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    • 10. 发明公开
    • CURABLE COMPOSITION
    • HÄRTBAREZUSAMMENSETZUNG
    • EP1700874A4
    • 2007-10-24
    • EP04807332
    • 2004-12-14
    • TOYO BOSEKI
    • YOSHIDA TAKEFUMITSUTSUMI MASAYUKIMAEDA SATOSHIKAWAHARA KEIZO
    • C08G59/50C08G59/18
    • C08G59/50C08G59/18
    • A curable resin composition which forms a continuous phase and a dispersoid at ordinary temperature, characterized in that the continuous phase is liquid at ordinary temperature and comprises (a) an epoxy compound having two or more epoxy groups per molecule and that the dispersoid comprises (b) a compound which is present as solid particles in the continuous phase at ordinary temperature and has two or more amino groups per molecule (preferably an aromatic amine compound having a benzoxazole structure). The composition is a curable epoxy composition of the one-pack type having excellent storage stability and giving a cured article with satisfactory material properties.
    • 1.一种在常温下形成连续相和分散质的固化性树脂组合物,其特征在于,连续相在常温下为液体,且包含(a)每分子具有两个或更多个环氧基的环氧化合物,并且该分散质包含(b )在常温下在连续相中作为固体颗粒存在并且每个分子具有两个或更多个氨基的化合物(优选具有苯并恶唑结构的芳族胺化合物)。 该组合物是单组分型可固化环氧组合物,其具有优异的储存稳定性并赋予固化物品令人满意的材料性能。