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1. 发明申请

US20170222073A1 METAL-CONTAINING THERMAL AND DIFFUSION BARRIER LAYER FOR FOIL-BASED METALLIZATION OF SOLAR CELLS 审中-公开
公开(公告)号：US20170222073A1
公开(公告)日：2017-08-03
申请号：US15492382
申请日：2017-04-20
申请人： Taeseok Kim , Robert Woehl , Gabriel Harley , Nils-Peter Harder , Jens-Dirk Moschner , Matthieu Moors , Michel Arsene Olivier Ngamo Toko
发明人： Taeseok Kim , Robert Woehl , Gabriel Harley , Nils-Peter Harder , Jens-Dirk Moschner , Matthieu Moors , Michel Arsene Olivier Ngamo Toko
IPC分类号： H01L31/0224 , H01L31/028 , H01L31/0368 , H01L31/077 , H01L31/056 , H01L31/0236
CPC分类号： H01L31/022458 , H01L31/022441 , H01L31/02366 , H01L31/028 , H01L31/035281 , H01L31/03682 , H01L31/05 , H01L31/0516 , H01L31/0547 , H01L31/056 , H01L31/0745 , H01L31/077 , H01L31/1804 , H01L31/182 , Y02E10/50
摘要： Methods of fabricating solar cells using a metal-containing thermal and diffusion barrier layer in foil-based metallization approaches, and the resulting solar cells, are described. For example, a method of fabricating a solar cell includes forming a plurality of semiconductor regions in or above a substrate. The method also includes forming a metal-containing thermal and diffusion barrier layer above the plurality of semiconductor regions. The method also includes forming a metal seed layer on the metal-containing thermal and diffusion barrier layer. The method also includes forming a metal conductor layer on the metal seed layer. The method also includes laser welding the metal conductor layer to the metal seed layer. The metal-containing thermal and diffusion barrier layer protects the plurality of semiconductor regions during the laser welding.

2. 发明授权

US09634178B1 Method of using laser welding to ohmic contact of metallic thermal and diffusion barrier layer for foil-based metallization of solar cells 有权
公开(公告)号：US09634178B1
公开(公告)日：2017-04-25
申请号：US14971335
申请日：2015-12-16
申请人： Taeseok Kim , Robert Woehl , Gabriel Harley , Nils-Peter Harder , Jens-Dirk Moschner , Matthieu Moors , Michel Arsène Olivier Ngamo Toko
发明人： Taeseok Kim , Robert Woehl , Gabriel Harley , Nils-Peter Harder , Jens-Dirk Moschner , Matthieu Moors , Michel Arsène Olivier Ngamo Toko
IPC分类号： H01L31/18 , H01L31/05 , H01L31/054 , H01L31/0368 , H01L31/0224
CPC分类号： H01L31/022458 , H01L31/022441 , H01L31/02366 , H01L31/028 , H01L31/035281 , H01L31/03682 , H01L31/05 , H01L31/0516 , H01L31/0547 , H01L31/056 , H01L31/0745 , H01L31/077 , H01L31/1804 , H01L31/182 , Y02E10/50
摘要： Methods of fabricating solar cells using a metal-containing thermal and diffusion barrier layer in foil-based metallization approaches, and the resulting solar cells, are described. For example, a method of fabricating a solar cell includes forming a plurality of semiconductor regions in or above a substrate. The method also includes forming a metal-containing thermal and diffusion barrier layer above the plurality of semiconductor regions. The method also includes forming a metal seed layer on the metal-containing thermal and diffusion barrier layer. The method also includes forming a metal conductor layer on the metal seed layer. The method also includes laser welding the metal conductor layer to the metal seed layer. The metal-containing thermal and diffusion barrier layer protects the plurality of semiconductor regions during the laser welding.

3. 发明申请

US20160380134A1 WIRE-BASED METALLIZATION FOR SOLAR CELLS 有权
标题翻译：用于太阳能电池的基于电线的金属化
公开(公告)号：US20160380134A1
公开(公告)日：2016-12-29
申请号：US14752818
申请日：2015-06-26
申请人： Richard Hamilton Sewell , Robert Woehl , Jens Dirk Moschner , Nils-Peter Harder
发明人： Richard Hamilton Sewell , Robert Woehl , Jens Dirk Moschner , Nils-Peter Harder
IPC分类号： H01L31/0224 , H01L31/18 , H01L31/05
CPC分类号： H01L31/022441 , H01L31/0682 , Y02E10/547
摘要： Approaches for fabricating wire-based metallization for solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal wires. Each metal wire of the plurality of metal wires is parallel along a first direction to form a one-dimensional layout of a metallization layer for the solar cell.
摘要翻译：描述了用于制造用于太阳能电池的线基金属化的方法以及所得到的太阳能电池。在一个示例中，太阳能电池包括具有背面和相对的光接收表面的基板。多个交替的N型和P型半导体区域设置在衬底的背面中或上方。导电接触结构设置在多个交替的N型和P型半导体区域上。导电接触结构包括多个金属线。多个金属线的每个金属线沿着第一方向平行，以形成用于太阳能电池的金属化层的一维布局。

4. 发明申请

US20170179308A1 LASER FOIL TRIM APPROACHES FOR FOIL-BASED METALLIZATION FOR SOLAR CELLS 审中-公开
公开(公告)号：US20170179308A1
公开(公告)日：2017-06-22
申请号：US15453612
申请日：2017-03-08
申请人： Robert Woehl , Richard Hamilton Sewell , Mohamed A. Elbandrawy , Taeseok Kim , Thomas P. Pass , Benjamin Ian Hsia , David Fredric Joel Kavulak , Nils-Peter Harder
发明人： Robert Woehl , Richard Hamilton Sewell , Mohamed A. Elbandrawy , Taeseok Kim , Thomas P. Pass , Benjamin Ian Hsia , David Fredric Joel Kavulak , Nils-Peter Harder
IPC分类号： H01L31/02 , H01L31/0224
CPC分类号： H01L31/022433 , H01L31/022441 , H01L31/0516 , H01L31/18 , Y02E10/50
摘要： Laser foil trim approaches for foil-based metallization of solar cells, and the resulting solar cells, are described. For example, a method of fabricating a solar cell includes attaching a metal foil sheet to a surface of a wafer to provide a unified pairing of the metal foil sheet and the wafer, wherein the wafer has a perimeter and the metal foil sheet has a portion overhanging the perimeter. The method also includes laser scribing the metal foil sheet along the perimeter of the wafer using a laser beam that overlaps the metal foil sheet outside of the perimeter of the wafer and at the same time overlaps a portion of the unified pairing of the metal foil sheet and the wafer inside the perimeter of the wafer to remove the portion of the metal foil sheet overhanging the perimeter and to provide a metal foil piece coupled to the surface of the wafer.

5. 发明申请

US20170125612A1 LASER FOIL TRIM APPROACHES FOR FOIL-BASED METALLIZATION FOR SOLAR CELLS 有权
公开(公告)号：US20170125612A1
公开(公告)日：2017-05-04
申请号：US14927265
申请日：2015-10-29
申请人： Robert Woehl , Richard Hamilton Sewell , Mohamed A. Elbandrawy , Taeseok Kim , Thomas P. Pass , Benjamin Ian Hsia , David Fredric Joel Kavulak , Nils-Peter Harder
发明人： Robert Woehl , Richard Hamilton Sewell , Mohamed A. Elbandrawy , Taeseok Kim , Thomas P. Pass , Benjamin Ian Hsia , David Fredric Joel Kavulak , Nils-Peter Harder
IPC分类号： H01L31/02
CPC分类号： H01L31/022433 , H01L31/022441 , H01L31/0516 , H01L31/18 , Y02E10/50
摘要： Laser foil trim approaches for foil-based metallization of solar cells, and the resulting solar cells, are described. For example, a method of fabricating a solar cell includes attaching a metal foil sheet to a surface of a wafer to provide a unified pairing of the metal foil sheet and the wafer, wherein the wafer has a perimeter and the metal foil sheet has a portion overhanging the perimeter. The method also includes laser scribing the metal foil sheet along the perimeter of the wafer using a laser beam that overlaps the metal foil sheet outside of the perimeter of the wafer and at the same time overlaps a portion of the unified pairing of the metal foil sheet and the wafer inside the perimeter of the wafer to remove the portion of the metal foil sheet overhanging the perimeter and to provide a metal foil piece coupled to the surface of the wafer.

6. 发明授权

US09620655B1 Laser foil trim approaches for foil-based metallization for solar cells 有权
公开(公告)号：US09620655B1
公开(公告)日：2017-04-11
申请号：US14927265
申请日：2015-10-29
申请人： Robert Woehl , Richard Hamilton Sewell , Mohamed A. Elbandrawy , Taeseok Kim , Thomas P. Pass , Benjamin Ian Hsia , David Fredric Joel Kavulak , Nils-Peter Harder
发明人： Robert Woehl , Richard Hamilton Sewell , Mohamed A. Elbandrawy , Taeseok Kim , Thomas P. Pass , Benjamin Ian Hsia , David Fredric Joel Kavulak , Nils-Peter Harder
IPC分类号： H01L31/00 , H01L31/02 , H01L31/18 , H01L31/0224 , H01L31/05
CPC分类号： H01L31/022433 , H01L31/022441 , H01L31/0516 , H01L31/18 , Y02E10/50
摘要： Laser foil trim approaches for foil-based metallization of solar cells, and the resulting solar cells, are described. For example, a method of fabricating a solar cell includes attaching a metal foil sheet to a surface of a wafer to provide a unified pairing of the metal foil sheet and the wafer, wherein the wafer has a perimeter and the metal foil sheet has a portion overhanging the perimeter. The method also includes laser scribing the metal foil sheet along the perimeter of the wafer using a laser beam that overlaps the metal foil sheet outside of the perimeter of the wafer and at the same time overlaps a portion of the unified pairing of the metal foil sheet and the wafer inside the perimeter of the wafer to remove the portion of the metal foil sheet overhanging the perimeter and to provide a metal foil piece coupled to the surface of the wafer.

7. 发明申请

US20110186121A1 METAL-CONTAINING COMPOSITION, METHOD FOR PRODUCING ELECTRICAL CONTACT STRUCTURES ON ELECTRICAL COMPONENTS AND ALSO ELECTRICAL COMPONENT 审中-公开
标题翻译：金属含量组合物，电气部件电气接触结构的制造方法以及电气部件
公开(公告)号：US20110186121A1
公开(公告)日：2011-08-04
申请号：US13003252
申请日：2009-07-06
申请人： Matthias Horteis , Robert Woehl , Stefan Glunz , Aleksander Filipovic , Daniel Schmidt
发明人： Matthias Horteis , Robert Woehl , Stefan Glunz , Aleksander Filipovic , Daniel Schmidt
IPC分类号： H01L31/0224 , H01B1/22 , H01B1/14 , H01L31/18
CPC分类号： H01L31/022425 , H01B1/22 , H05K1/092 , Y02E10/50
摘要： The present invention relates to a metal-containing composition, a method for producing electrical contact structures on electronic components and also an electronic component provided with such a contacting.
摘要翻译：本发明涉及含金属的组合物，电子部件上的电接触结构的制造方法以及具有接触的电子部件。

8. 发明申请

US20160380122A1 ETCHING TECHNIQUES FOR SEMICONDUCTOR DEVICES 有权
标题翻译：半导体器件的蚀刻技术
公开(公告)号：US20160380122A1
公开(公告)日：2016-12-29
申请号：US14751095
申请日：2015-06-25
申请人： Robert Woehl , David Aaron Randolph Barkhouse , Paul Loscutoff
发明人： Robert Woehl , David Aaron Randolph Barkhouse , Paul Loscutoff
IPC分类号： H01L31/02 , H01L21/3213 , H01L31/18
CPC分类号： H01L31/02013 , H01L21/32134 , H01L31/022441 , H01L31/0682 , H01L31/18 , H01L31/1804 , Y02E10/50 , Y02E10/547 , Y02P70/521
摘要： Fabricating a semiconductor device can include forming a metal seed region over a substrate. The method can include forming a mask over a first portion of the metal seed region. The method can also include forming a metal region over the metal seed region and removing the mask. The method can include forming metal contact fingers on the semiconductor device, where the forming includes etching the first portion of the metal seed region with an etchant comprising an acid, an oxidizer and chloride ions.
摘要翻译：制造半导体器件可以包括在衬底上形成金属种子区域。该方法可以包括在金属种子区域的第一部分上形成掩模。该方法还可以包括在金属种子区域上形成金属区域并除去掩模。该方法可以包括在半导体器件上形成金属接触指，其中形成包括用包含酸，氧化剂和氯离子的蚀刻剂蚀刻金属种子区的第一部分。

9. 发明授权

US08748310B2 Method for producing a metal contact structure of a photovoltaic solar cell 有权
标题翻译：光伏太阳能电池的金属接触结构的制造方法
公开(公告)号：US08748310B2
公开(公告)日：2014-06-10
申请号：US13805023
申请日：2011-06-16
申请人： Daniel Biro , Benjamin Thaidigsmann , Florian Clement , Robert Woehl , Edgar-Allan Wotke
发明人： Daniel Biro , Benjamin Thaidigsmann , Florian Clement , Robert Woehl , Edgar-Allan Wotke
IPC分类号： H01L21/44
CPC分类号： H01L31/18 , H01L31/022425 , H01L31/05 , Y02E10/50
摘要： A method for producing a metal contact structure of a photovoltaic solar cell, including: applying an electrically non-conductive insulating layer to a semiconductor substrate, applying a metal contact layer to the insulating layer, and generating a plurality of local electrically conductive connections between the semiconductor substrate and the contact layer right through the insulating layer. The metal contact layer is formed using two pastes containing metal particles: the first paste containing metal particles is applied to local regions, and the second paste containing metal particles is applied covering at least the regions covered with the first paste and partial regions located therebetween. By global heating the semiconductor substrate the first paste penetrates the insulating layer and forms an electrically conductive contact directly with the semiconductor substrate, whereas the second paste does not penetrate the insulating layer and is electrically conductively connected to the semiconductor substrate via the first paste.
摘要翻译：一种用于制造光伏太阳能电池的金属接触结构的方法，包括：向半导体衬底施加非导电绝缘层，向所述绝缘层施加金属接触层，以及在所述绝缘层之间产生多个局部导电连接半导体衬底和接触层直接通过绝缘层。使用含有金属颗粒的两个糊料形成金属接触层：将第一糊料含有金属颗粒施加到局部区域，并且将第二糊料含有金属颗粒涂覆至少覆盖第一糊料覆盖的区域和位于其间的部分区域。通过对半导体衬底进行全局加热，第一浆料穿透绝缘层并与半导体衬底直接形成导电触点，而第二焊膏不穿透绝缘层，并通过第一焊膏与半导体衬底电连接。

10. 发明申请

US20160380126A1 MULTI-LAYER BARRIER FOR METALLIZATION 审中-公开
标题翻译：用于金属化的多层障碍物
公开(公告)号：US20160380126A1
公开(公告)日：2016-12-29
申请号：US14751096
申请日：2015-06-25
申请人： David Aaron Randolph Barkhouse , Todd Richards Johnson , Paul Loscutoff , Robert Woehl
发明人： David Aaron Randolph Barkhouse , Todd Richards Johnson , Paul Loscutoff , Robert Woehl
IPC分类号： H01L31/0224 , H01L31/18
CPC分类号： H01L31/022441 , H01L31/0682 , H01L31/1804 , Y02E10/547 , Y02P70/521
摘要： A solar cell can include a substrate, a semiconductor region disposed in or above the substrate, and a conductive stack that includes a first conductive region, a multi-layer barrier region, and a second conductive region.
摘要翻译：太阳能电池可以包括基板，设置在基板中或上方的半导体区域，以及包括第一导电区域，多层势垒区域和第二导电区域的导电堆叠。

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