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1. 发明授权

US5886405A Semiconductor device package having inner leads with slots 失效
标题翻译：半导体器件封装，具有带引线的内引线
公开(公告)号：US5886405A
公开(公告)日：1999-03-23
申请号：US906877
申请日：1997-08-06
申请人： Tae Hyeong Kim , Tae Sung Park , In Sik Cho , Hee Kook Choi
发明人： Tae Hyeong Kim , Tae Sung Park , In Sik Cho , Hee Kook Choi
IPC分类号： H01L23/28 , H01L21/56 , H01L23/495 , H01L23/50 , H01L23/48
CPC分类号： H01L23/49548 , H01L21/565 , H01L23/4951 , H01L24/32 , H01L2224/29007 , H01L2224/32014 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01082 , H01L2924/181
摘要： A semiconductor device package includes a semiconductor chip and a plurality of inner leads, each having at least one slot formed along an upper surface of the inner lead. An adhesive layer is used to attach a bottom surface of the semiconductor chip to the upper surface of the inner lead. An encapsulant is allowed to flow in a package body mold, around the inner leads and through the slot. The slots prevent the production of turbulence along a side surface of the inner lead opposite to the flow direction, thereby avoiding problems associated with incomplete encapsulation such as the internal voids.
摘要翻译：半导体器件封装包括半导体芯片和多个内引线，每个内引线具有沿着内引线的上表面形成的至少一个槽。使用粘合剂层将半导体芯片的底面附着到内引线的上表面。允许密封剂在包装体模具中围绕内部引线并通过狭槽流动。这些槽防止沿与流动方向相反的内部引线的侧表面产生湍流，从而避免与内部空隙等不完全密封相关的问题。

2. 发明授权

US5811132A Mold for semiconductor packages 失效
标题翻译：半导体封装模具
公开(公告)号：US5811132A
公开(公告)日：1998-09-22
申请号：US542011
申请日：1995-10-12
申请人： Hee Sun Rho , Hee Kook Choi , In Sik Cho , Tae Sung Park
发明人： Hee Sun Rho , Hee Kook Choi , In Sik Cho , Tae Sung Park
IPC分类号： B29C45/26 , B29C45/02 , B29C45/14 , B29L31/34 , H01L21/56
CPC分类号： B29C45/14655 , H01L2224/48091 , H01L2224/48247 , H01L2924/10253
摘要： An improved mold for forming a semiconductor package, having a molding compound injection gate having a height not greater than the thickness of the lead frame of the semiconductor assembly placed in the mold.
摘要翻译：一种用于形成半导体封装的改进的模具，其具有不大于放置在模具中的半导体组件的引线框架的厚度的模制化合物注入门。

3. 发明授权

US5932923A Semiconductor device packages having dummy block leads and tie bars with extended portions to prevent formation of air traps in the encapsulate 失效
标题翻译：半导体器件封装具有虚拟块引线和具有延伸部分的连接杆，以防止密封件中的空气阱的形成
公开(公告)号：US5932923A
公开(公告)日：1999-08-03
申请号：US943129
申请日：1997-10-03
申请人： Tae Hyeong Kim , Hee Sun Rho , In Sik Cho , Gi Su Yoo , Sang Hyeop Lee
发明人： Tae Hyeong Kim , Hee Sun Rho , In Sik Cho , Gi Su Yoo , Sang Hyeop Lee
IPC分类号： H01L23/28 , H01L21/56 , H01L23/12 , H01L23/495 , H01L23/50
CPC分类号： H01L21/565 , H01L23/49551 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/01068 , H01L2924/01079 , H01L2924/181
摘要： A semiconductor device package is equipped with devices for preventing the formulation of air traps in its encapsulated package body. These devices include dummy block leads formed on the outermost inner lead of each row of inner leads, and extended portions formed on each tie bar. Each dummy block lead extends from the end of an outermost inner lead and is integrally formed therewith. The tie bar extended portions are separated into several parts defined by spaces between the parts, and the several parts are formed integral with each other and with the tie bar. The dummy block leads and the tie bar extended portions may be formed so as to be inclined relative to horizontal and with jagged edges at their side surfaces. The dummy block leads and tie bar extended portions serve to reduce the velocity of the potting resin which forms the encapsulate, as it enters the die cavity for encapsulation, but before the resin actually contacts the chip or the inner leads. Thereby, the flow velocity at various points within the mold cavity is uniform, and formation of air traps is prevented.
摘要翻译：半导体器件封装配备有用于防止其封装的封装主体中的空气阱的配制的装置。这些装置包括形成在每排内引线的最外侧的内引线上的虚拟块引线和形成在每个连杆上的延伸部分。每个虚拟块引线从最外侧的内部引线的端部延伸并与其一体地形成。拉杆延伸部分被分成由部件之间的空间限定的几个部分，并且多个部分彼此成一体并且与连接杆形成。虚拟块引导件和拉杆延伸部分可以形成为相对于水平面倾斜并且在其侧表面具有锯齿状边缘。虚拟块引线和连接杆延伸部分用于当其进入用于封装的模腔时，但在树脂实际接触芯片或内引线之前，会降低形成封装的灌封树脂的速度。因此，模腔内的各点的流速是均匀的，并且防止了空气阱的形成。

4. 发明授权

US5980870A Herb medicine extract-containing non-bleeding striped dentifrice composition 失效
标题翻译：含草药提取物含有非渗色条纹牙膏组合物
公开(公告)号：US5980870A
公开(公告)日：1999-11-09
申请号：US934544
申请日：1997-09-19
申请人： In Sub Baik , Jong Gi Lee , In Sik Cho , Youn Woo Park
发明人： In Sub Baik , Jong Gi Lee , In Sik Cho , Youn Woo Park
IPC分类号： A61K8/19 , A61K8/26 , A61K8/73 , A61K8/97 , A61Q11/00 , A61K9/16
CPC分类号： A61K8/0237 , A61K8/19 , A61K8/26 , A61K8/73 , A61K8/97 , A61Q11/00
摘要： A herb medicine extract-containing non-bleeding striped dentifrice composition, consisting essentially of a striped dentifrice component and a base dentifrice component, each component comprising the following ingredients at the substantially same amount: a. an abrasive that has a BET surface area of 10 m.sup.2 /g or less and an average particle diameter of 1 to 30 .mu.m upon measurement by Coulter Counter method, and shows oil absorption (linseed oil, ml/100 g) of 50 or less; b. a binder selected from the group consisting of xanthan gum, carrageenan, sodium carboxymethylcellulose, and the mixtures thereof; c. an alkyl sulfonate of anionic surfactants; and d. a humectant, and said striped dentifrice component containing herb medicine extracts at an amount of 0.001 to 10% by weight, on the basis of dry solid substance. It is non-bleeding by virtue of the substantially same formulation in the two components and the herb medicine extracts allow the dentifrice composition to suppress the formation of plaque.
摘要翻译：一种草本药物提取物含有非出血性条状洁齿剂组合物，其基本上由条状洁牙剂组分和基础洁齿剂组分组成，每种组分包含基本相同量的以下成分：a。通过Coulter Counter法测定的BET表面积为10m 2 / g以下，平均粒径为1〜30μm的研磨剂，油吸收（亚麻子油，ml / 100g）为50以下 ; b。选自黄原胶，角叉菜胶，羧甲基纤维素钠及其混合物的粘合剂; C。阴离子表面活性剂的烷基磺酸盐; 和d。湿润剂，所述条状洁齿剂组分含有基于干固体物质的0.001至10重量％的草药提取物。由于在两个成分中基本相同的制剂是不渗血的，草药提取物允许洁牙剂组合物抑制斑块的形成。

5. 发明申请

US20080237896A1 Wafer level packages capable of reducing chipping defect and manufacturing methods thereof 有权
标题翻译：能够减少切屑缺陷的晶片级封装及其制造方法
公开(公告)号：US20080237896A1
公开(公告)日：2008-10-02
申请号：US12076903
申请日：2008-03-25
申请人： In Sik Cho
发明人： In Sik Cho
IPC分类号： H01L23/29 , H01L21/00
CPC分类号： H01L21/561 , H01L23/3128 , H01L2224/13 , H01L2924/00011 , H01L2924/00014 , H01L2224/0401
摘要： A packaged semiconductor device may include a substrate including at least one device layer and at least one connector arranged thereon, and a resin cover covering each side of the substrate, the resin cover on at least one side of the substrate including an opening exposing the connector and the resin cover on at least one other side of the substrate exposing a portion of the substrate.
摘要翻译：封装的半导体器件可以包括：衬底，其包括至少一个器件层和布置在其上的至少一个连接器;以及覆盖衬底的每一侧的树脂覆盖层，所述衬底的至少一侧上的树脂盖包括露出连接器的开口并且所述树脂盖在所述基板的至少另一侧上，暴露所述基板的一部分。

6. 发明授权

US08026601B2 Encapsulated wafer level package with protection against damage and manufacturing method 有权
标题翻译：封装的晶圆级封装，防止损坏和制造方法
公开(公告)号：US08026601B2
公开(公告)日：2011-09-27
申请号：US12076903
申请日：2008-03-25
申请人： In Sik Cho
发明人： In Sik Cho
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L23/28
CPC分类号： H01L21/561 , H01L23/3128 , H01L2224/13 , H01L2924/00011 , H01L2924/00014 , H01L2224/0401
摘要： A packaged semiconductor device may include a substrate including at least one device layer and at least one connector arranged thereon, and a resin cover covering each side of the substrate, the resin cover on at least one side of the substrate including an opening exposing the connector and the resin cover on at least one other side of the substrate exposing a portion of the substrate.
摘要翻译：封装的半导体器件可以包括：衬底，其包括至少一个器件层和布置在其上的至少一个连接器;以及覆盖衬底的每一侧的树脂覆盖层，所述衬底的至少一侧上的树脂盖包括露出连接器的开口并且所述树脂盖在所述基板的至少另一侧上，暴露所述基板的一部分。

7. 发明授权

US07906472B2 Bleaching and detergent compositions comprising manganese complex prepared from tetra-aza macrocyclic ligands through a convenient synthesis 有权
标题翻译：漂白和洗涤剂组合物包含通过方便的合成由四 - 氮杂大环配体制备的锰络合物
公开(公告)号：US07906472B2
公开(公告)日：2011-03-15
申请号：US11593167
申请日：2006-11-03
申请人： Han Woong Park , Sang Yun Lee , In Sik Cho , Won Jong Kim , In Sub Baik
发明人： Han Woong Park , Sang Yun Lee , In Sik Cho , Won Jong Kim , In Sub Baik
IPC分类号： C11D1/00 , C11D3/20 , C11D3/26 , C11D3/28 , C11D3/39 , C11D3/395
CPC分类号： C11D3/3935 , C11D3/3932
摘要： The present invention provides a bleach activator which is at least one macrocyclic manganese complex selected from the group consisting of [MnIII(rac-14-decane)X2]Y, [MnIII(mes-14-decane)X2]Y.H2O and [MnIII(mes-14-decane)X2]Y represented by Formulas 1-3, as well as a preparation method thereof. Also, the invention provides a bleaching composition and bleaching detergent composition comprising the bleach activator. The bleach activator comprising the manganese complex is used in a granulated form. wherein X is at least one selected from chlorine (—Cl) and acetate (—OOCCH3), and Y is an anion selected from Cl−, Br−, F−, NO3−, ClO4−, OH−, NCS−, N3−, and PF6−.
摘要翻译：本发明提供一种漂白活化剂，它是至少一种选自[MnIII（rac-14-癸烷）X2] Y，[MnIII（mes-14-癸烷）X2]·Y.H2O和[ 由式1-3表示的MnIII（mes-14-癸烷）X2] Y及其制备方法。此外，本发明提供了一种漂白组合物和漂白洗涤剂组合物，其包含漂白活化剂。包含锰络合物的漂白活化剂以颗粒形式使用。其中X是选自氯（-Cl）和乙酸（-OOCCH 3）中的至少一种，Y是选自Cl-，Br-，F-，NO 3 - ，ClO 4 - ，OH-，NCS-，N 3 - ，和PF6-。

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