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    • 8. 发明申请
    • Cushioning Material for a Polishing Pad
    • 抛光垫用缓冲材料
    • US20090011221A1
    • 2009-01-08
    • US11815900
    • 2006-02-10
    • Hiromasa KawaguchiToshiaki KimuraTakeshi Kawakami
    • Hiromasa KawaguchiToshiaki KimuraTakeshi Kawakami
    • C08J9/35B32B3/26
    • B24B37/24Y10T428/249989Y10T428/249991Y10T428/249992
    • Disclosed is a cushioning material for a polishing pad, which hardly suffers swelling deformation caused by water because it is extremely low in water-absorbing characteristics and water-swelling characteristics. The cushioning material for a polishing pad includes a polyurethane foam capable of polishing even a semiconductor wafer having an undulated surface or a wafer having a local step that is formed during circuit forming process so that the undulation or step becomes smaller by uniformly polishing an entire surface of the wafer along the undulation or step. The cushioning material for a polishing pad is characterized by including a polyurethane foam obtained by reacting polyol and polyisocyanate with each other, the polyurethane foam having a contact angle with water of 90° or more. The polyurethane foam is preferably made by using hydrophobic polyol, and preferably has a self-skin layer formed thereon.
    • 公开了一种用于抛光垫的缓冲材料,由于其吸水特性和水溶胀特性极低,几乎不会由于水引起的溶胀变形。 用于抛光垫的缓冲材料包括能够抛光甚至具有波状表面的半导体晶片的聚氨酯泡沫或具有在电路形成过程期间形成的局部台阶的晶片,从而通过均匀抛光整个表面使波动或阶梯变小 沿着起伏或阶跃的晶片。 用于抛光垫的缓冲材料的特征在于包括通过使多元醇和多异氰酸酯彼此反应获得的聚氨酯泡沫,聚氨酯泡沫与水的接触角为90°以上。 聚氨酯泡沫优选通过使用疏水性多元醇制成,优选在其上形成自体表层。