakamoto , Yasuhiro Yuasa , Shuichi Tanaka , Shigeru Muraoka , Masakuni Tanaka
IPC分类号： B62D506
CPC分类号： B62D5/09
摘要： In a control unit for use with a power steering apparatus, there are provided and integrated into a single body, a main operating fluid feed device for supplying the hydraulic cylinder with an amount of oil corresponding to the amount of rotation of the steering wheel H, an auxiliary operating fluid feed device for supplying a correcting oil for adjusting drive of said hydraulic cylinder according to control signal, and a steering wheel angle sensor disposed around the rotating shaft of the steering wheel connected to said main operating fluid feed device, to detect steering wheel angle corresponding to the rotating position of said steering wheel.

8. 发明授权

US5903205A Induction-type rotational position detecting device 失效
标题翻译：感应式旋转位置检测装置
公开(公告)号：US5903205A
公开(公告)日：1999-05-11
申请号：US693405
申请日：1996-08-07
申请人： Atsutoshi Goto , Yasuhiro Yuasa , Shuichi Tanaka , Nobuyuki Akatsu , Kazuya Sakamoto , Hiroshi Sakamoto
发明人： Atsutoshi Goto , Yasuhiro Yuasa , Shuichi Tanaka , Nobuyuki Akatsu , Kazuya Sakamoto , Hiroshi Sakamoto
IPC分类号： G01B7/00 , G01B7/30 , G01D5/20 , G01D5/245 , H01F21/06
CPC分类号： G01D5/204
摘要： A group of secondary windings are distributively provided on a stator over a predetermined range, and the respective inductance of the secondary windings in the group is set in such a manner to present predetermined inductance distribution. A rotor has an eccentric shape so as to cause variations in magnetic coupling at individual poles of the stator in response to its current rotational position. By combined use of the magnetic coupling variations between primary and secondary windings on the stator and the predetermined inductance distribution of the secondary windings, high-accuracy detection of a rotational position is achieved with a simple structure. A plurality of primary windings may be set so as to present predetermined inductance distribution.
摘要翻译：一组次级绕组在预定范围内分布地设置在定子上，并且组中的次级绕组的相应电感被设定为呈现预定的电感分布。转子具有偏心的形状，以便响应于其当前的旋转位置而引起定子各个极的磁耦合的变化。通过组合使用定子上的初级和次级绕组之间的磁耦合变化和次级绕组的预定电感分布，以简单的结构实现旋转位置的高精度检测。可以设置多个初级绕组以便呈现预定的电感分布。

9. 发明授权

US08207056B2 Method for manufacturing semiconductor device, and method and structure for implementing semiconductor device 有权
标题翻译：制造半导体器件的方法，以及用于实现半导体器件的方法和结构
公开(公告)号：US08207056B2
公开(公告)日：2012-06-26
申请号：US12552728
申请日：2009-09-02
申请人： Shuichi Tanaka
发明人： Shuichi Tanaka
IPC分类号： H01L21/44 , H01L21/00
CPC分类号： H01L24/11 , H01L2224/05001 , H01L2224/05023 , H01L2224/05124 , H01L2224/05548 , H01L2224/05568 , H01L2224/05644 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/3025 , H01L2924/00014
摘要： A method for manufacturing a semiconductor device includes forming an electrode; forming a projection projecting with respect to the electrode by melting a resin; and providing a conductive layer electrically connected to the electrode. The conductive layer is extended to an upper surface of the projection. Therefore, productivity of the semiconductor is improved.
摘要翻译：一种制造半导体器件的方法包括：形成电极; 通过熔化树脂形成相对于电极突出的突起; 以及提供与该电极电连接的导电层。导电层延伸到突起的上表面。因此，提高了半导体的生产率。

10. 发明授权

US07910498B2 Method for manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US07910498B2
公开(公告)日：2011-03-22
申请号：US11425826
申请日：2006-06-22
申请人： Yasuo Yamasaki , Shuichi Tanaka , Nobuaki Hashimoto
发明人： Yasuo Yamasaki , Shuichi Tanaka , Nobuaki Hashimoto
IPC分类号： H01L21/31
CPC分类号： H01L24/13 , H01L23/525 , H01L24/11 , H01L24/90 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05124 , H01L2224/05548 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05671 , H01L2224/13099 , H01L2224/1319 , H01L2224/136 , H01L2224/90 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/07802 , H01L2924/12044 , H01L2924/14 , H01L2924/00014 , H01L2924/00
摘要： A method for manufacturing a semiconductor device, including: (a) forming an energy cured resin layer on a semiconductor substrate having an electrode pad and a passivation film; (b) fusing the resin layer without being cured and shrunk by a first energy supply processing; (c) forming a resin boss by curing and shrinking the resin layer after fusion by a second energy supply processing; and (d) forming an electrical conducting layer which is electrically connected to the electrode pad and passes through over the resin boss.
摘要翻译：一种制造半导体器件的方法，包括：（a）在具有电极焊盘和钝化膜的半导体衬底上形成能量固化树脂层; （b）通过第一能量供给处理使树脂层熔融而不固化和收缩; （c）通过第二能量供给处理使熔融后的树脂层固化收缩而形成树脂凸台; 和（d）形成电连接到电极焊盘并穿过树脂凸台的导电层。

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