专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JPH06108285A SEMICONDUCTOR WAFER PLATING JIG 失效
公开(公告)号：JPH06108285A
公开(公告)日：1994-04-19
申请号：JP11659091
申请日：1991-04-22
申请人： TOSHIBA CORP , EBARA CORP
发明人： EZAWA HIROKAZU , YODA TAKASHI , TSUJIMURA MANABU , KANAYAMA TAKUYA
IPC分类号： C25D5/02 , C25D7/12 , C25D17/08 , H01L21/288 , H01L21/68 , H01L21/683
摘要： PURPOSE:To stably plate semiconductor wafers for a long time by providing a cathode contact on the surface of the semiconductor wafer, which is sealed with a seal member and is not brought into contact with plating liquid, to prevent the plating liquid from being deposited in the front end part of the cathode contact. CONSTITUTION:A semiconductor wafer 1 is held by holding members 3 and 4 and is immersed in the plating liquid and is plated. A seal member 5 is arranged on these holding members 3 and 4 so that the plating liquid does not flow to parts other than the face to be plated of the semiconductor wafer 1. A cathode contact 7 connected to a cathode wiring 11 is provided in a resist peeled part 6 in the end face part, of the sealed semiconductor wafer 1. Thus, the cathode contact 7 is not brought into contact with the plating liquid, and semiconductor wafers are stably plated without deterioration for a long time.

2. 发明专利

JPH08311699A METHOD FOR AGITATING IN ELECTROPLATING DEVICE 失效
公开(公告)号：JPH08311699A
公开(公告)日：1996-11-26
申请号：JP11954195
申请日：1995-05-18
申请人： EBARA CORP
发明人： KANAYAMA TAKUYA , SAITO NOBUTOSHI
IPC分类号： B01F11/00 , C25D5/08 , C25D7/12 , C25D21/10
摘要： PURPOSE: To control the flow of a plating soln. and to obtain a uniform plating film thickness at the time of electroplating a semiconductor wafer in the plating soln. by agitating the soln. in the vicinity of the wafer with an agitating member provided with many elastic wires. CONSTITUTION: A semiconductor wafer 1 is pressed and fixed on the peripheral part of a plating jig 2 to be placed in a plating tank through a packing 3 and a packing presser 4. The wafer 1 is placed in a plating soln., an agitating member 10 is confronted with the wafer 1 and vertically set, and the agitating member 10 is horizontally reciprocated in parallel with the wafer 1 to agitate the plating soln. The agitating member 10 is flocked with many elastic brush bristles 12, and the bristle density is decreased at the upper part and increased at the lower part. As a result, the plating soln. is uniformly agitated in the depth direction, and a uniform plating thickness is obtained.

3. 发明专利

JPH05247692A 失效
公开(公告)号：JPH05247692A
公开(公告)日：1993-09-24
申请号：JP6377391
申请日：1991-03-06
申请人： EBARA CORP
发明人： TSUJIMURA MANABU , KANAYAMA TAKUYA , OHIRA TAKEMASA
IPC分类号： C25D17/06 , C25D17/08 , H01L21/288
摘要： PURPOSE:To provide the jig for plating which prevents the dissolution of a plating liquid on the end faces and rear surface of a semiconductor wafer. CONSTITUTION:The jig for plating to be used for electroplating of the semiconductor wafer 1 in a plating liquid consists of two holding members 3, 4 for holding the semiconductor wafer 1 in the plating liquid and sealing members 2c. This sealing member 2c has internally a space, is provided across the wafer and the two holding members 3, 4 and is so constituted as to be held by the two holding members. More specifically, a material which has a U- or C-shape in sectional shape and consists of soft rubber is used as the sealing member 2c.

4. 发明专利

JPH05218048A SEALING JIG OF SEMICONDUCTOR WAFER 失效
公开(公告)号：JPH05218048A
公开(公告)日：1993-08-27
申请号：JP5682492
申请日：1992-02-07
申请人： EBARA CORP
发明人： TSUJIMURA MANABU , KANAYAMA TAKUYA
IPC分类号： C23C18/31 , C25D5/02 , H01L21/288 , H01L21/321 , H01L21/60 , H01L21/68 , H01L21/683
摘要： PURPOSE:To provide a sealing jig for a semiconductor wafer which facilitates the reduction of the size of a treatment chamber by reducing the thickness of a jig. CONSTITUTION:An intermediate holding member 5 whose plate-shaped upper and lower surfaces have recesses 5a and 5b in which semiconductor wafers 1 and 2 are housed respectively and upper and lower holding members 3 and 4 which have holes 3a and 4a whose diameters are a little smaller than the diameters of the upper and lower recesses 5a and 5b of the intermediate holding member 5 at positions corresponding to the upper and lower recesses 5a and 5b are provided. Sealing members 6 and 7 which cover the edge portions of the upper and lower recesses 5a and 5b of the intermediate holding member 5 and the surface edge portions of the semiconductor wafers 1 and 2 are provided on the surfaces of the upper and lower holding members 3 and 4 and the semiconductor wafers 1 and 2 are housed in the upper and lower recesses 5a and 5b of the intermediate holding member 5 and the semiconductor wafers 1 and 2 are held between the intermediate holding member 5 and the upper and lower holding members 3 and 4.

5. 发明专利

JPH05222590A PLATING JIG FOR SEMICONDUCTOR WAFER 失效
公开(公告)号：JPH05222590A
公开(公告)日：1993-08-31
申请号：JP5682392
申请日：1992-02-07
申请人： EBARA CORP
发明人： TSUJIMURA MANABU , KANAYAMA TAKUYA
IPC分类号： C25D17/06 , C25D7/12 , C25D17/08 , H01L21/321 , H01L21/60
摘要： PURPOSE:To provide the plating jig for a semiconductor wafer having a sealing member which does not impair sealability regardless of whether the member is cut by the wedge of a resist or not and an independent electrode. CONSTITUTION:This plating jig is so constituted as to house the semiconductor wafer 4 into the recessed part 1a of a 1st holding member 1 and to clamp the semiconductor wafer 4 by means of the 1st holding member 1 and a 2nd holding member 2. The electrode piece 6 pressed to the conductive part of the semiconductor wafer 4 is disposed into the spacing formed of the inner peripheral part of the recessed part 1a of the 1st holding member 1 and the outer peripheral part of the semiconductor wafer 4. The electrode piece 6 and an external electrode are conducted by a conductor 7 penetrating the 1st holding member 1 and further, the electrode piece 6 is brought into pressurized contact with the outer peripheral part of the semiconductor wafer 4 by the elastic force of a spring member 8.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式