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1. 发明申请

US20160265115A1 METHOD OF ELECTROLESS GOLD PLATING 审中-公开
标题翻译：电镀金镀层的方法
公开(公告)号：US20160265115A1
公开(公告)日：2016-09-15
申请号：US15163437
申请日：2016-05-24
申请人： TOYO KOHAN CO., LTD.
发明人： Nobuaki MUKAI
IPC分类号： C23C18/42 , C23C18/50 , C23C18/16
CPC分类号： C23C18/1831 , B32B15/01 , B32B15/017 , B32B15/018 , B32B15/043 , C22C5/02 , C22C19/00 , C22C21/06 , C23C18/16 , C23C18/1633 , C23C18/165 , C23C18/1651 , C23C18/1653 , C23C18/32 , C23C18/34 , C23C18/36 , C23C18/38 , C23C18/40 , C23C18/42 , C23C18/44 , C23C18/48 , C23C18/50 , C23C18/52 , C23C18/54 , C23C28/00 , C23C28/02 , C23C28/021 , C23C30/00 , C23C30/005 , H01M8/0228 , Y10T428/12708 , Y10T428/12715 , Y10T428/12722 , Y10T428/12861 , Y10T428/12868 , Y10T428/12875 , Y10T428/12882 , Y10T428/12889 , Y10T428/12896 , Y10T428/12903 , Y10T428/1291 , Y10T428/12917 , Y10T428/12924 , Y10T428/12931 , Y10T428/12937 , Y10T428/12944 , Y10T428/12972 , Y10T428/2495 , Y10T428/24967 , Y10T428/24975
摘要： A method of electroless gold plating includes a step of forming an underlying alloy layer on a base material and a step of forming a gold plate layer directly on the underlying alloy layer by electroless reduction plating using a cyanide-free gold plating bath. The underlying alloy layer is formed of an M1-M2-M3 alloy, where M1 is at least one element selected from Ni, Fe, Co, Cu, Zn, where Sn, M2 is at least one element selected from Pd, Re, Pt, Rh, Ag and where Ru, and M3 is at least one element selected from P and B.
摘要翻译：无电镀金的方法包括在基材上形成下面的合金层的步骤，以及通过使用无氰镀金浴的无电还原电镀在底层合金层上直接形成金板层的步骤。下面的合金层由M1-M2-M3合金形成，其中M1是选自Ni，Fe，Co，Cu，Zn中的至少一种元素，其中Sn，M2是选自Pd，Re，Pt中的至少一种元素，Rh，Ag，其中Ru和M3是选自P和B中的至少一种元素。

2. 发明申请

US20160145746A1 PALLADIUM PLATE COATED MATERIAL AND METHOD OF PRODUCING PALLADIUM PLATE COATED MATERIAL 审中-公开
标题翻译：聚氯乙烯涂层材料及其制备方法
公开(公告)号：US20160145746A1
公开(公告)日：2016-05-26
申请号：US14897118
申请日：2014-04-21
申请人： TOYO KOHAN CO., LTD.
发明人： Nobuaki MUKAI
IPC分类号： C23C18/50 , C23C18/48 , C23C18/16 , C22C5/04
CPC分类号： C23C18/50 , C22C5/04 , C23C18/1633 , C23C18/1651 , C23C18/44 , C23C18/48 , C23C28/021
摘要： There is provided a palladium plate coated material (100) comprising: a base material (10); an underlying alloy layer (20) formed on the base material (10); and a palladium plated layer (30) formed on the underlying alloy layer (20). The palladium plate coated material (100) is characterized in that the underlying alloy layer (20) is formed of an M1-M2-M3 alloy (where M1 is at least one element selected from Ni, Fe, Co, Cu, Zn and Sn, M2 is at least one element selected from Pd, Re, Pt, Rh, Ag and Ru, and M3 is at least one element selected from P and B).
摘要翻译：提供一种钯板涂覆材料（100），包括：基材（10）; 形成在基材（10）上的下层合金层（20）。和形成在下面的合金层（20）上的镀钯层（30）。钯板涂覆材料（100）的特征在于，下面的合金层（20）由M1-M2-M3合金（其中M1是选自Ni，Fe，Co，Cu，Zn和Sn中的至少一种元素） M2是选自Pd，Re，Pt，Rh，Ag和Ru中的至少一种元素，M3是选自P和B中的至少一种元素）。

3. 发明申请

US20150125777A1 SEPARATOR FOR FUEL CELLS, FUEL CELL, FUEL CELL STACK, AND METHOD OF MANUFACTURING SEPARATOR FOR FUEL CELLS 审中-公开
标题翻译：用于燃料电池的分离器，燃料电池，燃料电池堆和制造用于燃料电池的分离器的方法
公开(公告)号：US20150125777A1
公开(公告)日：2015-05-07
申请号：US14595680
申请日：2015-01-13
申请人： TOYO KOHAN CO., LTD.
发明人： Nobuaki MUKAI
IPC分类号： H01M8/02 , C23C18/50 , H01M2/14 , H01M8/24 , C23C18/16
CPC分类号： H01M8/021 , B32B15/018 , C22C19/03 , C22C19/07 , C23C18/165 , C23C18/1651 , C23C18/36 , C23C18/44 , C23C18/50 , C23C18/54 , H01M2/145 , H01M8/0206 , H01M8/0208 , H01M8/0228 , H01M8/0263 , H01M8/2483 , Y02P70/56
摘要： A separator for fuel cells is provided. The separator includes: a base material; an underlying alloy layer formed on the base material; and a gold plate layer formed on the underlying alloy layer. The separator is characterized in that the underlying alloy layer is formed of an M1-M2-M3 alloy (where M1 is at least one element selected from Ni, Fe, Co, Cu, Zn and Sn, M2 is at least one element selected from Pd, Re, Pt, Rh, Ag and Ru, and M3 is at least one element selected from P and B).
摘要翻译：提供燃料电池用隔板。分离器包括：基材; 形成在基材上的底层合金层; 以及形成在下面的合金层上的金板层。分离器的特征在于，下面的合金层由M1-M2-M3合金（其中M1是选自Ni，Fe，Co，Cu，Zn和Sn中的至少一种元素）形成，M2是至少一种选自 Pd，Re，Pt，Rh，Ag和Ru，M3是选自P和B中的至少一种元素）。

4. 发明申请

US20150340714A1 SEPARATOR FOR FUEL CELLS, FUEL CELL, FUEL CELL STACK, AND METHOD OF MANUFACTURING SEPARATOR FOR FUEL CELLS 审中-公开
标题翻译：用于燃料电池的分离器，燃料电池，燃料电池堆和制造用于燃料电池的分离器的方法
公开(公告)号：US20150340714A1
公开(公告)日：2015-11-26
申请号：US14650236
申请日：2013-11-26
申请人： TOYO KOHAN CO., LTD.
发明人： Nobuaki MUKAI
IPC分类号： H01M8/02 , C23C18/31 , C23C18/16
摘要： A separator for fuel cells is provided. The separator includes: a base material; an underlying plate layer formed on the base material; and a gold plate layer formed on the underlying plate layer by means of electroless plating. The separator is characterized in that a face of the underlying plate layer facing the gold plate layer has an arithmetic average roughness Ra of 80 nm or less. According to the present invention, there can be provided a separator for fuel cells in which the gold plate layer can be uniformly formed for irregular parts that constitute gas flow channels and the occurrence of unformed parts and pinholes in the gold plate layer is prevented without increasing the film thickness of the gold plate layer and which is excellent in the corrosion resistance and the conductivity.
摘要翻译：提供燃料电池用隔板。分离器包括：基材; 形成在基材上的下层板层; 以及通过无电镀形成在下面的板层上的金板层。隔板的特征在于，面向金板层的底板的面的算术平均粗糙度Ra为80nm以下。根据本发明，可以提供一种用于燃料电池的隔板，其中可以均匀地形成金板层，用于构成气体流动通道的不规则部分，并且在不增加的情况下防止在金板层中出现未成形部件和针孔金板层的膜厚，耐腐蚀性和导电性优异。

5. 发明公开

US20230269880A1 COPPER CLAD LAMINATE AND METHOD FOR PRODUCING THE SAME 审中-公开
公开(公告)号：US20230269880A1
公开(公告)日：2023-08-24
申请号：US18040214
申请日：2021-08-07
申请人： TOYO KOHAN CO., LTD.
发明人： Youhei YOSHIMATSU , Nobuaki MUKAI , Takahiro YOSHIDA
IPC分类号： H05K3/02 , H05K1/09 , H05K3/06 , H05K1/02
CPC分类号： H05K3/022 , H05K1/09 , H05K3/06 , H05K1/028 , H05K1/0296 , H05K1/0313
摘要： [Object]
To provide a copper clad laminate that is capable of achieving a good volume resistivity at an electroless copper plating layer of a low dielectric resin film while suppressing a transmission loss when being applied to a flexible circuit board, and a method for producing the copper clad laminate.
[Solving Means]
A copper clad laminate of the present invention includes a low dielectric resin film having a relative permittivity of 3.5 or lower and a dissipation factor of 0.008 or lower at a frequency of 10 GHz, and an electroless copper plating layer laminated on at least one surface of the low dielectric resin film. An Ni content in the electroless copper plating layer is 0.01 to 1.2 wt %, and the electroless copper plating layer has a volume resistivity of 6.0 μΩ·cm or lower.

6. 发明申请

US20180290434A1 ALLOY PLATE COATED MATERIAL AND METHOD OF PRODUCING ALLOY PLATE COATED MATERIAL 审中-公开
公开(公告)号：US20180290434A1
公开(公告)日：2018-10-11
申请号：US16000355
申请日：2018-06-05
申请人： TOYO KOHAN CO., LTD.
发明人： Nobuaki MUKAI , Tomoyuki TSURUDA , Takahiro YOSHIDA
IPC分类号： B32B15/01 , C23C22/83 , C23C22/50 , C23C28/00 , H01M8/0228 , H01M8/0208 , C23C18/50
摘要： An alloy plate coated material including a base material and an alloy plate layer which is formed on the base material to constitute an outermost layer and is formed from a M1-M2-M3 alloy. M1 is at least one element selected from Ni, Fe, Co, Cu, Zn and Sn. M2 is at least one element selected from Pd, Re, Pt, Rh, Ag and Ru. M3 is at least one element selected from P and B. The alloy plate layer has a molar ratio of M1 to M2 (M1/M2) of 0.005 to 0.5.

7. 发明公开

US20230284393A1 COPPER CLAD LAMINATE AND METHOD FOR PRODUCING THE SAME 审中-公开
公开(公告)号：US20230284393A1
公开(公告)日：2023-09-07
申请号：US18040236
申请日：2021-08-07
申请人： TOYO KOHAN CO., LTD.
发明人： Nobuaki MUKAI , Takahiro YOSHIDA , Youhei YOSHIMATSU
IPC分类号： H05K3/18 , H05K1/02 , H05K1/03
CPC分类号： H05K3/184 , H05K1/028 , H05K1/032 , H05K2203/1105
摘要： [Object]
To provide a copper clad laminate that is capable of achieving high adhesion between a low dielectric resin film and a copper plating layer and a good volume resistivity while suppressing a transmission loss when being applied to a flexible circuit board, and a method for producing the copper clad laminate.
[Solving Means]
A copper clad laminate of the present invention includes a low dielectric resin film having a relative permittivity of 3.5 or lower and a dissipation factor of 0.008 or lower at a frequency of 10 GHz, and an electroless copper plating layer laminated on at least one surface of the low dielectric resin film. A weighted average size of crystallites in the electroless copper plating layer is 25 to 300 nm, and an adhesion strength between the resin film and the electroless copper plating layer is 4.2 N/cm or more.

8. 发明申请

US20160265114A1 GOLD PLATE COATED MATERIAL 审中-公开
标题翻译：金板涂层材料
公开(公告)号：US20160265114A1
公开(公告)日：2016-09-15
申请号：US15163419
申请日：2016-05-24
申请人： TOYO KOHAN CO., LTD.
发明人： Nobuaki MUKAI
IPC分类号： C23C18/18 , B32B15/01 , H01M8/0228 , C23C18/44
CPC分类号： C23C18/1831 , B32B15/01 , B32B15/017 , B32B15/018 , B32B15/043 , C22C5/02 , C22C19/00 , C22C21/06 , C23C18/16 , C23C18/1633 , C23C18/165 , C23C18/1651 , C23C18/1653 , C23C18/32 , C23C18/34 , C23C18/36 , C23C18/38 , C23C18/40 , C23C18/42 , C23C18/44 , C23C18/48 , C23C18/50 , C23C18/52 , C23C18/54 , C23C28/00 , C23C28/02 , C23C28/021 , C23C30/00 , C23C30/005 , H01M8/0228 , Y10T428/12708 , Y10T428/12715 , Y10T428/12722 , Y10T428/12861 , Y10T428/12868 , Y10T428/12875 , Y10T428/12882 , Y10T428/12889 , Y10T428/12896 , Y10T428/12903 , Y10T428/1291 , Y10T428/12917 , Y10T428/12924 , Y10T428/12931 , Y10T428/12937 , Y10T428/12944 , Y10T428/12972 , Y10T428/2495 , Y10T428/24967 , Y10T428/24975
摘要： A method of electroless gold plating includes a step of forming an underlying alloy layer on a base material and a step of forming a gold plate layer directly on the underlying alloy layer by electroless reduction plating using a cyanide-free gold plating bath. The underlying alloy layer is formed of an M1-M2-M3 alloy, where M1 is at least one element selected from Ni, Fe, Co, Cu, Zn, where Sn, M2 is at least one element selected from Pd, Re, Pt, Rh, Ag and where Ru, and M3 is at least one element selected from P and B.
摘要翻译：无电镀金的方法包括在基材上形成下面的合金层的步骤，以及通过使用无氰镀金浴的无电还原电镀在底层合金层上直接形成金板层的步骤。下面的合金层由M1-M2-M3合金形成，其中M1是选自Ni，Fe，Co，Cu，Zn中的至少一种元素，其中Sn，M2是选自Pd，Re，Pt中的至少一种元素，Rh，Ag，其中Ru和M3是选自P和B中的至少一种元素。

9. 发明申请

US20160263862A1 ALLOY PLATE COATED MATERIAL AND METHOD OF PRODUCING ALLOY PLATE COATED MATERIAL 有权
标题翻译：合金板涂层材料及其制造方法
公开(公告)号：US20160263862A1
公开(公告)日：2016-09-15
申请号：US15032109
申请日：2014-10-27
申请人： TOYO KOHAN CO., LTD.
发明人： Nobuaki MUKAI , Tomoyuki TSURUDA , Takahiro YOSHIDA
IPC分类号： B32B15/01 , C23C18/50
CPC分类号： B32B15/015 , C23C18/50 , C23C22/50 , C23C22/83 , C23C28/34 , H01M8/0208 , H01M8/0228 , H01M2008/1095 , Y10T428/12861
摘要： Provided is an alloy plate coated material including a base material, and an alloy plate layer which is formed on the base material to constitute an outermost layer and is formed from a M1-M2-M3 alloy (provided that M1 is at least one element selected from Ni, Fe, Co, Cu, Zn and Sn; M2 is at least one element selected from Pd, Re, Pt, Rh, Ag and Ru; and M3 is at least one element selected from P and B), in which the alloy plate layer has a molar ratio of M1 to M2 (M1/M2) of 0.005 to 0.5.
摘要翻译：提供一种合金板涂覆材料，其包括基材和合金板层，其形成在基体材料上以构成最外层，并由M1-M2-M3合金形成（条件是M1选自至少一种元素来自Ni，Fe，Co，Cu，Zn和Sn; M2是选自Pd，Re，Pt，Rh，Ag和Ru中的至少一种元素;以及M3是选自P和B）中的至少一种元素，其中合金板层的摩尔比为M1〜M2（M1 / M2）为0.005〜0.5。

10. 发明申请

US20160130701A1 GOLD PLATE COATED STAINLESS MATERIAL AND METHOD OF PRODUCING GOLD PLATE COATED STAINLESS MATERIAL 审中-公开
标题翻译：金板涂层不锈钢材料及其制造方法
公开(公告)号：US20160130701A1
公开(公告)日：2016-05-12
申请号：US14897093
申请日：2013-09-20
申请人： TOYO KOHAN CO., LTD.
发明人： Nobuaki MUKAI , Takahiro YOSHIDA
IPC分类号： C23C18/31 , C23C22/50
CPC分类号： C23C18/31 , C23C18/1834 , C23C18/44 , C23C18/54 , C23C22/50 , C23C28/322 , C23C28/3455 , C23G1/081
摘要： There is provided a gold plate coated stainless material characterized by comprising: a stainless steel sheet formed with a passivation film having a surface of which a Cr/O value is within a range of 0.05 to 0.2 and a Cr/Fe value is within a range of 0.5 to 0.8 when measured by Auger electron spectroscopy analysis; and a gold plated layer formed on the passivation film of the stainless steel sheet. According to the present invention, there can be provided a gold plate coated stainless material which can be improved in the coverage and interfacial adhesion property of the gold plated layer formed on the stainless steel sheet even when reducing the thickness of the gold plated layer, thereby to be excellent in corrosion resistance and conductivity and advantageous in cost.
摘要翻译：提供了镀金不锈钢材料，其特征在于包括：形成有钝化膜的不锈钢板，其表面的Cr / O值在0.05至0.2的范围内，Cr / Fe值在一定范围内通过俄歇电子能谱分析测量为0.5〜0.8; 以及形成在不锈钢板的钝化膜上的镀金层。根据本发明，可以提供一种金板涂布的不锈钢材料，即使减少镀金层的厚度，也可以提高形成在不锈钢板上的镀金层的覆盖率和界面粘附性，从而具有优异的耐腐蚀性和导电性，成本优越。

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