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1. 发明申请

US20170371092A1 METHOD FOR MANUFACTURING ELECTRONIC PRODUCTS, RELATED ARRANGEMENT AND PRODUCT 审中-公开
公开(公告)号：US20170371092A1
公开(公告)日：2017-12-28
申请号：US15672684
申请日：2017-08-09
申请人： TactoTek Oy
发明人： Antti KERANEN , Jarmo SAASKI , Tuomas HEIKKILA , Paavo NISKALA , Kari SEVERINKANGAS , Sami TORVINEN
IPC分类号： F21V8/00
CPC分类号： G02B6/0065 , G02B6/0036 , G02B6/0051 , G02B6/006 , G02B6/0091
摘要： A method for manufacturing an electronic product, including obtaining a flexible, optically substantially transparent or translucent, substrate sheet, printing, by an additive printed electronics process, a plurality of electrical conductors on the substrate sheet, printing or disposing, a plurality of electronic components including optoelectronic light emissive components on the substrate sheet, at least some of the printed conductors being configured to provide electrical current thereto, providing at least one graphic on the substrate sheet, the at least one graphic configured to enable outcoupling of light, and attaching a flexible, optically substantially transparent, lightguide sheet to the substrate sheet to establish a multi-layer structure, the light emitted by the light emissive components being received by the lightguide sheet, propagating therewithin, and then being at least partly emitted to the environment through the at least one graphic.

2. 发明申请

US20150308639A1 METHOD FOR MANUFACTURING ELECTRONIC PRODUCTS, RELATED ARRANGEMENT AND PRODUCT 有权
标题翻译：制造电子产品的方法，相关安排和产品
公开(公告)号：US20150308639A1
公开(公告)日：2015-10-29
申请号：US14264273
申请日：2014-04-29
申请人： Tactotek Oy
发明人： Antti KERANEN , Jarmo SAASKI , Tuomas HEIKKILA , Paavo NISKALA , Kari SEVERINKANGAS , Sami TORVINEN
IPC分类号： F21K99/00 , F21V8/00
CPC分类号： G02B6/0065 , G02B6/0036 , G02B6/0051 , G02B6/006 , G02B6/0091
摘要： A method for manufacturing an electronic product, includes: obtaining a flexible, optically substantially transparent or translucent, substrate sheet; printing a number of electrical conductors on the substrate sheet in accordance with a predefined schematic; printing or disposing a number of electronic components including optoelectronic light emissive, preferably LED (light-emitting diode), components on the substrate sheet in accordance with the schematic, wherein at least some of the printed conductors are configured to provide electrical current thereto; and attaching a flexible, optically substantially transparent, lightguide sheet to the substrate so as to establish a functional multi-layer structure, where the light emitted by the light emissive components is incoupled to the lightguide, propagates therewithin, and is at least partly outcoupled to the environment through the substrate sheet. Related arrangement and electronic device are presented.
摘要翻译：一种电子产品的制造方法，包括：获得柔性光学上基本上透明或半透明的基片; 根据预定示意图在基片上印刷多个电导体; 根据示意图，在基板上打印或布置包括光电发光，优选LED（发光二极管））的多个电子部件，其中至少一些印刷导体被配置为向其提供电流; 以及将柔性的光学上基本上透明的光导薄片附接到所述基底上，以便建立功能性多层结构，其中由所述光发射组件发射的光被耦合到所述光导，在其中传播，并且至少部分地耦合到通过基板的环境。介绍了相关的布置和电子设备。

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