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    • 9. 发明专利
    • CLAD MATERIAL
    • MY118038A
    • 2004-08-30
    • MYPI9700534
    • 1997-02-14
    • TOYO KOHAN CO LTD
    • SAIJO KINJIYOSHIDA KAZUOYOSHIMOTO NOBUYUKIISOBE TAKEHIKO
    • H01M2/12B23K20/00B23K20/04
    • CLAD MATERIAL (19) COMPRISES A METAL SUBSTRATE (A) WHICH IS PROVIDED WITH A MULTIPLICITY OF PERFORATED OPENINGS (C) THEREIN AND A METAL FOIL (8) WHICH IS LAMINATED ON THE METAL SUBSTRATE TO CLOSE THE PERFORATED OPENINGS (C). TO PRODUCE SUCH A CLAD MATERIAL, AT LEAST ONE SURFACE OF THE METAL SUBSTRATE (A) AND CORRESPONDING ONE SURFACE OF THE METAL FOIL (8) ARE RESPECTIVELY SUBJECTED TO A DRY ETCHING AND THE METAL SUBSTRATE AND THE METAL FOIL ARE LAMINATED IN SUCH A MANNER THAT THE ETCHED SURFACES FACE EACH OTHER. ALTERNATELY, ONLY ONE SURFACE OF THE METAL SUBSTRATE (A) IS SUBJECTED TO A DRY ETCHING AND THE METAL SUBSTRATE (A) AND THE METAL FOIL (8) ARE LAMINATED IN SUCH A MANNER THAT THE ETCHED SURFACE OF THE METAL SUBSTRATE DEFINES A LAMINATING SURFACE. IT MAY BE POSSIBLE TO PROVIDE A NICKEL PLATING ON THE METAL SUBSTRATE (A) OR THE METAL FOIL (8). THE CLAD MATERIAL CAN BE EFFECTIVELY USED FOR PRODUCING SAFETY VALVE CHIPS WHICH RUPTURE ACCURATELY AT LOW PRESSURES WHICH FALL IN A STABLE PRESSURE RANGE ON A MASS PRODUCTION BASIS. (FIGURE 1 & 4)