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1. 发明申请

US20080175008A1 LIGHT-EMITTING DIODE ASSEMBLY AND METHOD OF FABRICATION 失效
标题翻译：发光二极管组件和制造方法
公开(公告)号：US20080175008A1
公开(公告)日：2008-07-24
申请号：US11626041
申请日：2007-01-23
申请人： TSENG-HSIANG HU , YEU-LIH LIN , LI-KUANG TAN
发明人： TSENG-HSIANG HU , YEU-LIH LIN , LI-KUANG TAN
IPC分类号： F21V29/00 , C23C14/34 , H01S4/00
CPC分类号： F21V29/80 , F21K9/00 , F21V29/51 , F21V29/59 , F21V29/763 , F21V29/89 , H01L33/64 , H01L33/648 , H05K1/0272 , H05K1/053 , Y10T29/49002
摘要： A light-emitting diode (LED) assembly includes a heat dissipation device (30) and at least one LED (10). The heat dissipation device has a connecting surface (33) with circuitry (20) being directly formed thereon. The at least one LED is electrically connected with the circuitry, and is maintained in thermal and mechanical contact with the connecting surface to dissipate heat generated thereby through the heat dissipation device. A method for making the LED assembly includes steps of: (A) providing a heat dissipation device having a surface for the LED to be mounted thereon; (B) insulating the surface; (C) forming circuitry on the insulated surface directly to obtain a connecting surface; (D) attaching the LED to the connecting surface of the heat dissipation device thermally and mechanically, and connecting the LED with the circuitry electrically to form the LED assembly.
摘要翻译：发光二极管（LED）组件包括散热装置（30）和至少一个LED（10）。散热装置具有连接表面（33），其上直接形成电路（20）。所述至少一个LED与所述电路电连接，并且与所述连接表面保持热和机械接触，从而散发通过所述散热装置产生的热量。一种用于制造LED组件的方法，包括以下步骤：（A）提供具有用于安装在其上的LED的表面的散热装置; （B）绝缘表面; （C）直接在绝缘表面上形成电路以获得连接表面; （D）热和机械地将LED连接到散热装置的连接表面，并且将LED与电路电连接以形成LED组件。

2. 发明申请

US20080157100A1 LIGHT-EMITTING DIODE ASSEMBLY 失效
标题翻译：发光二极管组件
公开(公告)号：US20080157100A1
公开(公告)日：2008-07-03
申请号：US11687132
申请日：2007-03-16
申请人： LI-KUANG TAN , YEU-LIH LIN , TSENG-HSIANG HU
发明人： LI-KUANG TAN , YEU-LIH LIN , TSENG-HSIANG HU
IPC分类号： H01L33/00
CPC分类号： F21V29/51 , F21V19/001 , F21V19/045 , F21V29/74 , F21V29/80 , F21Y2115/10 , H01L2924/0002 , H01L2924/00
摘要： A light emitting diode (LED) assembly includes at least an LED (102), a substrate (20), a heat dissipation apparatus (40) and at least one securing frame (30). The substrate forms a set of electrical circuitry (22) thereon. The at least one LED is arranged on a side of the substrate and electrically connected with the set of electrical circuitry of the substrate. The heat dissipation apparatus is arranged on an opposite side of the substrate. The securing frame includes a pressing portion (32) securing the substrate with the heat dissipation apparatus detachably.
摘要翻译：发光二极管（LED）组件至少包括LED（102），基板（20），散热装置（40）和至少一个固定框架（30）。衬底在其上形成一组电路（22）。所述至少一个LED布置在所述衬底的一侧并与所述衬底的所述电路组电连接。散热装置设置在基板的相对侧。固定框架包括可拆卸地固定基板与散热装置的按压部分（32）。

3. 发明申请

US20070132092A1 LIGHT-EMITTING DIODE ASSEMBLY AND METHOD OF FABRICATION 失效
标题翻译：发光二极管组件和制造方法
公开(公告)号：US20070132092A1
公开(公告)日：2007-06-14
申请号：US11309257
申请日：2006-07-20
申请人： TSENG-HSIANG HU , YEU-LIH LIN , LI-KUANG TAN
发明人： TSENG-HSIANG HU , YEU-LIH LIN , LI-KUANG TAN
IPC分类号： H01L23/34
CPC分类号： F21V29/80 , F21V15/01 , F21V23/00 , F21V29/004 , F21V29/74 , F21V29/763 , F21V29/773 , F21Y2115/10 , H01L2224/48091 , H01L2224/48247 , Y10S257/93 , H01L2924/00014
摘要： An LED assembly includes a packaged LED module (30) and a heat dissipation device (50). The LED module includes at least an LED die therein and a plurality of conductive pins (32, 34) extending downwardly from a bottom portion thereof. The heat dissipation device is thermally and electrically connected with the at least an LED die. The heat dissipation device defines at least a mounting hole (542) therein. At least one of the conductive pins is fittingly received in the at least a mounting hole and thermally and electrically connects with the heat dissipation device.
摘要翻译： LED组件包括封装的LED模块（30）和散热装置（50）。所述LED模块至少包括一个LED管芯，以及从其底部向下延伸的多个导电引脚（32,34）。所述散热装置与所述至少一个LED管芯热电连接。散热装置在其中至少限定一个安装孔（542）。至少一个导电销适配地容纳在至少一个安装孔中，并与散热装置进行热电连接。

4. 发明申请

US20080191948A1 ANTENNA FOR ELECTRONIC PRODUCT AND METHOD FOR FABRICATING THE SAME 失效
标题翻译：电子产品用天线及其制造方法
公开(公告)号：US20080191948A1
公开(公告)日：2008-08-14
申请号：US11690043
申请日：2007-03-22
申请人： TSENG-HSIANG HU , LI-KUANG TAN , YEU-LIH LIN
发明人： TSENG-HSIANG HU , LI-KUANG TAN , YEU-LIH LIN
IPC分类号： H01Q1/24
CPC分类号： H01Q1/38 , H01Q1/243
摘要： An antenna device (10) of a consumer electronic product is formed on an outer surface (302) of a shell (30) of the electronic product. The shell of the consumer electronic product is adapted for forming an enclosure of an electronic product. The antenna device extends on a planar plane and is integrally formed with and is coated on the outer surface of the shell. A method for making the antenna device includes: (A) providing a consumer electronic product having a shell for forming the antenna device on an outer surface thereof, the shell being adapted for enclosing components of the consumer electronic product therein; (B) coating a copper layer on the outer surface of the shell of the electronic product; (C) forming circuitry out of the copper layer to form the antenna device.
摘要翻译：消费电子产品的天线装置（10）形成在电子产品的外壳（30）的外表面（302）上。消费电子产品的外壳适于形成电子产品的外壳。天线装置在平面上延伸并且与外壳的外表面一体地形成并涂覆在壳体的外表面上。一种制造天线装置的方法包括：（A）提供具有用于在其外表面上形成天线装置的外壳的消费电子产品，所述外壳适于将消费电子产品的部件封闭在其中; （B）在电子产品外壳的外表面上涂布铜层; （C）从铜层形成电路以形成天线装置。

5. 发明申请

US20070121301A1 HEAT DISSIPATION ASSEMBLY 失效
标题翻译：散热装置
公开(公告)号：US20070121301A1
公开(公告)日：2007-05-31
申请号：US11309219
申请日：2006-07-13
申请人： LI-KUANG TAN , YEU-LIH LIN , TSENG-HSIANG HU
发明人： LI-KUANG TAN , YEU-LIH LIN , TSENG-HSIANG HU
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L23/4093 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation assembly used for dissipating heat from heat generating electronic components includes a mounting frame, a heat sink and a fan duct. The heat sink is positioned on the mounting frame; the fan duct is attached to the heat sink. The fan duct includes a plurality of first clamping portions, and the mounting frame includes a plurality of second clamping portions corresponding to the first clamping portions. The first clamping portions engage with the second clamping portions to fix the fan duct and the heat sink onto the mounting frame.
摘要翻译：用于从发热电子部件散热的散热组件包括安装框架，散热器和风扇导管。散热器位于安装框架上; 风扇导管连接到散热器。风扇管道包括多个第一夹持部分，并且安装框架包括对应于第一夹持部分的多个第二夹持部分。第一夹紧部分与第二夹持部分接合，以将风扇管道和散热器固定到安装框架上。

6. 发明申请

US20070090737A1 LIGHT-EMITTING DIODE ASSEMBLY AND METHOD OF FABRICATION 审中-公开
标题翻译：发光二极管组件和制造方法
公开(公告)号：US20070090737A1
公开(公告)日：2007-04-26
申请号：US11309256
申请日：2006-07-20
申请人： TSENG-HSIANG HU , YIH-JONG HSIEH , LI-KUANG TAN
发明人： TSENG-HSIANG HU , YIH-JONG HSIEH , LI-KUANG TAN
IPC分类号： H01J61/52 , H01J7/24 , H01J1/02
CPC分类号： F21V29/51 , F21K9/00 , F21V29/56 , F21V29/74 , F21V29/80 , F21V29/83 , F21Y2115/10 , H01L33/648 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： A light-emitting diode (LED) assembly and a method for fabrication thereof are disclosed. The LED assembly includes a heat-absorbing member in which a working fluid is provided, an LED die (60) directly attached to the heat-absorbing member, and a heat-dissipating member thermally attached to the heat-absorbing member. The heat-absorbing member absorbs heat via the working fluid from the LED die and transfers the heat to the heat-dissipating member for dissipation. The method involves directly attaching the LED die to the heat-absorbing member.
摘要翻译：公开了一种发光二极管（LED）组件及其制造方法。 LED组件包括其中设置有工作流体的吸热构件，直接附接到吸热构件的LED模具（60）和热吸附构件热附着的散热构件。吸热构件通过来自LED管芯的工作流体吸收热量，并将热量传递到散热构件以进行散热。该方法包括将LED管直接连接到吸热件。

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