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    • 7. 发明申请
    • TRI-LAYER SEMICONDUCTOR STACKS FOR PATTERNING FEATURES ON SOLAR CELLS
    • 三层半导体堆栈用于图案化太阳能电池的特性
    • WO2017173383A1
    • 2017-10-05
    • PCT/US2017/025571
    • 2017-03-31
    • SUNPOWER CORPORATION
    • TRACY, Kieran MarkSMITH, David D.BALU, VenkatasubramaniMASAD, AsnatWALDHAUER, Ann
    • H01L31/0392H01L31/06H01L31/042H01L31/18
    • Tri-layer semiconductor stacks for patterning features on solar cells, and the resulting solar cells, are described herein. In an example, a solar cell includes a substrate. A semiconductor structure is disposed above the substrate. The semiconductor structure includes a P-type semiconductor layer disposed directly on a first semiconductor layer. A third semiconductor layer is disposed directly on the P-type semiconductor layer. An outermost edge of the third semiconductor layer is laterally recessed from an outermost edge of the first semiconductor layer by a width. An outermost edge of the P-type semiconductor layer is sloped from the outermost edge of the third semiconductor layer to the outermost edge of the third semiconductor layer. A conductive contact structure is electrically connected to the semiconductor structure.
    • 本文描述了用于图案化太阳能电池上的特征的三层半导体堆叠以及所得到的太阳能电池。 在一个示例中,太阳能电池包括衬底。 半导体结构设置在衬底上方。 该半导体结构包括直接设置在第一半导体层上的P型半导体层。 第三半导体层直接设置在P型半导体层上。 第三半导体层的最外边缘从第一半导体层的最外边缘横向凹入一个宽度。 P型半导体层的最外边缘从第三半导体层的最外边缘向第三半导体层的最外边缘倾斜。 导电接触结构电连接到半导体结构。
    • 8. 发明申请
    • SPUTTER TOOL
    • 飞溅工具
    • WO2016100744A1
    • 2016-06-23
    • PCT/US2015/066514
    • 2015-12-17
    • SUNPOWER CORPORATION
    • SHEN, Yu-ChenQIU, TaiqingWOEHL, RobertTRACY, Kieran MarkAGRAWAL, Mukul
    • H01L31/18H01L31/0236H01L31/0248H01L21/203
    • C23C14/50C23C14/165C23C14/34C23C14/3464H01J37/32715
    • Sputter tools are described. In one embodiment, an apparatus to support a wafer includes a pallet having a depression to receive the wafer. The pallet includes an opening below the depression, and an edge in the depression is to support the wafer over the opening. A cover at least partially covers the opening. In one example, the cover may be a plate with one or more holes, and a pipe may be located below each of the holes in the cover. In one embodiment, a wafer-processing system includes a processing chamber and a pallet with a depression to receive a wafer. The pallet has an opening below the depression, and an edge in the depression supports the wafer over the opening. In one such embodiment, a cover at least partially covers the opening. According to one embodiment, an energy-absorbing material is disposed below the opening in the pallet.
    • 描述了溅射工具。 在一个实施例中,用于支撑晶片的装置包括具有接收晶片的凹陷的托盘。 托盘包括在凹陷下方的开口,并且凹陷中的边缘将晶片支撑在开口上。 盖子至少部分地覆盖开口。 在一个示例中,盖可以是具有一个或多个孔的板,并且管可以位于盖中的每个孔下方。 在一个实施例中,晶片处理系统包括处理室和具有凹陷的托盘以接收晶片。 托盘在凹陷下方具有开口,并且凹陷中的边缘将晶片支撑在开口上方。 在一个这样的实施例中,盖至少部分地覆盖开口。 根据一个实施例,能量吸收材料设置在托盘中的开口下方。