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3. 发明专利

JPH0271584A FORMATION OF ELECTRONIC CIRCUIT 失效
公开(公告)号：JPH0271584A
公开(公告)日：1990-03-12
申请号：JP22292588
申请日：1988-09-06
申请人： TOYOTA MOTOR CORP
发明人： TAKAHASHI HIDEKI , FUKUMA NOBUO , SHIBATA TAKUO , MATSUDAIRA YASUTO
IPC分类号： H05K3/04 , H05K3/20
摘要： PURPOSE:To enable the formation of a thick film circuit pattern of high dimensional accuracy by a method wherein a paste sheet provided with a protective resin film formed on its surface is provided above a circuit board, and the paste sheet is punched into a shape of a circuit pattern, which is pressure-bonded to the circuit board and calcined to form an electronic circuit on the circuit board. CONSTITUTION:A paste sheet 16 is provided to a space between dies 11 and 12 of a circuit pattern forming device 10 putting a conductor paste 16a on an alumina substrate 15 side, the paste sheet 16 is punched into a shape of a circuit pattern and a punched paste sheet 16', is pressure-bonded onto the alumina substrate 15. In this process, the paste sheet 16, which is to be punched, has been formed into one piece with an elastic protective resin film 16b on its side. Next, the paste sheet 16', which is to be a circuit, is made to adhere strongly to the alumina substrate 15 making the substrate 15 provided with the paste sheet 16' pass through a pair of pressurizing rollers 21 and 22 of a pressurizing device 19, which is calcined for the formation of a circuit pattern.

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