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1. 发明专利

JP2014128062A Dc power distribution system 有权
标题翻译：直流电源分配系统
公开(公告)号：JP2014128062A
公开(公告)日：2014-07-07
申请号：JP2012281243
申请日：2012-12-25
申请人： Taisei Corp , 大成建設株式会社 , Toshiba Corp , 株式会社東芝
发明人： ENDO TETSUO , KOBAYASHI SHINGO , ONODA SHUJI , ENDO AKIRA , IINO MINORU , OGURA YASUHIRO
IPC分类号： H02J1/12 , H01M10/44 , H01M10/48 , H02J7/35 , H02M3/00
摘要： PROBLEM TO BE SOLVED: To provide an efficient DC power distribution system by preventing conversion efficiency of a DC/DC converter from being reduced.SOLUTION: A distributed power source 11, a high-capacity secondary battery 13 and a DC/DC converter 12 are connected. A distributed power source 21, a high-capacity secondary battery 23 and a DC/DC converter 22 are connected, and the DC/DC converters 12, 22 are connected to a primary side of a DC distribution panel 4. Loads L1, L2 are connected to the DC distribution panel 4 and low-voltage DC loads L3, L4 are connected via low-capacity secondary batteries 5, 6, respectively. When generated power Pg1, Pg2 of the distributed power sources 11, 21 are greater than required power of the loads L1-L4, the generated power Pg1, Pg2 are supplied to the loads L1, L2 and supplied to the loads L3, L4 via the low-capacity secondary batteries 5, 6. The low-capacity secondary batteries 5, 6 are charged with a surplus of the generated power Pg1, Pg2 and further, the high-capacity secondary battery 13 is charged with a surplus of that surplus.
摘要翻译：要解决的问题：通过防止DC / DC转换器的转换效率降低来提供高效的直流配电系统。解决方案：分布式电源11，大容量二次电池13和DC / DC转换器12是连接的。连接分布式电源21，大容量二次电池23和DC / DC转换器22，将DC / DC转换器12,22与直流配电盘4的一次侧连接。负载L1，L2为连接到直流配电盘4和低压直流负载L3，L4分别通过低容量二次电池5,6连接。当分布式电源11,21的发电电力Pg1，Pg2大于负载L1〜L4的所需功率时，将发电电力Pg1，Pg2提供给负载L1，L2，经由负载L1，L2供给负载L3，L4 低容量二次电池5,6。低容量二次电池5,6被充满了剩余的发电电力Pg1，Pg2，并且大容量二次电池13充满了剩余的剩余量。

2. 发明专利

JPH0453186A HEAT RESISTANT RESIN LAMINATED BOARD, MANUFACTURE THEREOF AND PRINTED WIRING BOARD USING SAME 失效
公开(公告)号：JPH0453186A
公开(公告)日：1992-02-20
申请号：JP15766790
申请日：1990-06-18
申请人： TOSHIBA CORP
发明人： WADA HIROSUKE , MIKOGAMI YUKIKIMI , ANDO SHIGERU , ENDO AKIRA
IPC分类号： B32B15/08 , B32B7/10 , H05K1/03 , H05K3/38
摘要： PURPOSE:To provide excellent heat dissipation and to rigidly bring a wiring pattern into close contact with a board through an insulating layer having excellent heat resistance by laminating thermoplastic resin having inorganic element, special temperature or higher of glass transition point and self-fusion adhesive properties and a metal foil on a metal plate. CONSTITUTION:A thermoplastic resin layer 2 is formed on a metal plate 1 having cutouts 1, and a metal foil layer 3 is further formed thereon. Warpage, distortion, etc., can be further suppressed with such a structure. The thermoplastic resin having flame retardance or nonflammable resin having inorganic element such as sulfur, halogen element, etc., 260 deg.C or higher of glass transition point and self-fusion adhesive properties includes, for example, polyketone sulfide resin having excellent heat resistance, tetrafluoroethylene-perfluoroalkylvinylether copolymer, etc. The foil is adhered on the plate through the resin to form a laminated board.

3. 发明专利

JPH0371698A MANUFACTURE OF PRINTED WIRING BOARD 失效
公开(公告)号：JPH0371698A
公开(公告)日：1991-03-27
申请号：JP20741989
申请日：1989-08-10
申请人： TOSHIBA CORP
发明人： ENDO AKIRA
IPC分类号： H05K9/00 , H05K1/02 , H05K3/46
摘要： PURPOSE:To obtain a printed wiring board which always displays maintains a highly reliable electromagnetic shielding property by a method wherein an electromagnetic shielding layer is provided as an inner layer or built in a required printed wiring board by a laminate molding process. CONSTITUTION:An electromagnetic shielding layer 2 is deposited on the required face of an insulating support 1. Then, copper foils 4 as conductive foils are laid on both the primary faces of the insulating support 1 where the electromagnetic shielding layer 2 has been provided, which is subjected to a laminate molding process through a conventional means to obtain a printed wiring board. The printed wiring board concerned is successively subjected to a required through-hole processing, a circuit pattern processing in which the copper foils 4 is photoetched, a plating process, and others, whereby a target electromagnetic shielding type printed wiring board can be obtained. By this setup, a complicated insulating layer forming work after the formation of a required circuit pattern can be simplified and a wiring board of high reliability can be obtained.

4. 发明专利

JPH0246795A MANUFACTURE OF PRINTED WIRING BOARD 失效
公开(公告)号：JPH0246795A
公开(公告)日：1990-02-16
申请号：JP19854388
申请日：1988-08-09
申请人： TOSHIBA CORP
发明人： ENDO AKIRA
IPC分类号： H05K3/00 , H05K3/42
摘要： PURPOSE:To coat inner wall surfaces of through holes with uniform copper layers by chemical copper-plating by forming thin copper layers at the through hole sections and, after forming prescribed circuit patterns, etc., removing the plated layers, and then, forming the chemical copper-plated layers having desired thicknesses on exposed surfaces. CONSTITUTION:A chemical copper-plated layer 5 having a thickness of

5. 发明专利

JPH01143295A MANUFACTURE OF MULTILAYER PRINTED WIRING BOARD 失效
公开(公告)号：JPH01143295A
公开(公告)日：1989-06-05
申请号：JP30137287
申请日：1987-11-28
申请人： TOSHIBA CORP
发明人： ENDO AKIRA
IPC分类号： H05K3/46
摘要： PURPOSE:To form an outer layer circuit pattern having precision pattern width and gap, by using a two-sided copper coated laminated board whose copper foil of the outer layer face is thinner than that of the inner layer face thus providing a thin conductor of outer layer. CONSTITUTION:A through hole 4 is provided in a specified position of a two- sided copper coated lamination board 3 which is composed by applying a 5mum- thick copper foil 1 and an 18mum thick-copper foil 2 on both sides of an insulation board. Then a copper plating layer 5 is provided on the entire surface of the lamination board 3 and a circuit pattern 6 is formed on the face of the copper foil 2(18mum) and an outer layer board 7 is manufactured whose outer layer face is the face of the thin copper foil 1. Seventy two outer layer boards and an inner layer board 9 whereon an inner layer circuit pattern 8 is formed on the both sides respectively, are laminated with a plurality of prepregs 10 interposed therebetween, then heated and pressurized for lamination formation in one-piece construction. A through hole 11 is provided at a specified position of a multilayer board then a copper plating layer 12 is formed on the entire of the inner wall face of the hole 11 and outer layer face. A circuit pattern 13 is formed on the outer layer face by an ordinary method.

6. 发明专利

JPS61153281A CHEMICAL COPPER PLATING SOLUTION 失效
公开(公告)号：JPS61153281A
公开(公告)日：1986-07-11
申请号：JP27330384
申请日：1984-12-26
申请人： TOSHIBA CORP
发明人： ENDO AKIRA , TAKEDA KAZUHIRO
IPC分类号： C23C18/40
摘要： PURPOSE:To improve the stability and Cu depositing property of a chemical Cu plating soln. by adding an org. sulfur compound or an ethyleneamine compound to the plating soln. contg. a Cu salt, a complexing agent, a reducing agent and a pH adjusting agent or by further adding 2,2'-dipyridyl or a water soluble cyanide. CONSTITUTION:An aqueous soln. contg. a Cu ion source such as CuSO4 or CuCl2, a complexing agent such as EDTA or Rochelle salt, a reducing agent such as formaldehyde and a pH adjusting agent such as NaOH is prepd. as a chemical Cu plating soln., and 0.1-10mg/l org. sulfur compound such as thiourea or 1-500m/l ethyleneamine compound is added to the plating soln. In order to improve the ductility of a plated Cu film, 1-100mg/l 2,2'-dipyridyl or 1-100mg/l water soluble cyanide such as NaCn may be added. The chemical Cu plating soln. having superior stability and capable of rapidly depositing Cu is obtd.

7. 发明专利

JPH01313996A MANUFACTURE OF PRINTED WIRING BOARD 失效
公开(公告)号：JPH01313996A
公开(公告)日：1989-12-19
申请号：JP14507288
申请日：1988-06-13
申请人： TOSHIBA CORP
发明人： ENDO AKIRA
IPC分类号： H05K3/42
摘要： PURPOSE:To improve the reliability of electric conduction of a through hole by a method wherein an electroplated copper layer is formed on a land and the inner wall surface of a through hole, by utilizing selective etching property of copper and nickel. CONSTITUTION:A chemical nickel plated layer 7 as a substratum is formed on the whole part containing the inner wall of a through hole 4 and a land 6. By using said substratum 7, a dense electroplated copper layer 9 is formed so as to cover the inner wall surface of the through hole 4 and a land 6. As a result, the formed copper layer 9 possesses density, and maintains almost uniform quality. The formed electroplated copper layer 9 is further coated with a nickel plated layer 7'. In this state, the layer 9 is etched and eliminated together with the chemical nickel layer 7 covering a circuit part, so that the electroplated copper layer 9 is not damaged. Thereby the reliability of electric conduction of through hole is improved.

8. 发明专利

JPS6179303A Manufacture of waveguide 失效
标题翻译：波导的制造
公开(公告)号：JPS6179303A
公开(公告)日：1986-04-22
申请号：JP20271884
申请日：1984-09-27
申请人： Toshiba Corp
发明人： MARUOKA MINEO , ENDO AKIRA
IPC分类号： H01P11/00
CPC分类号： H01P11/002
摘要： PURPOSE:To dissolve problems which have been caused by etching, by using a low-melting point alloy as the material of a mandrel and, when a formed product is taken out, melting the mandrel. CONSTITUTION:A mandrel 11 is formed by using a ternary eutectic alloy (of a 143 deg.C melting temperature) of, for example, 18.2% Cd, 30.6% Pd, and 51.2% Sn and electric Cu plating is performed on the surface of the mandrel 11 after performing non-electroplating Ag plating. Carbon cloth 15 is wound around the mandrel 11 to a thickness of 2mm by impregnating the cloth with epoxy resin at every one layer. The section formed with the carbon cloth is heat- hardened for about 3hr at 120 deg.C under 4kg/cm2 pressure and, after the heat- hardening treatment, put under atmospheric pressure at 130 deg.C. Then the formed product is put in a furnace of 145 deg.C where the material forming the mandrel 11 is melted and removed and a waveguide 16 is obtained.
摘要翻译：目的：为了解决由蚀刻引起的问题，通过使用低熔点合金作为心轴的材料，并且当成形产品被取出时，熔化心轴。构成：通过使用例如18.2％Cd，30.6％Pd和51.2％Sn的三元共晶合金（143℃的熔融温度）形成心轴11，并且在表面上进行电镀铜在进行非电镀Ag电镀之后的心轴11。碳布15通过在每一层用环氧树脂浸渍布缠绕在心轴11上至2mm的厚度。用碳布形成的部分在120℃，4kg / cm2压力下加热硬化约3小时，经过加热硬化处理后，在130℃的大气压下进行。然后将形成的产品放入145℃的炉中，其中形成心轴11的材料被熔化和去除，并且获得波导16。

9. 发明专利

JPH01191498A MANUFACTURE OF MULTILAYER PRINTED WIRING BOARD 失效
公开(公告)号：JPH01191498A
公开(公告)日：1989-08-01
申请号：JP1609188
申请日：1988-01-27
申请人： TOSHIBA CORP
发明人： ENDO AKIRA
IPC分类号： H05K3/46
摘要： PURPOSE:To form a highly accurate outer layer circuit pattern, by providing an etching resisting metal-resist layer on an outer conductor layer before performing plating of a through hole in laminated boards, removing the plated layer on the surface of the outer layer wherein through hole plating is performed by etching, and thereafter peeling and removing the etching resisting metal-resist layer. CONSTITUTION:Copper foils 2 and 3 are stuck to both surfaces of an insulating plate 1. A through hole 4 is provided at a specified position. Thereafter, a copper plated layer 5 is provided on the entire surface. Then, circuit patterns are formed on both surfaces of a board. A nickel plated layer 6 is provided as an etching resisting metal- resist layer on the circuit pattern of the outer layer. A prepreg 10 is provided between two obtained outer plates 7 and inner layer plate 9. Inner circuit patterns 8 are formed on both surfaces of the plate 9. Heating is performed and pressure is applied, and a unitary body is molded. A through hole 11 is provided at a specified position. Then, a copper plated layer 12 is provided on the entire surface. Thereafter, only the copper plated layer on the nickel plated layer 6 other than the land part of the through hole is etched away. Then, the exposed nickel plated layer 6 is peeled and removed, and a multilayer printed wiring board is obtained.

10. 发明专利

JPS621878A ANALYZER 失效
公开(公告)号：JPS621878A
公开(公告)日：1987-01-07
申请号：JP13792885
申请日：1985-06-26
申请人： TOSHIBA CORP
发明人： HASEBE HIROYUKI , ENDO AKIRA
IPC分类号： C23C18/40 , C23C18/16 , C23C18/38
摘要： PURPOSE:To measure copper concn. in soln. accurately and continuously independently of the pH value of soln. to be measured, by controlling intensity of incident light on an optical cell due to the pH, and detecting intensity of light after passing the optical cell with photodelector. CONSTITUTION:Light emitted from a source 1 such as tungsten lamp is made to monochromatic light having a specified wavelength by a filter 2, it is converged by a lens 3 and made incident on electroless copper plating liquid being soln. to be measured in the optical cell 4. Light passed through the cell 4 is made incident on a photodetector tube 5 such as photomultiplier tube to measure the intensity. Further the pH value of the above described soln. is measured by a pH measuring electrode 6, the output is converted to low impedance by an impedance converter 7, then the source 1 is controlled through optical source control circuit combined with a nonlinear feed back circuit 9. In this way, fluctuation of the pH value is corrected, copper concn. in plating liquid is continuously and accurately detected and plating liquid can be stably and accurately controlled.

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