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    • 1. 发明专利
    • Thermally conductive resin composition excellent in heat resistance and heat dissipation component using the same
    • 导热性树脂组合物在耐热性和散热性能方面的优异成分
    • JP2014145024A
    • 2014-08-14
    • JP2013014085
    • 2013-01-29
    • Taika:Kk株式会社タイカ
    • KAWAGOE YOSHIFUMIAZUMA SHUNICHI
    • C08L101/00C08K3/22C08L83/04
    • PROBLEM TO BE SOLVED: To provide a thermally conductive resin composition which is improved in heat resistance or thermal degradation resistance in a low-oxygen atmosphere by containing a specific thermal stabilizer, and to provide a heat dissipation component using the same.SOLUTION: The thermally conductive resin composition for a low-oxygen heating environment, which is obtained by dispersing at least a thermally conductive filler (B) and a thermal stabilizer (C) in a resin (A) and is used in a low-oxygen heating environment, is characterized in that: the thermal stabilizer (C) is a rare earth oxide of a body-centered cubic crystal structure (or a C-type rare earth oxide); and the content of the C-type rare earth oxide is 0.005-100 pts.wt. based on 100 pts.wt. of the resin (A).
    • 要解决的问题:提供一种通过含有特定的热稳定剂在低氧气氛中提高耐热性或耐热降解性的导热性树脂组合物,并提供使用其的散热成分。解决方案:热 通过将至少导热性填料(B)和热稳定剂(C)分散在树脂(A)中而用于低氧加热环境而得到的低氧加热环境用导电性树脂组合物为 其特征在于,所述热稳定剂(C)为体心立方晶体结构(或C型稀土氧化物)的稀土类氧化物。 C型稀土氧化物的含量为0.005〜100重量份。 基于100重量 的树脂(A)。