专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JPH0458548A HYBRID IC MODULE 失效
公开(公告)号：JPH0458548A
公开(公告)日：1992-02-25
申请号：JP17202790
申请日：1990-06-27
申请人： TOSHIBA CORP
发明人： TAKEDA KAZUYOSHI , YAMADA TATSUYA , MURASE NAOAKI
IPC分类号： H01L23/02
摘要： PURPOSE:To make an adhesive creep into a U-shaped groove and to collectively bond the groove to a heat-dissipating metal base plate by a method wherein the U-shaped groove is formed at the circumference in the inner wall surface near the lower end face of a cylindrical insulating frame. CONSTITUTION:A U-shaped groove 4a is formed at the circumference in the inner wall surface near the lower end of a cylindrical resin frame 4. Then, one turn of a groove 2b having a proper depth is formed at the outside of a protruding stripe 2a which has been formed in a prescribed position on a heat-dissipating base plate 2. The lower end face of the resin frame 4 is fitted into the groove 2b and is bonded by using an adhesive 3. Since the U-shaped groove 4a has been formed at the circumference of the cylindrical resin frame at this time, the adhesive creeps into the U-shaped groove and this bonding operation is executed completely. Thereby, an insulating resin 5 which is filled into the resin frame 4 and with which a hybrid IC main body 1 is covered is not leaked out or does not flow out.

2. 发明专利

JPH03280486A HYBRID INTEGRATED CIRCUIT ELEMENT 失效
公开(公告)号：JPH03280486A
公开(公告)日：1991-12-11
申请号：JP8029290
申请日：1990-03-28
申请人： TOSHIBA CORP
发明人： TAGUCHI YASUO , TAKEDA KAZUYOSHI , MOCHIDA HISASHI
IPC分类号： H05K1/05 , H05K1/02 , H05K1/03 , H05K7/20
摘要： PURPOSE:To improve a hybrid integrated circuit element in heat dissipating efficiency by a method wherein a heat conductive insulating board is interposed between a heat dissipating metal plate and a thick film board in one piece, and a metal case bonded to the heat dissipating metal plate is provided covering these boards. CONSTITUTION:A resistor 12 which releases heat in operation is provided on the backside of a thick film board 10 where components such as semiconductor elements are not installed as connected to a wiring layer. In succession, an aluminum nitride board is fixed to the thick film board 10 taking advantage of an adhesive agent layer. A heat conductive insulating board such as a ceramic board 13 and a heat dissipating metal plate 14 of copper or copper alloy are fixed to the thick film board 10 mounted with circuit components in one piece by the use of conductive adhesive agent layers 15 to form most of a hybrid integrated circuit element. A metal case 16 is fixed to the ends of the thick film board 10 which constitutes the surface part of the laminated body composed of three layers in a hermetically sealing manner, and thus a hybrid integrated circuit element used in a vehicle can be formed.

3. 发明专利

JP2002016215A SEMICONDUCTOR DEVICE MODULE 失效
公开(公告)号：JP2002016215A
公开(公告)日：2002-01-18
申请号：JP2000198473
申请日：2000-06-30
申请人： TOSHIBA CORP
发明人： TAKEDA KAZUYOSHI
IPC分类号： H01L25/07 , H01L21/60 , H01L23/52 , H01L25/065 , H01L25/18
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device module, having a structure which can accelerate both the size reduction and thickness reduction of a device. SOLUTION: This module has a 1st lead frame 1-1, having a mount part 1a where a control semiconductor element 3 is mounted and a connection part 1c, which is connected to a protection electrode 8 of a power semiconductor element 2 and a 2nd lead frame 1-2, having a mount part lb where the power semiconductor 2 is mounted and a connection part 1d, which is connected to a projection electrode 8 of the control semiconductor element 3. Then the projection electrode 8 of the power semiconductor element 2 and the projection electrode 8 of the control semiconductor element 3 are electrically connected to each other, while overlapping with each other and in this state, and they are sealed with a sealing member 6.

4. 发明专利

JPH03218088A THERMAL-STRESS RELIEVING TYPE HYBRID INTEGRATED CIRCUIT 失效
公开(公告)号：JPH03218088A
公开(公告)日：1991-09-25
申请号：JP1331190
申请日：1990-01-23
申请人： TOSHIBA CORP
发明人： TAKEDA KAZUYOSHI , YAMADA TATSUYA , MURASE NAOAKI
IPC分类号： H05K7/20 , H05K1/00 , H05K1/14 , H05K3/34 , H05K5/00
摘要： PURPOSE:To relieve the stress produced in a lead pin section by providing a through hole having a diameter which is 5 times as large as that of lead pins or larger through an insulating plate on which the circuit parts for controlling circuits are mounted and a piercing hole through a circuit parts connecting member and soldering the lead pins inserted into both holes. CONSTITUTION:Leads 11 and 11 for connecting with an outside circuit are installed to the bottom end section of a metallic stem 10 by a hermetic sealing method. An insulating plate 12 is firmly attached to the bottom section of the stem 10 by soldering. A metallized layer which is made to function as a wiring layer is formed on the plate 12 and semiconductor elements 14 are fixed to the plate 12 by soldering. After the leads 11 and 11 are inserted into hole sections formed through another insulating plate 15, the leads are soldered 16. A connecting member 18 is arranged on the surface of another insulating plate on which circuit parts 17 for hybrid integrated circuit controlling stages are mounted and inner surface of a cap 13. On the other hand, a piercing hole 20 is formed through the member which covers the opening of a through hole 19 formed through the plate 15 and lead pins 21 and 21 are passed through and soldered 22 to both holes 19 and 20. It is desirable to make the diameter of the hole 19 5 times or more as large as that of the pins 21.

5. 发明专利

JPH02148759A HERMETICALLY SEALING TYPE HYBRID INTEGRATED CIRCUIT DEVICE 失效
公开(公告)号：JPH02148759A
公开(公告)日：1990-06-07
申请号：JP30202288
申请日：1988-11-29
申请人： TOSHIBA CORP
发明人： MURASE NAOAKI , TAKEDA KAZUYOSHI
IPC分类号： H01L25/00 , H05K1/14
摘要： PURPOSE:To rapidly radiate the heat of a control circuit by solid heat transfer and to eliminate an operating malfunction by integrally mounting the circuit on the inner wall face of a cap for sealing the circuit when a driver circuit and the control circuit are sealed to form a hybrid IC device. CONSTITUTION:A driver circuit 3 having a power transistor is mounted on a metal stem 1 through an insulating board 4, input/output terminals 2 at both ends of leads 7 for forming it are electrically insulated, and hermetically externally extended via a through hole formed at the stem 1. When a control circuit 6 composed of a thick film board 6a for controlling the circuit 3 and circuit elements 6b for controlling to drive is formed to be opposed to the circuit 3, the circuit 6 is mounted on the inner wall face of a metal cap 5 for hermetically sealing the whole, and connected to the circuit 3 by a flexible printed circuit board 8. Thus, generated heat is effectively radiated from the stem 1 and the cap 5, and its reliability is improved.

6. 发明专利

JPH10261744A SEMICONDUCTOR DEVICE AND ITS MANUFACTURE 失效
公开(公告)号：JPH10261744A
公开(公告)日：1998-09-29
申请号：JP21529397
申请日：1997-08-08
申请人： TOSHIBA CORP
发明人： SEKINE TOSHITAKA , TAKEDA KAZUYOSHI , HIYAMA YUJI
IPC分类号： H01L23/28 , H01L21/56 , H01L23/36
摘要： PROBLEM TO BE SOLVED: To realize reduction of cost without damaging insulating and heat dissipating properties, in a semiconductor device wherein a plurality of power elements are arranged and the whole device is built in an unified body with mold resin. SOLUTION: An insulating layer 16 having thermal conductivity is arranged on the surface of the side facing a metal frame 12 of a heat dissipating plate 14. An insulating layer 16 is previously formed on the heat dissipating plate 14. Molding is performed by using mold resin, in the state that the heat dissipating plate 14 is fixed on the metal frame 12 on which a power element 11 is mounted, so that a semiconductor device can be completed by one time molding.

7. 发明专利

JPH03283650A AIRTIGHTLY SEALED MODULE 失效
公开(公告)号：JPH03283650A
公开(公告)日：1991-12-13
申请号：JP8464990
申请日：1990-03-30
申请人： TOSHIBA CORP
发明人： MOCHIDA HISASHI , TAKEDA KAZUYOSHI
IPC分类号： H01L25/18 , H01L21/52 , H01L23/04 , H01L25/04 , H01L25/16
摘要： PURPOSE:To simplify manufacture of the title module and thereby to improve economics by a method wherein transistor(TR) blocks having semiconductor pelletes mounted thereon respectively are shaped in required pentagons, disposed in a prescribed manner and sealed airtightly. CONSTITUTION:TR blocks 106A to 106F having semiconductor pellets 108A to 108F mounted thereon are shaped in pentagons each having three right angles and are disposed inside a round cap 100 so that the side of each of them positioned between two angles not being right is opposite to the inner wall of the cap 100, and they are sealed airtightly. thus constitution enables employment of the TR blocks in the same shape and thus an airtightly sealed module being easy to prepare and having hight economics is obtained.

8. 发明专利

JPH03154367A SEALED HYBRID INTEGRATED CIRCUIT DEVICE 失效
公开(公告)号：JPH03154367A
公开(公告)日：1991-07-02
申请号：JP29437289
申请日：1989-11-13
申请人： TOSHIBA CORP
发明人： YAMADA TATSUYA , IMAJI YOSHIAKI , TAKEDA KAZUYOSHI , MURASE NAOAKI , TAGUCHI YASUO
IPC分类号： H01L23/28
摘要： PURPOSE:To exhibit favorable appearance such as that the blur of a filler, or the like is not recognized and also to preserve function high in reliability such as that a metallic case body and an insulating frame are also mechanically united firmly by providing a step between the heights of both sidewalls, concerning the groove structure or shape of an insulating frame face with which a heat radiating metallic case body engages. CONSTITUTION:For the junction unification part between a heat radiating metallic case body 2 and an insulating frame 4, in short, the groove part 4' at the end face on the insulating frame 4 with which the part to be junctioned of the metallic case body 2 engages, the height of an inwall 4a is made lower than that of an outwall 4b or an angle of, at least, 5 deg. is given to the perpendicular in the depth direction. For this reason, the filling operation of an adhesive with the junction area preserved, and others become easy, and the connection by engagement is bonded and united minutely. Hereby, the problem such as that the appearance is marred by the ooze (outflow) of a filler disappears completely, and it can always function as the one high in reliability.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式